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    • 6. 发明授权
    • Method and apparatus for studying vibrational modes of an electro-acoustic device
    • 用于研究电声装置的振动模式的方法和装置
    • US06587212B1
    • 2003-07-01
    • US09702713
    • 2000-10-31
    • Bradley Paul BarberPeter Ledel GammelJohn Edwin Graebner
    • Bradley Paul BarberPeter Ledel GammelJohn Edwin Graebner
    • G01B902
    • G01B11/00
    • A method for studying vibrational modes of an electro-acoustic device includes driving the electro-acoustic device to produce at least one vibrational mode therein, collecting phase and amplitude data from the electro-acoustic device using optical interferometry, and mapping the at least one vibrational mode based upon the collected phase and amplitude data. The phase and amplitude data may be processed to provide an instantaneous three-dimensional view of the at least one vibrational mode. Furthermore, a sequence of instantaneous three-dimensional views may be constructed to form a motion picture of the at least one vibrational mode. Additionally, collecting may include raster scanning to provide phase and amplitude data across a surface of the electro-acoustic device.
    • 一种用于研究电声装置的振动模式的方法包括驱动电声装置以在其中产生至少一个振动模式,使用光学干涉测量从电声装置收集相位和振幅数据,并将至少一个振动 模式基于收集的相位和振幅数据。 可以处理相位和振幅数据以提供至少一个振动模式的瞬时三维视图。 此外,可以构造一系列瞬时三维视图以形成至少一个振动模式的运动图像。 另外,收集可以包括光栅扫描以提供横跨电声装置的表面的相位和幅度数据。
    • 8. 发明授权
    • Process for making an on-chip vacuum tube device
    • 制造片上真空管装置的方法
    • US07670203B2
    • 2010-03-02
    • US11649197
    • 2007-01-03
    • Peter Ledel GammelRichard Edwin HowardOmar Daniel LopezWei Zhu
    • Peter Ledel GammelRichard Edwin HowardOmar Daniel LopezWei Zhu
    • H01J9/02H01J9/18H01J1/02
    • H01J23/165H01J9/02H01J9/022H01J21/105H01J25/00H01J2209/18
    • A method of making a microelectromechanical microwave vacuum tube device is disclosed. The device is formed by defining structural regions and sacrificial regions in a substrate. The structural regions have flexural members. The substrate is treated to remove the sacrificial regions and release the structural regions such that the structural regions are moveable by the flexural members. The structural regions include a device cathode, a device grid or both a device cathode and a device grid. The cathode comprises electron emitters. The device further includes an output structure where amplified microwave power is removed from the device. In the method, the cathode surface and the grid surface are moved to a position where they are substantially parallel to each other and substantially perpendicular to the substrate. The device further comprises an anode that is substantially parallel to the cathode surface and the grid surface.
    • 公开了一种制造微机电微波真空管装置的方法。 该器件通过在衬底中限定结构区域和牺牲区域而形成。 结构区域具有弯曲构件。 处理衬底以去除牺牲区域并释放结构区域,使得结构区域可被弯曲构件移动。 结构区域包括器件阴极,器件栅格或器件阴极和器件栅格。 阴极包括电子发射体。 该装置还包括其中放大的微波功率从该装置移除的输出结构。 在该方法中,阴极表面和栅格表面移动到它们基本上彼此平行并且基本上垂直于衬底的位置。 该装置还包括基本上平行于阴极表面和栅格表面的阳极。
    • 10. 发明授权
    • Micromachined variable capacitor
    • 微机电可变电容器
    • US06212056B1
    • 2001-04-03
    • US09280804
    • 1999-03-26
    • Peter Ledel GammelJames Albert Walker
    • Peter Ledel GammelJames Albert Walker
    • H01G500
    • H01G5/18H01G5/014
    • First and second wafers are micromachined by standard integrated-circuit fabrication techniques to respectively make first and second component parts of a variable capacitor. A thin flexible membrane in the first wafer is integral with and mechanically supported by the first wafer. A metal pattern on the first wafer includes a first capacitor plate on the membrane. In the second wafer, a well is formed. A metal pattern on the second wafer includes a second capacitor plate in the well. By bonding the two parts together face-to-face, the capacitor plates are positioned in spaced-apart alignment with each other. External electrical connections to the plates are made via bonding-pad portions of the metal patterns on the wafers. In response to electrical control signals, the metal plate on the membrane can be moved toward the other plate, thereby selectively changing the capacitance of the assembly.
    • 第一和第二晶片通过标准集成电路制造技术进行微加工,以分别制造可变电容器的第一和第二组成部分。 第一晶片中的薄柔性膜与第一晶片成一体并由其机械支撑。 第一晶片上的金属图案包括膜上的第一电容器板。 在第二晶片中形成一个阱。 第二晶片上的金属图案包括井中的第二电容器板。 通过将两个部件面对面地结合在一起,电容器板彼此间隔开对准地定位。 通过晶片上的金属图案的焊盘部分进行到板的外部电连接。 响应于电气控制信号,膜上的金属板可以朝向另一个板移动,从而选择性地改变组件的电容。