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1. 发明申请

US20080000768A1 Electrically Coupled Target Panels 审中-公开
标题翻译：电耦合目标板
公开(公告)号：US20080000768A1
公开(公告)日：2008-01-03
申请号：US11428226
申请日：2006-06-30
申请人： Bradley O. Stimson , Makoto Inagawa , Hienminh Huu Le , John M. White
发明人： Bradley O. Stimson , Makoto Inagawa , Hienminh Huu Le , John M. White
IPC分类号： C23C14/32 , C23C14/00
CPC分类号： C23C14/3407 , H01J37/3408 , H01J37/3423 , H01J37/3429 , H01J37/3435 , H01J37/3444
摘要： A method and apparatus for electrically coupling a plurality of target together is disclosed. Individually powered targets allow greater control over depositing during a sputtering process. By individually powering the targets, different power levels may be applied to different targets. The targets may additionally be coupled together with a resistor. The resistor allows the targets to have a more controlled power level.
摘要翻译：公开了一种用于将多个目标物电耦合在一起的方法和装置。单独供电的目标允许在溅射过程中更好地控制沉积。通过单独为目标供电，不同的功率水平可能适用于不同的目标。靶可以另外与电阻器耦合在一起。电阻允许目标具有更多的受控功率水平。

2. 发明申请

US20080006523A1 COOLED PVD SHIELD 审中-公开
标题翻译：冷却PVD膜
公开(公告)号：US20080006523A1
公开(公告)日：2008-01-10
申请号：US11764217
申请日：2007-06-17
申请人： Akihiro Hosokawa , Bradley O. Stimson , Hienminh Huu Le , Makoto Inagawa
发明人： Akihiro Hosokawa , Bradley O. Stimson , Hienminh Huu Le , Makoto Inagawa
IPC分类号： C23C16/00 , C23C14/32
CPC分类号： C23C14/042 , C23C14/50 , C23C14/564 , H01J37/32458 , H01J37/32623 , H01J37/32651 , H01J37/32715
摘要： The present invention generally comprises a top shield for shielding a shadow frame within a PVD chamber. The top shield may remain in a stationary position and at least partially shield the shadow frame to reduce the amount of material that may deposit on the shadow frame during processing. The top shield may be cooled to reduce the amount of fluxuation in temperature of the top shield and shadow frame during processing and/or during down time.
摘要翻译：本发明通常包括用于屏蔽PVD室内的阴影框架的顶部屏蔽件。顶部屏蔽可以保持在静止位置，并且至少部分地遮蔽阴影框架以减少在处理期间可能沉积在阴影框架上的材料的量。顶部屏蔽可以被冷却以减少处理期间和/或在停机期间顶部屏蔽和阴影框架的温度的变化量。

3. 发明授权

US09222165B2 Cooled PVD shield 有权
标题翻译：冷却PVD屏蔽
公开(公告)号：US09222165B2
公开(公告)日：2015-12-29
申请号：US13353136
申请日：2012-01-18
申请人： Akihiro Hosokawa , Bradley O. Stimson , Hienminh Huu Le , Makoto Inagawa
发明人： Akihiro Hosokawa , Bradley O. Stimson , Hienminh Huu Le , Makoto Inagawa
IPC分类号： C23C14/34 , C23C14/04 , H01J37/32 , C23C14/50 , C23C14/56
CPC分类号： C23C14/042 , C23C14/50 , C23C14/564 , H01J37/32458 , H01J37/32623 , H01J37/32651 , H01J37/32715
摘要： The present invention generally comprises a top shield for shielding a shadow frame within a PVD chamber. The top shield may remain in a stationary position and at least partially shield the shadow frame to reduce the amount of material that may deposit on the shadow frame during processing. The top shield may be cooled to reduce the amount of fluxuation in temperature of the top shield and shadow frame during processing and/or during down time.
摘要翻译：本发明通常包括用于屏蔽PVD室内的阴影框架的顶部屏蔽件。顶部屏蔽可以保持在静止位置，并且至少部分地遮蔽阴影框架以减少在处理期间可能沉积在阴影框架上的材料的量。顶部屏蔽可以被冷却以减少处理期间和/或在停机期间顶部屏蔽和阴影框架的温度的变化量。

4. 发明申请

US20070295596A1 PVD TARGET 有权
标题翻译： PVD目标
公开(公告)号：US20070295596A1
公开(公告)日：2007-12-27
申请号：US11426271
申请日：2006-06-23
申请人： Makoto INAGAWA , Bradley O. Stimson , Akihiro Hosokawa , Hienminh Huu Le , Jrjyan Jerry Chen
发明人： Makoto INAGAWA , Bradley O. Stimson , Akihiro Hosokawa , Hienminh Huu Le , Jrjyan Jerry Chen
IPC分类号： C23C14/32 , C23C14/00
CPC分类号： C23C14/3407 , C23C14/352 , C23C14/564 , H01J37/3435
摘要： A physical vapor deposition target assembly is configured to isolate a target-bonding layer from a processing region. In one embodiment, the target assembly comprises a backing plate, a target having a first surface and a second surface, and a bonding layer disposed between the backing plate and the second surface. The first surface of the target is in fluid contact with a processing region and the second surface of the target is oriented toward the backing plate. The target assembly may include multiple targets.
摘要翻译：物理气相沉积靶组件被配置为将目标结合层与处理区域隔离。在一个实施例中，目标组件包括背板，具有第一表面和第二表面的靶，以及设置在背板和第二表面之间的结合层。目标的第一表面与处理区域流体接触，并且目标物的第二表面朝向背板取向。目标组件可以包括多个目标。

5. 发明申请

US20120111273A1 COOLED PVD SHIELD 有权
标题翻译：冷却PVD膜
公开(公告)号：US20120111273A1
公开(公告)日：2012-05-10
申请号：US13353136
申请日：2012-01-18
申请人： AKIHIRO HOSOKAWA , Bradley O. Stimson , Hienminh Huu Le , Makoto Inagawa
发明人： AKIHIRO HOSOKAWA , Bradley O. Stimson , Hienminh Huu Le , Makoto Inagawa
IPC分类号： C23C16/04 , C23C16/458
CPC分类号： C23C14/042 , C23C14/50 , C23C14/564 , H01J37/32458 , H01J37/32623 , H01J37/32651 , H01J37/32715
摘要： The present invention generally comprises a top shield for shielding a shadow frame within a PVD chamber. The top shield may remain in a stationary position and at least partially shield the shadow frame to reduce the amount of material that may deposit on the shadow frame during processing. The top shield may be cooled to reduce the amount of fluxuation in temperature of the top shield and shadow frame during processing and/or during down time.
摘要翻译：本发明通常包括用于屏蔽PVD室内的阴影框架的顶部屏蔽件。顶部屏蔽可以保持在静止位置，并且至少部分地遮蔽阴影框架以减少在处理期间可能沉积在阴影框架上的材料的量。顶部屏蔽可以被冷却以减少处理期间和/或在停机期间顶部屏蔽和阴影框架的温度的变化量。

6. 发明授权

US07815782B2 PVD target 有权
标题翻译： PVD目标
公开(公告)号：US07815782B2
公开(公告)日：2010-10-19
申请号：US11426271
申请日：2006-06-23
申请人： Makoto Inagawa , Bradley O. Stimson , Akihiro Hosokawa , Hienminh Huu Le , Jrjyan Jerry Chen
发明人： Makoto Inagawa , Bradley O. Stimson , Akihiro Hosokawa , Hienminh Huu Le , Jrjyan Jerry Chen
IPC分类号： C23C14/35
CPC分类号： C23C14/3407 , C23C14/352 , C23C14/564 , H01J37/3435
摘要： A physical vapor deposition target assembly is configured to isolate a target-bonding layer from a processing region. In one embodiment, the target assembly comprises a backing plate, a target having a first surface and a second surface, and a bonding layer disposed between the backing plate and the second surface. The first surface of the target is in fluid contact with a processing region and the second surface of the target is oriented toward the backing plate. The target assembly may include multiple targets.
摘要翻译：物理气相沉积靶组件被配置为将目标结合层与处理区域隔离。在一个实施例中，目标组件包括背板，具有第一表面和第二表面的靶，以及设置在背板和第二表面之间的结合层。目标的第一表面与处理区域流体接触，并且目标物的第二表面朝向背板取向。目标组件可以包括多个目标。

7. 发明申请

US20070295598A1 Backing plate assembly 审中-公开
标题翻译：背板组件
公开(公告)号：US20070295598A1
公开(公告)日：2007-12-27
申请号：US11483134
申请日：2006-07-07
申请人： Makoto Inagawa , Hienminh Huu Le , Bradley O. Stimson , Akihiro Hosokawa
发明人： Makoto Inagawa , Hienminh Huu Le , Bradley O. Stimson , Akihiro Hosokawa
IPC分类号： C23C14/00 , C23C14/32
CPC分类号： C23C14/3407 , C23C14/352 , C23C14/564 , H01J37/3435
摘要： In certain embodiments, the invention comprises a backing plate for accommodating large area sputtering targets is disclosed. The backing plate assembly has cavities carved into the back surface of the backing plate. The backing plate may further include cooling channels that run through the backing plate to control the temperature of the backing plate and the target. The cavities may be filled with a material that has a lower density than the backing plate. Additionally, the entire back surface may be covered with the material to produce a smooth surface upon which a magnetron may move during a PVD process.
摘要翻译：在某些实施例中，本发明包括用于容纳大面积溅射靶的背板。背板组件具有雕刻到背板的后表面中的腔体。背板还可以包括穿过背板的冷却通道，以控制背板和靶的温度。空腔可以填充具有比背板更低密度的材料。此外，整个后表面可以被材料覆盖以产生光滑表面，在PVD过程中磁控管可在该光滑表面上移动。

8. 发明授权

US07432184B2 Integrated PVD system using designated PVD chambers 失效
标题翻译：集成PVD系统使用指定的PVD腔
公开(公告)号：US07432184B2
公开(公告)日：2008-10-07
申请号：US11213662
申请日：2005-08-26
申请人： Akihiro Hosokawa , Makoto Inagawa , Hienminh Huu Le , John M. White
发明人： Akihiro Hosokawa , Makoto Inagawa , Hienminh Huu Le , John M. White
IPC分类号： H01L21/00 , H01L21/44
CPC分类号： H01L21/67201 , C23C14/566 , C23C14/568 , H01L21/67167 , H01L21/67184 , H01L21/67196 , H01L29/66765
摘要： A method for making a film stack containing one or more metal-containing layers and a substrate processing system for forming the film stack on a substrate are provided. The substrate processing system includes at least one transfer chamber coupled to at least one load lock chamber, at least one first physical vapor deposition (PVD) chamber configured to deposit a first material layer on a substrate, and at least one second PVD chamber for in-situ deposition of a second material layer over the first material layer within the same substrate processing system without breaking the vacuum or taking the substrate out of the substrate processing system to prevent surface contamination, oxidation, etc. The substrate processing system is configured to provide high throughput and compact footprint for in-situ sputtering of different material layers in designated PVD chambers.
摘要翻译：提供了一种制造包含一个或多个含金属层的膜堆叠的方法和用于在基板上形成膜堆叠的基板处理系统。衬底处理系统包括耦合到至少一个负载锁定室的至少一个传送室，被配置成将第一材料层沉积在衬底上的至少一个第一物理气相沉积（PVD）室和至少一个第二PVD室在相同的基板处理系统内在第一材料层上沉积第二材料层而不破坏真空或将基板从基板处理系统取出以防止表面污染，氧化等。基板处理系统被配置为提供高产量和紧凑的占地面积，用于在指定的PVD室中不同材料层的原位溅射。

9. 发明授权

US06801400B2 Motion limiter for disk drive integrated gimbal suspension 有权
标题翻译：磁盘驱动器集成云台悬架的运动限制器
公开(公告)号：US06801400B2
公开(公告)日：2004-10-05
申请号：US10057639
申请日：2002-01-24
申请人： Ta-Chang Fu , Hienminh Huu Le , Tzong-Shii Pan
发明人： Ta-Chang Fu , Hienminh Huu Le , Tzong-Shii Pan
IPC分类号： G11B548
CPC分类号： G11B5/4826
摘要： An integrated gimbal suspension includes a flexure with an integrated, built-in gimbal, and includes a limiter structure that constrains motions of the gimbal in multi-degrees of freedom. The limiter structure includes one or more tab-shaped limiters and corresponding stops integrally formed into the gimbal assembly at strategic locations, which interact to provide the desired constraints to the motions of the flexure gimbal to prevent permanent damage from over-straining the gimbal or flexure beyond its designed range. The limiters may be pre-formed tab-shaped structures that are bent from the plane of the flexure. As the gimbal moves from its nominal position, one or more limiters engage the stops before such motion reaches the limit of the designed range of motion of the gimbal.
摘要翻译：一体化万向节悬架包括具有集成的内置万向架的挠曲件，并且包括限制器结构，其以多自由度约束万向节的运动。限制器结构包括一个或多个翼片限位器和在战略位置处一体地形成在万向节组件中的相应的止挡件，其相互作用以对弯曲万向架的运动提供期望的约束，以防止由于万向架或挠曲件过度拉伸导致的永久性损坏超出其设计范围。限制器可以是从挠曲件的平面弯曲的预成形的片状结构。当万向架从其标称位置移动时，一个或多个限位器在这种运动达到设计的万向节运动范围的极限之前接合止挡件。

10. 发明授权

US06552875B1 Suspension design for improving the curing process for head bonding application and method for same 有权
标题翻译：用于改善头部粘合应用的固化过程的悬架设计及其方法
公开(公告)号：US06552875B1
公开(公告)日：2003-04-22
申请号：US09620791
申请日：2000-07-21
申请人： Hienminh Huu Le , Tzong-Shii Pan
发明人： Hienminh Huu Le , Tzong-Shii Pan
IPC分类号： G11B560
CPC分类号： G11B5/484 , G11B5/6005
摘要： A suspension design for improving the curing process for head bonding application and a method for same is disclosed. Vias are formed in the load beam and the flexure so that UV light is allowed to pass to cure the UV sensitive adhesive thereby bonding the slider to the head gimbal assembly.
摘要翻译：公开了一种用于改善头部粘合应用的固化过程的悬架设计及其方法。在负载梁和挠曲件中形成通孔，使得允许UV光通过以固化UV敏感粘合剂，从而将滑块结合到头部万向架组件。

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