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1. 发明授权

US5273589A Method for low pressure rinsing and drying in a process chamber 失效
标题翻译：在处理室中低压冲洗和干燥的方法
公开(公告)号：US5273589A
公开(公告)日：1993-12-28
申请号：US911408
申请日：1992-07-10
申请人： Bradley L. Griswold , Syed A. Husain
发明人： Bradley L. Griswold , Syed A. Husain
IPC分类号： B08B3/10 , F26B3/00 , F26B5/04 , H01L21/00 , H01L21/306 , B08B3/00
CPC分类号： H01L21/02043 , B08B3/10 , F26B3/00 , F26B5/04 , H01L21/67028 , Y10S134/902
摘要： An embodiment of the present invention is a system for rinsing and drying items comprising a process chamber for receiving the items; a rinse condenser; a first heater; a vaporizer for vaporizing water and including a second heater; a vacuum system for reducing the pressure within the process chamber; and a valving apparatus for independently coupling the process chamber to the vaporizer and the process chamber to the vacuum system. A controller sequences the first and second heaters and the valving apparatus such that the pressure within the process chamber is substantially reduced below atmospheric pressure, the rinse condenser is turned on, water is introduced to the vaporizer which is turned to water vapor by turning the second heater on, the water vapor is circulated to the process chamber, the water vapor is condensed on the items and the rinse condenser, the condensate water is allowed to rain on the items, the water condensate is returned from the process chamber to the vaporizer, the process chamber is isolated from the vaporizer, the rinse condenser is turned off, the first heater is turned on, the vacuum system operates to remove water vapor from the process chamber, and atmospheric pressure is restored to the process chamber when the items are dry of water.
摘要翻译：本发明的一个实施例是一种用于冲洗和干燥物品的系统，包括用于接收物品的处理室; 冲洗冷凝器; 第一个加热器用于蒸发水并包括第二加热器的蒸发器; 用于减小处理室内的压力的真空系统; 以及用于将处理室独立地连接到蒸发器和处理室到真空系统的阀装置。控制器对第一和第二加热器和阀装置进行排序，使得处理室内的压力基本上降低到大气压以下，冲洗冷凝器打开，水通过转动第二个加热器上，水蒸汽循环到处理室，水蒸汽在物品和冲洗冷凝器上冷凝，冷凝水被允许在物品上下雨，水冷凝物从处理室返回到蒸发器，处理室与蒸发器隔离，冲洗冷凝器关闭，第一加热器打开，真空系统操作以从处理室中除去水蒸汽，当物品干燥时大气压力恢复到处理室的水。

2. 发明授权

US5998859A Packaging and interconnect system for integrated circuits 失效
公开(公告)号：US5998859A
公开(公告)日：1999-12-07
申请号：US420844
申请日：1995-04-10
申请人： Bradley L. Griswold , Chung Wen Ho , William C. Robinette, Jr.
发明人： Bradley L. Griswold , Chung Wen Ho , William C. Robinette, Jr.
IPC分类号： H01L23/04 , H01L23/24 , H01L23/31 , H01L23/367 , H01L23/498 , H01L23/538 , H01L25/065 , H01L23/02
CPC分类号： H01L23/3121 , H01L23/04 , H01L23/24 , H01L23/3128 , H01L23/3675 , H01L23/49827 , H01L23/5389 , H01L25/0652 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14
摘要： A thin MCM packaging structure and technique is provided in which a thin film decal interconnect circuit is fabricated on a thin aluminum wafer. The thin-film decal interconnect employs Au metallurgy for bonding and comprises a bond pad/ground plane layer, topside pads, and one or more routing layers. The top routing layer also acts as the pad layer along the edge of the interconnect structure. The underside of the decal interconnect structure is provided with metal pads for attachment to conventional aluminum or gold I/O pads on one surface of the integrated circuit die. A thermosonic bonding system is used to bond the die pads to the pads. The aluminum wafer is selectively removed forming one or more cavities to hold one or more die to be mounted on the MCM structure. The die are oriented with their pads in contact with contact pads on the thin-film decal interconnect to which they are bonded and the cavities are filled with a liquid encapsulant and cured. The composite structure may be lapped down to minimize overall package thickness and to expose the backsides of the integrated circuit die for thermal management.

3. 发明授权

US5796164A Packaging and interconnect system for integrated circuits 失效
标题翻译：用于集成电路的封装和互连系统
公开(公告)号：US5796164A
公开(公告)日：1998-08-18
申请号：US621563
申请日：1996-03-25
申请人： Mark T. McGraw , Bradley L. Griswold , Chung W. Ho , Byoung-Youl Min , Michael I. Grove , William C. Robinette, Jr.
发明人： Mark T. McGraw , Bradley L. Griswold , Chung W. Ho , Byoung-Youl Min , Michael I. Grove , William C. Robinette, Jr.
IPC分类号： H01L23/24 , H01L23/31 , H01L23/538 , H01L25/065 , H01L23/34 , H01L23/02 , H01L23/28
CPC分类号： H01L23/5389 , H01L23/24 , H01L23/3121 , H01L23/3128 , H01L23/5387 , H01L25/0652 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/14 , H01L2924/181
摘要： A thin MCM packaging structure and technique is provided in which a thin film decal interconnect circuit is fabricated on a thin aluminum wafer. The thin-film decal interconnect employs Au metallurgy for bonding and comprises a bond pad/ground plane layer, topside pads, and one or more routing layers. The top routing layer also acts as the pad layer along the edge of the interconnect structure. The underside of the decal interconnect structure is provided with metal pads for attachment to conventional aluminum or gold I/O pads on one surface of the integrated circuit die. A thermosonic bonding system is used to bond the die pads to the pads. The aluminum wafer is selectively removed forming one or more cavities to hold one or more die to be mounted on the MCM structure. The die are oriented with their pads in contact with contact pads on the thin-film decal interconnect to which they are bonded and the cavities are filled with a liquid encapsulant and cured. A leadframe has inner bond leads electrically bonded to bonding pads of the thin film multilayer interconnect circuit disposed about a periphery thereof and a multi-layer laminate board is mechanically bonded over the thin film multilayer interconnect circuit and over the inner bond leads of the lead frame and has a first layer including conductive pads extending outward from about an inner periphery thereof, and a second layer including apertures aligned with outwardly extending portions of the conductive pads.
摘要翻译：提供了一种薄MCM封装结构和技术，其中在薄铝晶片上制造薄膜贴片互连电路。薄膜贴片互连采用Au冶金用于结合，并且包括接合焊盘/接地平面层，顶侧焊盘和一个或多个布线层。顶部路由层还沿着互连结构的边缘充当焊盘层。贴花互连结构的下侧设置有用于附接到集成电路管芯的一个表面上的常规铝或金I / O焊盘的金属焊盘。热键结合系统用于将管芯焊盘焊接到焊盘。选择性地去除铝晶片形成一个或多个空腔以保持要安装在MCM结构上的一个或多个管芯。模具被定向成使它们的焊盘与薄膜贴片互连上的接触焊盘接触，并将它们粘合到其上并且空腔填充有液体密封剂并固化。引线框架具有电连接到薄膜多层互连电路的接合焊盘的内部接合引线，该接合焊盘围绕其周边设置，并且多层层压板机械地接合在薄膜多层互连电路上并且在引线框架的内部接合引线上并且具有包括从其内周向外延伸的导电焊盘的第一层，以及包括与导电焊盘的向外延伸部分对准的孔的第二层。

4. 发明授权

US5422514A Packaging and interconnect system for integrated circuits 失效
标题翻译：用于集成电路的封装和互连系统
公开(公告)号：US5422514A
公开(公告)日：1995-06-06
申请号：US60406
申请日：1993-05-11
申请人： Bradley L. Griswold , Chung W. Ho , William C. Robinette, Jr.
发明人： Bradley L. Griswold , Chung W. Ho , William C. Robinette, Jr.
IPC分类号： H01L23/04 , H01L23/24 , H01L23/31 , H01L23/367 , H01L23/498 , H01L23/538 , H01L25/065 , H05K3/34
CPC分类号： H01L23/3121 , H01L23/04 , H01L23/24 , H01L23/3128 , H01L23/3675 , H01L23/49827 , H01L23/5389 , H01L25/0652 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14
摘要： A thin MCM packaging structure and technique is provided in which a thin film decal interconnect circuit is fabricated on a thin aluminum wafer. The thin-film decal interconnect employs Au metallurgy for bonding and comprises a bond pad/ground plane layer, topside pads, and one or more routing layers. The top routing layer also acts as the pad layer along the edge of the interconnect structure. The underside of the decal interconnect structure is provided with metal pads for attachment to conventional aluminum or gold I/O pads on one surface of the integrated circuit die. A thermosonic bonding system is used to bond the die pads to the pads. The aluminum wafer is selectively removed forming one or more cavities to hold one or more die to be mounted on the MCM structure. The die are oriented with their pads in contact with contact pads on the thin-film decal interconnect to which they are bonded and the cavities are filled with a liquid encapsulant and cured. The composite structure may be lapped down to minimize overall package thickness and to expose the backsides of the integrated circuit die for thermal management.
摘要翻译：提供了一种薄MCM封装结构和技术，其中在薄铝晶片上制造薄膜贴片互连电路。薄膜贴片互连采用Au冶金用于结合，并且包括接合焊盘/接地平面层，顶侧焊盘和一个或多个布线层。顶部路由层还沿着互连结构的边缘充当焊盘层。贴花互连结构的下侧设置有用于附接到集成电路管芯的一个表面上的常规铝或金I / O焊盘的金属焊盘。热键结合系统用于将管芯焊盘焊接到焊盘。选择性地去除铝晶片形成一个或多个空腔以保持要安装在MCM结构上的一个或多个管芯。模具被定向成使它们的焊盘与薄膜贴片互连上的接触焊盘接触，并将它们粘合到其上并且空腔填充有液体密封剂并固化。复合结构可以被倒下以最小化整体封装厚度并暴露集成电路管芯的背面用于热管理。

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