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1. 发明申请

US20060286694A1 Method for fabricating LED 审中-公开
标题翻译：制造LED的方法
公开(公告)号：US20060286694A1
公开(公告)日：2006-12-21
申请号：US11455839
申请日：2006-06-20
申请人： Bor-Jen Wu , Mei-Hui Wu , Ken Kai-fu Chang , Chien-An Chen , Yuan-Hsiao Chang , Li-Shei Yeh
发明人： Bor-Jen Wu , Mei-Hui Wu , Ken Kai-fu Chang , Chien-An Chen , Yuan-Hsiao Chang , Li-Shei Yeh
IPC分类号： H01L21/00
CPC分类号： H01L33/0079
摘要： A high etching selective layer and a light emitting structure are formed subsequently on a semiconductor substrate. Then, a p-type Ohmic contact layer and a metal substrate are formed subsequently on the light emitting structure. The semiconductor substrate and the high etching selective layer are removed. Next, an n-type electrode and a transparent conductive layer are formed adjacent to surface of the light emitting structure opposite to the metal layer.
摘要翻译：随后在半导体衬底上形成高蚀刻选择层和发光结构。然后，在发光结构上随后形成p型欧姆接触层和金属基板。去除半导体衬底和高蚀刻选择层。接下来，与发光结构的与金属层相反的表面相邻地形成n型电极和透明导电层。

2. 发明授权

US06963167B2 Electrode structure for a light-emitting element 失效
标题翻译：用于发光元件的电极结构
公开(公告)号：US06963167B2
公开(公告)日：2005-11-08
申请号：US10733408
申请日：2003-12-12
申请人： Bor-Jen Wu , Mei-Hui Wu , Yuan-Hsiao Chang , Chien-An Chen
发明人： Bor-Jen Wu , Mei-Hui Wu , Yuan-Hsiao Chang , Chien-An Chen
IPC分类号： H01J1/62 , H01L33/38 , H05B33/02
CPC分类号： H01L33/38 , H01L33/20
摘要： An electrode structure for a light-emitting element includes a first electrode and a second electrode. The first electrode has a plurality of first fingers paralleling with each other, a first connective part, and at least a first contact part. Each first finger has a first end and a second end. Pluralities of first ends connect to the first connective part. The first contact part interposes between any first end and the first connective part. The second electrode has a plurality of second fingers paralleling with each other, a second connective part, and at least a second contact part. Each second finger has a third end and a fourth end, and any second finger is between and parallels to any two first fingers. Pluralities of third ends connect to the second connective part. The second contact part interposes between any third end and the second connective part. The second electrode defines a plurality of hexagonal units among a plurality of second ends. Each hexagonal unit shares its four sides to its adjacent hexagonal units, and the four sides include two of the second fingers and the second connective part. Each second end extends to the center of each hexagonal unit.
摘要翻译：用于发光元件的电极结构包括第一电极和第二电极。第一电极具有彼此并联的多个第一指状物，第一连接部分和至少第一接触部分。每个第一手指具有第一端和第二端。多个第一端连接到第一连接部分。第一接触部分插入在任何第一端和第一连接部分之间。第二电极具有彼此并联的多个第二指状物，第二连接部分和至少第二接触部分。每个第二手指具有第三端和第四端，并且任何第二手指位于并平行于任何两个第一手指之间。多个第三端连接到第二连接部分。第二接触部分插入任何第三端和第二连接部分之间。第二电极在多个第二端中限定多个六边形单元。每个六边形单元将其四个侧面共享到其相邻的六边形单元，并且四边包括两个第二指状物和第二结合部分。每个第二端延伸到每个六边形单元的中心。

3. 发明申请

US20060284321A1 LED structure for flip-chip package and method thereof 审中-公开
标题翻译：用于倒装芯片封装的LED结构及其方法
公开(公告)号：US20060284321A1
公开(公告)日：2006-12-21
申请号：US11471482
申请日：2006-06-21
申请人： Bor-Jen Wu , Mei-Hui Wu , Chien-An Chen , Yuan-Hsiao Chang
发明人： Bor-Jen Wu , Mei-Hui Wu , Chien-An Chen , Yuan-Hsiao Chang
IPC分类号： H01L23/48
CPC分类号： H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： LED structure can be packaged by using flip-chip package. An LED structure is covered by a conduction enhancing layer. A bumping area definition layer is then formed on the conduction enhancing layer to expose bumping area portions with p-pad and n-pad underneath, and a bumping pad is then formed over the bumping area portions. The bumping area definition layer and then exposed conduction enhancing layer is removed subsequently.
摘要翻译： LED结构可以通过使用倒装芯片封装封装。 LED结构被传导增强层覆盖。然后在导电增强层上形成凸起区域定义层，以在下面的p焊盘和n焊盘露出凸块区域部分，然后在凸块区域部分上形成凸台。随后去除碰撞区域定义层，然后暴露导电增强层。

4. 发明申请

US20090140282A1 Led structure for flip-chip package and method thereof 审中-公开
标题翻译：用于倒装芯片封装的LED结构及其方法
公开(公告)号：US20090140282A1
公开(公告)日：2009-06-04
申请号：US12292716
申请日：2008-11-25
申请人： Bor-Jen Wu , Mei-Hui Wu , Chien-An Chen , Yuan-Hsiao Chang
发明人： Bor-Jen Wu , Mei-Hui Wu , Chien-An Chen , Yuan-Hsiao Chang
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： LED structure can be packaged by using flip-chip package. An LED structure is covered by a conduction enhancing layer. A bumping area definition layer is then formed on the conduction enhancing layer to expose bumping area portions with p-pad and n-pad underneath, and a bumping pad is then formed over the bumping area portions. The bumping area definition layer and then exposed conduction enhancing layer is removed subsequently.
摘要翻译： LED结构可以通过使用倒装芯片封装封装。 LED结构被传导增强层覆盖。然后在导电增强层上形成凸起区域定义层，以在下面的p焊盘和n焊盘露出凸块区域部分，然后在凸块区域部分上形成凸台。随后去除碰撞区域定义层，然后暴露导电增强层。

5. 发明授权

US06884646B1 Method for forming an LED device with a metallic substrate 有权
标题翻译：用金属基板形成LED器件的方法
公开(公告)号：US06884646B1
公开(公告)日：2005-04-26
申请号：US10796200
申请日：2004-03-10
申请人： Bor-Jen Wu , Mei-Hui Wu , Chien-An Chen , Yuan-Hsiao Chang
发明人： Bor-Jen Wu , Mei-Hui Wu , Chien-An Chen , Yuan-Hsiao Chang
IPC分类号： H01L21/00 , H01L33/00
CPC分类号： H01L33/0079
摘要： An LED epitaxial structure and a first electrode layer are formed on a provisional substrate in sequence. Then, a metallic permanent substrate is formed on the first electrode layer, and the provisional substrate is removed to expose a surface of the LED epitaxial structure. A plurality of second electrodes is formed on the surface of the LED epitaxial structure. Finally, the metallic permanent substrate, the first electrode layer, and the LED epitaxial structure are diced to form a plurality of LED devices.
摘要翻译：依次在临时衬底上形成LED外延结构和第一电极层。然后，在第一电极层上形成金属永久性基板，除去临时基板，露出LED外延结构的表面。在LED外延结构的表面上形成多个第二电极。最后，金属永久性基板，第一电极层和LED外延结构被切割以形成多个LED器件。

6. 发明申请

US20050230699A1 Light-emitting device with improved optical efficiency 审中-公开
标题翻译：具有提高光学效率的发光装置
公开(公告)号：US20050230699A1
公开(公告)日：2005-10-20
申请号：US11104463
申请日：2005-04-13
申请人： Bor-Jen Wu , Chien-An Chen , Mei-Hui Wu , Yuan-Hsiao Chang
发明人： Bor-Jen Wu , Chien-An Chen , Mei-Hui Wu , Yuan-Hsiao Chang
IPC分类号： H01L27/15 , H01L33/22 , H01L33/46
CPC分类号： H01L33/22 , H01L33/46
摘要： A light-emitting device with improved optical efficiency is disclosed. A semiconductor substrate underlies active p-n junction layers, and has an internal scattering/reflecting surface near the bottom surface of the semiconductor substrate. Accordingly, the light originated at the active p-n junction layers is internally reflected from the internally curved reflecting surface, and substantially passes though the top surface of the semiconductor substrate.
摘要翻译：公开了一种具有改善的光学效率的发光器件。半导体衬底位于有源p-n结层的底部，并且在半导体衬底的底表面附近具有内部散射/反射表面。因此，起始于活性p-n结层的光从内部弯曲的反射表面内部反射，并且基本上穿过半导体衬底的顶表面。

7. 发明申请

US20050127817A1 Electrode structure for a light-emitting element 失效
公开(公告)号：US20050127817A1
公开(公告)日：2005-06-16
申请号：US10733408
申请日：2003-12-12
申请人： Bor-Jen Wu , Mei-Hui Wu , Yuan-Hsiao Chang , Chen-An Chen
发明人： Bor-Jen Wu , Mei-Hui Wu , Yuan-Hsiao Chang , Chen-An Chen
IPC分类号： H01J1/62 , H01L33/38 , H05B33/02
CPC分类号： H01L33/38 , H01L33/20
摘要： An electrode structure for a light-emitting element includes a first electrode and a second electrode. The first electrode has a plurality of first fingers paralleling with each other, a first connective part, and at least a first contact part. Each first finger has a first end and a second end. Pluralities of first ends connect to the first connective part. The first contact part interposes between any first end and the first connective part. The second electrode has a plurality of second fingers paralleling with each other, a second connective part, and at least a second contact part. Each second finger has a third end and a fourth end, and any second finger is between and parallels to any two first fingers. Pluralities of third ends connect to the second connective part. The second contact part interposes between any third end and the second connective part. The second electrode defines a plurality of hexagonal units among a plurality of second ends. Each hexagonal unit shares its four sides to its adjacent hexagonal units, and the four sides include two of the second fingers and the second connective part. Each second end extends to the center of each hexagonal unit.

8. 发明申请

US20050227394A1 Method for forming die protecting layer 审中-公开
标题翻译：成型模保护层成型方法
公开(公告)号：US20050227394A1
公开(公告)日：2005-10-13
申请号：US10818156
申请日：2004-04-03
申请人： Bor-Jen Wu , Mei-Hui Wu
发明人： Bor-Jen Wu , Mei-Hui Wu
IPC分类号： H01L21/47 , H01L33/50
CPC分类号： H01L33/501 , H01L2933/0041
摘要： A method for forming a die protecting layer is disclosed. The method comprises the following steps: providing a wafer with numerous dies on a first surface and a second surface, forming a transparent protecting layer on the second surface of the wafer. Clearly, the transparent protecting layer is directly formed on the backside or the front side of the wafer.
摘要翻译：公开了一种形成管芯保护层的方法。该方法包括以下步骤：在第一表面和第二表面上提供具有多个管芯的晶片，在晶片的第二表面上形成透明保护层。显然，透明保护层直接形成在晶片的背面或正面上。

9. 发明授权

US07221237B2 Frequency tunable device 有权
标题翻译：频率可调谐装置
公开(公告)号：US07221237B2
公开(公告)日：2007-05-22
申请号：US10982497
申请日：2004-11-05
申请人： Chun-Sheng Liang , Mei-Hui Wu , Jenn-Ming Wu
发明人： Chun-Sheng Liang , Mei-Hui Wu , Jenn-Ming Wu
IPC分类号： H01P1/11 , H01P1/215 , H01P1/23
CPC分类号： H01P1/181
摘要： A frequency tunable device includes a substrate, and a capacitor structure supported by the substrate and including a ferroelectric film and first and second electrodes. The ferroelectric film has two opposite sides, and is made from a ferroelectric material having a formula of Pb1−xBaxZrO3, where x is a positive number greater than 0.3 and less than 0.6. The first and second electrodes are respectively formed on the sides of the ferroelectric film. The dielectric constant of the ferroelectric film varies with a voltage applied to the first and second electrodes.
摘要翻译：频率可调谐装置包括基板和由基板支撑并包括铁电薄膜和第一和第二电极的电容器结构。铁电体膜具有两个相对的两侧，并且由具有下式的铁电材料制成：具有下式的Pb 1-x Ba x ZrO 3 3，其中 x是大于0.3且小于0.6的正数。第一和第二电极分别形成在铁电体膜的侧面上。铁电体膜的介电常数随施加到第一和第二电极的电压而变化。

10. 发明申请

US20070121317A1 Solar lighting device having color and brightness control mechanism 审中-公开
标题翻译：具有彩色和亮度控制机构的太阳能照明装置
公开(公告)号：US20070121317A1
公开(公告)日：2007-05-31
申请号：US11286328
申请日：2005-11-25
申请人： Bin-Juine Huang , Hung-Ta Tsao , Mei-Hui Wu , Min-Sheng Wu , Chun-Kuan Wu , Shih-Ming Yan
发明人： Bin-Juine Huang , Hung-Ta Tsao , Mei-Hui Wu , Min-Sheng Wu , Chun-Kuan Wu , Shih-Ming Yan
IPC分类号： F21L4/00
CPC分类号： F21S9/037 , A47G19/2227 , A47G23/0309 , A47G2019/2238 , F21V23/0442 , F21V23/0485 , F21V33/0036 , F21Y2115/10
摘要： A solar lighting device includes a transparent housing. Within the housing, there are provided a light-emitting member (e.g., LED or lamp), a control circuit having a microprocessor and a switch activated by magnetic force, light, or body temperature, and a solar battery for supplying electric power to both the light-emitting member and the control circuit. A transparent or translucent object such as cup, bottle, or ornament may be mounted on the lighting device such that light with varying color and/or brightness may be emitted from the object as controlled by the microprocessor and the switch activated by an approaching trigger member when the lighting device is activated.
摘要翻译：太阳能照明装置包括透明外壳。在壳体内设置有发光部件（例如LED或灯），具有微处理器的控制电路和由磁力，光或体温激活的开关，以及用于向两者提供电力的太阳能电池发光部件和控制电路。诸如杯子，瓶子或装饰品的透明或半透明物体可以安装在照明装置上，使得可以从物体发射具有不同颜色和/或亮度的光，由微处理器控制，并且由接近的触发器件激活的开关当照明装置被激活时。

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