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1. 发明授权

US07158896B1 Real time immersion medium control using scatterometry 失效
标题翻译：实时浸入介质控制采用散射法
公开(公告)号：US07158896B1
公开(公告)日：2007-01-02
申请号：US10978604
申请日：2004-11-01
申请人： Bhanwar Singh , Srikanteswara Dakshina-Murthy , Khoi A. Phan , Ramkumar Subramanian , Bharath Rangarajan , Iraj Emami
发明人： Bhanwar Singh , Srikanteswara Dakshina-Murthy , Khoi A. Phan , Ramkumar Subramanian , Bharath Rangarajan , Iraj Emami
IPC分类号： G06F19/00
CPC分类号： G03F7/70916 , G03F7/2041 , G03F7/70341
摘要： Systems and/or methods are disclosed for measuring and/or controlling an amount of impurity that is dissolved within an immersion medium employed with immersion lithography. The impurity can be photoresist from a photoresist layer coated upon a substrate surface. A known grating structure is built upon the substrate. A real time immersion medium monitoring component facilitates measuring and/or controlling the amount of impurities dissolved within the immersion medium by utilizing light scattered from the known grating structure.
摘要翻译：公开了用于测量和/或控制溶解在浸入式光刻中使用的浸渍介质中的杂质量的系统和/或方法。杂质可以是来自涂覆在基材表面上的光致抗蚀剂层的光致抗蚀剂。已知的光栅结构被构建在衬底上。实时浸没介质监测部件通过利用从已知光栅结构散射的光来便于测量和/或控制溶解在浸没介质中的杂质的量。

2. 发明授权

US07065427B1 Optical monitoring and control of two layers of liquid immersion media 失效
标题翻译：两层液浸介质的光学监测与控制
公开(公告)号：US07065427B1
公开(公告)日：2006-06-20
申请号：US10979367
申请日：2004-11-01
申请人： Srikanteswara Dakshina-Murthy , Bhanwar Singh , Ramkumar Subramanian , Bharath Rangarajan , Khoi A. Phan
发明人： Srikanteswara Dakshina-Murthy , Bhanwar Singh , Ramkumar Subramanian , Bharath Rangarajan , Khoi A. Phan
IPC分类号： G06F19/00 , G02B7/00 , H01L21/00
CPC分类号： G03F7/7085 , G03F7/70341 , G03F7/70591
摘要： A multi-layer immersion medium monitoring system for a lithographic process monitors characteristics of an immersion medium of a semiconductor manufacturing process. The multi-layer immersion medium includes at least a first liquid of a first density (or viscosity) and a second liquid of a lower density (or viscosity), both of which are interspersed between a final optical component and a semiconductor layer. The higher density layer is provided to reduce turbulence in the immersion medium during the lithographic processes. A scatterometry system monitors optical characteristics of the multi-layer immersion medium to effectuate control of a lithographic process.
摘要翻译：用于光刻工艺的多层浸渍介质监测系统监测半导体制造工艺的浸渍介质的特性。多层浸渍介质至少包括第一密度（或粘度）的第一液体和较低密度（或粘度）的第二液体，它们都分散在最终的光学部件和半导体层之间。提供更高密度的层以在光刻过程中减少浸没介质中的湍流。散射测量系统监测多层浸没介质的光学特性，以实现光刻工艺的控制。

3. 发明授权

US07604903B1 Mask having sidewall absorbers to enable the printing of finer features in nanoprint lithography (1XMASK) 有权
标题翻译：具有侧壁吸收器的面罩能够在纳米印刷光刻（1XMASK）中印刷更精细的特征，
公开(公告)号：US07604903B1
公开(公告)日：2009-10-20
申请号：US10768515
申请日：2004-01-30
申请人： Bhanwar Singh , Srikanteswara Dakshina-Murthy , Khoi A. Phan , Bharath Rangarajan , Ramkumar Subramanian
发明人： Bhanwar Singh , Srikanteswara Dakshina-Murthy , Khoi A. Phan , Bharath Rangarajan , Ramkumar Subramanian
IPC分类号： G03F1/00 , G03F1/14
CPC分类号： G03F1/50
摘要： A mask is provided to be used with nanoprint lithography processes to facilitate reproduction of small features required for the production of integrated circuits. A translucent substrate is provided along with one or more three-dimensional features that include one or more vertical sidewalls. An absorbing material is deposited upon one or more of the vertical sidewalls so that light in an incident direction to an upper surface of the substrate will be absorbed by the absorbing material, resulting in light blocking features. One or more horizontal surfaces are formed upon one or more of the three-dimensional features, which allow light rays to exit a lower surface of the substrate unobstructed by the absorbing material.
摘要翻译：提供掩模以与纳米印刷光刻工艺一起使用，以便于再现生产集成电路所需的小特征。提供了一个半透明衬底以及包括一个或多个垂直侧壁的一个或多个三维特征。吸收材料沉积在一个或多个垂直侧壁上，使得在衬底的上表面的入射方向上的光将被吸收材料吸收，导致阻光特征。一个或多个水平表面形成在三维特征中的一个或多个上，这允许光线离开衬底的下表面而不被吸收材料阻挡。

4. 发明授权

US07221060B1 Composite alignment mark scheme for multi-layers in lithography 有权
标题翻译：光刻多层复合对准标记方案
公开(公告)号：US07221060B1
公开(公告)日：2007-05-22
申请号：US11074602
申请日：2005-03-08
申请人： Bhanwar Singh , Khoi A. Phan , Bharath Rangarajan , Iraj Emami , Ramkumar Subramanian
发明人： Bhanwar Singh , Khoi A. Phan , Bharath Rangarajan , Iraj Emami , Ramkumar Subramanian
IPC分类号： H01L23/544
CPC分类号： G03F7/70625 , G03F7/70633 , G03F9/7076 , Y10S438/975
摘要： Systems and/or methods are disclosed for aligning multiple layers of a multi-layer semiconductor device fabrication process and/or system utilizing a composite alignment mark. A component is provided to form the composite alignment mark, such that a first portion of the composite alignment mark is associated with a layer of the wafer and a second portion of the composite alignment mark is associated with a disparate layer of the wafer. An alignment component is utilized to align a reticle for a layer to be patterned to the composite alignment mark.
摘要翻译：公开了用于对准多层半导体器件制造工艺和/或利用复合对准标记的系统的多层的系统和/或方法。提供组件以形成复合对准标记，使得复合对准标记的第一部分与晶片的层相关联，并且复合对准标记的第二部分与晶片的不同层相关联。使用对准部件将待图案化的层的掩模版对准到复合对准标记。

5. 发明授权

US07381278B1 Using supercritical fluids to clean lenses and monitor defects 有权
标题翻译：使用超临界流体清洁镜头并监测缺陷
公开(公告)号：US07381278B1
公开(公告)日：2008-06-03
申请号：US11555564
申请日：2006-11-01
申请人： Ramkumar Subramanian , Bhanwar Singh , Khoi A Phan , Srikanteswara Dakshina-Murthy
发明人： Ramkumar Subramanian , Bhanwar Singh , Khoi A Phan , Srikanteswara Dakshina-Murthy
IPC分类号： G03B27/42
CPC分类号： G03F7/2041 , G03F7/70341 , G03F7/70925
摘要： Disclosed are immersion lithography methods involving irradiating a first photoresist through a lens and an immersion liquid, the immersion liquid contacting the lens and the first photoresist in a first apparatus; contacting the lens with a supercritical fluid in a second apparatus; and irradiating a second photoresist through the lens and an immersion liquid, the immersion liquid contacting the lens and the second photoresist in the first apparatus.
摘要翻译：公开了浸没式光刻方法，包括通过透镜和浸没液体照射第一光致抗蚀剂，浸没液体在第一装置中与透镜和第一光致抗蚀剂接触; 在第二装置中使透镜与超临界流体接触; 以及通过所述透镜和浸没液体照射第二光致抗蚀剂，所述浸没液体与所述透镜和所述第二光致抗蚀剂接触。

6. 发明授权

US07156925B1 Using supercritical fluids to clean lenses and monitor defects 有权
标题翻译：使用超临界流体清洁镜头并监测缺陷
公开(公告)号：US07156925B1
公开(公告)日：2007-01-02
申请号：US10978844
申请日：2004-11-01
申请人： Ramkumar Subramanian , Bhanwar Singh , Khoi A. Phan , Srikanteswara Dakshina-Murthy
发明人： Ramkumar Subramanian , Bhanwar Singh , Khoi A. Phan , Srikanteswara Dakshina-Murthy
IPC分类号： G03B27/42
CPC分类号： G03F7/2041 , G03F7/70341 , G03F7/70925
摘要： Disclosed are immersion lithography methods involving irradiating a first photoresist through a lens and an immersion liquid, the immersion liquid contacting the lens and the first photoresist in a first apparatus; contacting the lens with a supercritical fluid in a second apparatus; and irradiating a second photoresist through the lens and an immersion liquid, the immersion liquid contacting the lens and the second photoresist in the first apparatus.
摘要翻译：公开了浸没式光刻方法，包括通过透镜和浸没液体照射第一光致抗蚀剂，浸没液体在第一装置中与透镜和第一光致抗蚀剂接触; 在第二装置中使透镜与超临界流体接触; 以及通过所述透镜和浸没液体照射第二光致抗蚀剂，所述浸没液体与所述透镜和所述第二光致抗蚀剂接触。

7. 发明授权

US07449348B1 Feedback control of imprint mask feature profile using scatterometry and spacer etchback 有权
标题翻译：使用散射法和间隔蚀刻蚀刻对印迹掩模特征轮廓的反馈控制
公开(公告)号：US07449348B1
公开(公告)日：2008-11-11
申请号：US10858605
申请日：2004-06-02
申请人： Srikanteswara Dakshina-Murthy , Bhanwar Singh , Ramkumar Subramanian , Khoi A. Phan
发明人： Srikanteswara Dakshina-Murthy , Bhanwar Singh , Ramkumar Subramanian , Khoi A. Phan
IPC分类号： H01L21/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , H01L22/12
摘要： The present invention relates generally to photolithographic systems and methods, and more particularly to systems and methodologies that facilitate compensating for retrograde feature profiles on an imprint mask. An aspect of the invention generates feedback information that facilitates control of imprint mask feature profile via employing a scatterometry system to detect retrograde feature profiles, and mitigating the retrograde profiles via a spacer etchback procedure.
摘要翻译：本发明一般涉及光刻系统和方法，更具体地涉及有助于补偿压印掩模上逆行特征轮廓的系统和方法。本发明的一个方面产生反馈信息，其通过使用散射测量系统来检测逆行特征轮廓，以及通过间隔回蚀程序来缓解逆行轮廓，从而有助于控制压印掩模特征轮廓。

8. 发明授权

US06741445B1 Method and system to monitor and control electro-static discharge 失效
标题翻译：监测和控制静电放电的方法和系统
公开(公告)号：US06741445B1
公开(公告)日：2004-05-25
申请号：US10050458
申请日：2002-01-16
申请人： Khoi A. Phan , Bhanwar Singh , Bharath Rangarajan , Ramkumar Subramanian
发明人： Khoi A. Phan , Bhanwar Singh , Bharath Rangarajan , Ramkumar Subramanian
IPC分类号： H01T2300
CPC分类号： H01L21/67253
摘要： A system and methodology is provided for monitoring and controlling static charge during wafer and mask fabrication. The static charge on a target device is monitored. If the static charge becomes too high, corrective actions are taken to reduce the static charge. An antistatic solution is dispensed on the target device. The system and methodology provided reduce damage resulting from electrostatic discharge during fabrication. The system and methodology also reduce delays during fabrication by automatically controlling static charge without the need for manual intervention.
摘要翻译：提供了一种用于在晶片和掩模制造期间监测和控制静电荷的系统和方法。监视目标设备上的静电荷。如果静电荷过高，则采取纠正措施减少静电。抗静电溶液分配在目标装置上。所提供的系统和方法减少了制造过程中静电放电造成的损坏。该系统和方法还通过自动控制静电而减少制造过程中的延迟，而无需人工干预。

9. 发明授权

US06684172B1 Sensor to predict void free films using various grating structures and characterize fill performance 失效
标题翻译：传感器预测使用各种光栅结构的无空隙膜，并表征填充性能
公开(公告)号：US06684172B1
公开(公告)日：2004-01-27
申请号：US10034165
申请日：2001-12-27
申请人： Ramkumar Subramanian , Steven C. Avanzino , Christopher F. Lyons , Khoi A. Phan , Bharath Rangarajan , Bhanwar Singh , Cyrus E. Tabery
发明人： Ramkumar Subramanian , Steven C. Avanzino , Christopher F. Lyons , Khoi A. Phan , Bharath Rangarajan , Bhanwar Singh , Cyrus E. Tabery
IPC分类号： G01L2500
CPC分类号： C23C16/52 , C23C14/547 , C23C18/1675 , C25D21/12 , H01L21/76877
摘要： One aspect of the invention relates to a metal fill process and systems therefor involving providing a standard calibration wafer having a plurality of fill features of known dimensions in a metalization tool; depositing a metal material over the standard calibration wafer; monitoring the deposition of metal material using a sensor system, the sensor system operable to measure one or more fill process parameters and to generate fill process data; controlling the deposition of metal material to minimize void formation using a control system wherein the control system receives fill process data from the sensor system and analyzes the fill process data to generate a feed-forward control data operative to control the metalization tool; and depositing metal material over a production wafer in the metalization tool using the fill process data generated by the sensor system and the control system. The invention further relates to tool characterization processes and systems therefor.
摘要翻译：本发明的一个方面涉及一种金属填充方法及其系统，其涉及在金属化工具中提供具有已知尺寸的多个填充特征的标准校准晶片; 在标准校准晶片上沉积金属材料; 使用传感器系统监测金属材料的沉积，所述传感器系统可操作以测量一个或多个填充过程参数并产生填充过程数据; 控制金属材料的沉积以最小化使用控制系统的空隙形成，其中控制系统从传感器系统接收填充过程数据并分析填充过程数据以产生可操作以控制金属化工具的前馈控制数据; 以及使用由传感器系统和控制系统产生的填充过程数据在金属化工具中的生产晶片上沉积金属材料。本发明还涉及其工具表征过程及其系统。

10. 发明授权

US06594024B1 Monitor CMP process using scatterometry 有权
标题翻译：使用散点法监测CMP过程
公开(公告)号：US06594024B1
公开(公告)日：2003-07-15
申请号：US09886863
申请日：2001-06-21
申请人： Bhanwar Singh , Ramkumar Subramanian , Khoi A. Phan , Bharath Rangarajan , Carmen Morales
发明人： Bhanwar Singh , Ramkumar Subramanian , Khoi A. Phan , Bharath Rangarajan , Carmen Morales
IPC分类号： G01B1128
CPC分类号： B24B37/005 , B24B49/12 , G01N21/47 , G01N21/9501 , H01L21/30625
摘要： One aspect of the present invention relates to an in-line system for monitoring and optimizing an on-going CMP process in order to determine a CMP process endpoint comprising a wafer, wherein the wafer is subjected to the CMP process; a CMP process monitoring system for generating a signature related to wafer dimensions for the wafer subjected to the CMP process; and a signature library to which the generated signature is compared to determine a state of the wafer. Another aspect relates to an in-line method for monitoring and optimizing an on-going CMP process involving providing a wafer, wherein the wafer is subjected to a CMP process; generating a signature associated with the wafer; comparing the generated signature to a signature library to determine a state of the wafer; and using a closed-loop feedback control system for modifying the on-going CMP process according to the determined state of the wafer.
摘要翻译：本发明的一个方面涉及用于监测和优化正在进行的CMP工艺的在线系统，以便确定包括晶片的CMP工艺端点，其中晶片经历CMP工艺; 用于生成与经历CMP处理的晶片的晶片尺寸相关的签名的CMP过程监控系统; 以及生成的签名被比较的签名库，以确定晶片的状态。另一方面涉及用于监测和优化涉及提供晶片的正在进行的CMP工艺的在线方法，其中所述晶片经受CMP工艺; 产生与晶片相关联的签名; 将生成的签名与签名库进行比较以确定晶片的状态; 以及使用闭环反馈控制系统来根据所确定的晶片状态来修正正在进行的CMP工艺。

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