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1. 发明授权

US5263620A Wirebond removal apparatus using alternating fluid stream 失效
标题翻译：使用交替流体流的导线粘合去除装置
公开(公告)号：US5263620A
公开(公告)日：1993-11-23
申请号：US843693
申请日：1992-02-28
申请人： Bernardo Hernandez , Raymond R. Horton , Ismail C. Noyan , Michael J. Palmer , Mark B. Ritter
发明人： Bernardo Hernandez , Raymond R. Horton , Ismail C. Noyan , Michael J. Palmer , Mark B. Ritter
IPC分类号： H01L21/60 , B08B3/02 , B23K1/018 , B26F3/00 , H05K13/04
CPC分类号： H05K13/0486 , B23K1/018 , H01L24/98 , H01L2224/05554 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48011 , H01L2224/48091 , H01L2224/48227 , H01L2224/85201 , H01L24/45 , H01L24/48 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/20752 , Y10T225/10 , Y10T225/30 , Y10T225/329 , Y10T29/49821 , Y10T29/53274
摘要： A method and apparatus for removing wires bonded between chip contact pads and substrate contact pads using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.

2. 发明授权

US5446261A Solder application system using helix to control solder meniscus 失效
标题翻译：焊接应用系统采用螺旋线控制焊料半月板
公开(公告)号：US5446261A
公开(公告)日：1995-08-29
申请号：US148451
申请日：1993-10-26
申请人： Bernardo Hernandez , Raymond R. Horton , Michael J. Palmer , Ismail C. Noyan , Frederick G. Weindelmayer
发明人： Bernardo Hernandez , Raymond R. Horton , Michael J. Palmer , Ismail C. Noyan , Frederick G. Weindelmayer
IPC分类号： B23K3/03 , H05B3/42
CPC分类号： B23K3/03
摘要： A soldering tip overcomes the gravitational effects on molten solder and supplies a large molten solder sphere for contact with a surface to which solder is to be applied. A conical or cylindrical spiral or helix of solder-wettable material, preferably in the form of a compressional spring is attached to the soldering tip with the central axis of the helix aligned with the axis of the soldering tip, preferably by welding. Solder supplied to the soldering tip flows between the coils of the helix and forms a meniscus at the lower end of the helix so that only the molten solder meniscus touches the surface during application of solder. The increased surface tension acts to overcome gravitational effects and assures a more even flow of solder to the surface.
摘要翻译：焊接头克服了对熔融焊料的重力影响，并提供了一个大的熔融焊球，用于与要施加焊料的表面接触。焊料可润湿材料的圆锥形或圆柱形螺旋或螺旋，优选为压缩弹簧形式，优选通过焊接，将螺旋的中心轴线与烙铁头的轴线对准，从而将烙铁头连接到烙铁头。提供给焊接头的焊料在螺旋线圈之间流动，并在螺旋的下端形成弯液面，使得在施加焊料期间仅熔融的焊料弯月面接触表面。增加的表面张力起到克服重力作用的作用，并确保焊料更均匀地流向表面。

3. 发明授权

US5244143A Apparatus and method for injection molding solder and applications thereof 失效
标题翻译：注射成型焊料的设备和方法及其应用
公开(公告)号：US5244143A
公开(公告)日：1993-09-14
申请号：US869676
申请日：1992-04-16
申请人： Thomas G. Ference , Peter A. Gruber , Bernardo Hernandez , Michael J. Palmer , Arthur R. Zingher
发明人： Thomas G. Ference , Peter A. Gruber , Bernardo Hernandez , Michael J. Palmer , Arthur R. Zingher
IPC分类号： B23K3/00 , B23K1/20 , B23K3/06 , B29C45/00 , H05K3/34
CPC分类号： B23K3/0607 , B23K1/20 , H05K3/3468 , B23K2201/40 , H01L2224/11003 , H01L2224/111 , H05K2201/10734 , H05K2203/0113 , H05K2203/0338 , H05K2203/128
摘要： An apparatus and method are described for injection molding solder mounds onto electronic devices. The apparatus has a reservoir for molten solder which is disposed over a cavity in an injection plate. The injection plate is disposed over a mold having an array of cavities therein into which solder in injection molded. The mold is disposed over a workpiece, such as a semiconductor chip or a semiconductor chip packaging substrate. The cavities in the mold are aligned with electrical contact locations on the chip or substrate. The workpiece is heated and the molten solder is forced under gas pressure into the cavity in the injection plate disposed above the array of cavities in the mold. The molten solder is forced into the array of cavities in the mold. The injection plate is advanced to slide over the mold to wipe away the excess solder above the mold at a plurality of wiping apertures in the injection plate. The injection plate is further advanced to a location having a nonsolder wettable surface at which location the injection plate is removed. The mold is then removed to leave solder mounds disposed on the workpiece. The workpiece can be a semiconductor chip, a semiconductor chip packaging substrate or a dummy substrate onto which the injected molded solder adheres such as a polymer layer to form a carrier substrate for a solder mound array which can be subsequently transferred to a substrate such as a semiconductor chip or a semiconductor chip packaging substrate. The apparatus and methods of the present invention can be integrated into an automated manufacturing system for depositing an array of solder mounds onto a substrates.

4. 发明授权

US5915462A High efficiency thermal interposer 失效
标题翻译：高效热插入器
公开(公告)号：US5915462A
公开(公告)日：1999-06-29
申请号：US851656
申请日：1997-05-06
申请人： Bernardo Hernandez , Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer
发明人： Bernardo Hernandez , Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer
IPC分类号： H01L21/60 , B23K20/02 , F28F9/20 , F28F13/00 , F28F7/00 , B23K1/12
CPC分类号： B23K20/025 , B23K20/023 , F28F13/00 , F28F9/20 , H01L2924/0002
摘要： A high efficiency thermal interposer comprising a first hollow disk and second hollow disk, held together by thermally isolating fasteners. The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk; but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means for introducing cold jets of air into the cavity containing the particles, means for circulating the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.
摘要翻译：一种高效热插入件，包括第一中空盘和第二中空盘，通过热隔离紧固件保持在一起。紧固件保持磁盘彼此接触。在本发明的说明性实施例中，第一盘是低温盘部分，第二盘是隔热板的高温盘部分。此外，根据本发明的优选实施例，盘之间的空间填充有与高温盘热接触的小导热颗粒（例如不锈钢球）; 但不与低温盘接触。热插入器/隔热罩包括用于将冷空气引入到容纳颗粒的空腔中的装置，用于使空气循环的装置，以及空气可以从腔排出以携带从颗粒内部吸收的热量的装置空腔。新型热插入器具有质量低，紧凑，并且可以实现温度下降，这将允许高功率HAT装置与温度敏感的电子定向装置（例如机器人臂）结合使用。

5. 发明授权

US5669437A High efficiency thermal interposer 失效
标题翻译：高效热插入器
公开(公告)号：US5669437A
公开(公告)日：1997-09-23
申请号：US172674
申请日：1993-12-22
申请人： Bernardo Hernandez , Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer
发明人： Bernardo Hernandez , Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer
IPC分类号： H01L21/60 , B23K20/02 , F28F9/20 , F28F13/00 , F28F7/00 , B23K1/12
CPC分类号： B23K20/025 , B23K20/023 , F28F13/00 , F28F9/20 , H01L2924/0002
摘要： A high efficiency thermal interposer comprising a first hollow disk and second hollow disk, held together by thermally isolating fasteners. The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk; but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means for introducing cold jets of air into the cavity containing the particles, means for circulating the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.
摘要翻译：一种高效热插入件，包括第一中空盘和第二中空盘，通过热隔离紧固件保持在一起。紧固件保持磁盘彼此接触。在本发明的说明性实施例中，第一盘是低温盘部分，第二盘是隔热板的高温盘部分。此外，根据本发明的优选实施例，盘之间的空间填充有与高温盘热接触的小导热颗粒（例如不锈钢球）; 但不与低温盘接触。热插入器/隔热罩包括用于将冷空气引入到容纳颗粒的空腔中的装置，用于使空气循环的装置，以及空气可以从腔排出以携带从颗粒内部吸收的热量的装置空腔。新型热插入器具有质量低，紧凑，并且可以实现温度下降，这将允许高功率HAT装置与温度敏感的电子定向装置（例如机器人臂）结合使用。

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