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    • 4. 发明授权
    • Structure of phase shifting mask
    • 相移掩模的结构
    • US06866967B2
    • 2005-03-15
    • US10190197
    • 2002-07-03
    • Benjamin Szu-Min Lin
    • Benjamin Szu-Min Lin
    • G03F1/00G03F1/32G03F1/36G03F9/00
    • G03F1/32
    • A phase shifting mask is disclosed in this present invention. The above-mentioned phase shifting mask comprises a quartz layer and a plurality of transmission adjustor layer onto the quartz layer. By employing the above-mentioned phase shifting mask, the material of the transmission adjustors has not to be changed with the light source. Furthermore, the contrast of the phase shifting mask of this invention is better than the contrast of the binary mask and the half-tone mask in the prior art. Therefore, this invention provides a more efficient mask, and the phase shifting mask according to this present invention can improve the resolution in photolithography.
    • 在本发明中公开了一种相移掩模。 上述相移掩模包括石英层和在石英层上的多个透射调节层。 通过采用上述相移掩模,传输调节器的材料不会随着光源而改变。 此外,本发明的相移掩模的对比度优于现有技术中二进制掩模和半色调掩模的对比度。 因此,本发明提供了更有效的掩模,根据本发明的相移掩模可以提高光刻中的分辨率。
    • 5. 发明授权
    • Method of forming a multi-layer photo mask
    • 形成多层光罩的方法
    • US06296974B1
    • 2001-10-02
    • US09391321
    • 1999-09-08
    • Benjamin Szu-Min Lin
    • Benjamin Szu-Min Lin
    • G03P900
    • G03F7/0035G03F1/58
    • This invention provides a method of forming a multi-layer photo mask on a photo mask substrate. A first transparent layer comprising at least one vertical side wall is formed on at least one predetermined area of the photo mask substrate. A first opaque spacer is formed around the vertical side wall of the first transparent layer, and the top side of the first spacer is approximately leveled off with the upper surface of the first transparent layer. An external transparent layer is formed on the photo mask substrate and outside the predetermined area, and the upper surface of the external transparent layer is leveled off with that of the first transparent layer. So the first transparent layer and the external transparent layer form a first photo mask layer. A second transparent layer comprising at least one vertical side wall is formed on at least one predetermined area of the first photo mask layer. A second opaque spacer is formed around the vertical side wall of the second transparent layer, and the top side of the second spacer is approximately leveled off with the upper surface of the second transparent layer.
    • 本发明提供了在光掩模基板上形成多层光掩膜的方法。 包括至少一个垂直侧壁的第一透明层形成在光掩模基板的至少一个预定区域上。 在第一透明层的垂直侧壁周围形成第一不透明间隔物,并且第一间隔物的顶侧与第一透明层的上表面几乎平齐。 在光掩模基板上形成外部透明层,在规定区域外形成外部透明层,外部透明层的上表面与第一透明层的上表面平齐。 因此,第一透明层和外部透明层形成第一光掩模层。 包括至少一个垂直侧壁的第二透明层形成在第一光掩模层的至少一个预定区域上。 在第二透明层的垂直侧壁周围形成第二不透明间隔物,并且第二间隔物的顶侧与第二透明层的上表面大致平齐。
    • 6. 发明授权
    • Method of forming a node contact of a DRAM's memory cell
    • 形成DRAM存储单元的节点接触的方法
    • US06187669B1
    • 2001-02-13
    • US09391326
    • 1999-09-08
    • Jung-Chao ChiouBenjamin Szu-Min Lin
    • Jung-Chao ChiouBenjamin Szu-Min Lin
    • H01L214763
    • H01L27/10855H01L21/76897H01L27/0207H01L27/10885
    • This invention provides a method of forming a node contact with self-alignment on a semiconductor wafer. The wafer comprises a substrate, a dielectric layer, and a first and a second bit lines. A first side wall of the first bit line is adjacent to a second side wall of the second bit line and comprises a first region and two second regions adjacent to the first region. The distance between the first region and the second side wall is greater than a predetermined value and the distance between the two second regions and the second side wall is less than the predetermined value. A second insulating layer is formed on the dielectric layer and two bit lines to form a groove over the gap between the first region and the second side wall. A first anisotropic etching is performed to extend the bottom of the groove down to the dielectric layer. The remaining second insulating layer around the groove forms a spacer, and the remaining second insulating layer in the gaps between the two second regions and the second side wall still completely covers the surface of the two gaps. A second anisotropic etching process is performed to remove the dielectric layer at the bottom of the groove in a vertical direction down to the substrate so as to form the node contact.
    • 本发明提供一种在半导体晶片上形成具有自对准的节点接触的方法。 晶片包括衬底,电介质层以及第一和第二位线。 第一位线的第一侧壁与第二位线的第二侧壁相邻并且包括与第一区域相邻的第一区域和两个第二区域。 第一区域和第二侧壁之间的距离大于预定值,并且两个第二区域和第二侧壁之间的距离小于预定值。 第二绝缘层形成在电介质层和两个位线之间以在第一区域和第二侧壁之间的间隙上形成沟槽。 执行第一各向异性蚀刻以将凹槽的底部向下延伸到电介质层。 围绕凹槽的剩余的第二绝缘层形成间隔物,并且在两个第二区域和第二侧壁之间的间隙中的剩余的第二绝缘层仍完全覆盖两个间隙的表面。 进行第二种各向异性蚀刻工艺以在垂直方向上去除凹槽底部的电介质层,以便形成节点接触。
    • 7. 发明授权
    • Photolithography technique utilizing alignment marks at scribe line
intersections
    • 光刻技术利用划线交点处的对准标记
    • US6071656A
    • 2000-06-06
    • US349209
    • 1999-07-07
    • Benjamin Szu-Min Lin
    • Benjamin Szu-Min Lin
    • G03F9/00
    • G03F9/7084
    • A photolithography technique. A chip has latitudinal scribe lines and longitudinal scribe lines and also has a plurality of alignment marks. The latitudinal scribe lines and longitudinal scribe lines divide the chip into a plurality of dies. Some dies are effective dies. Alignment marks are located at each intersection of the latitudinal and longitudinal scribe lines. Each shot contains a plurality of dies. A mask having a plurality of mask alignment marks is provided. The mask alignment marks are used for alignment with alignment marks in the chip. The alignment marks of the chip are aligned with the mask alignment marks of the mask. At least three alignment marks close to the effective dies in the shots are selected for detection a focus and focal plane of each shot, so as to level the shot and perform an exposure step on each shot, shot by shot.
    • 光刻技术。 芯片具有纬向划痕线和纵向划痕线,并且还具有多个对准标记。 横向划痕线和纵向划痕线将芯片分成多个模具。 一些死亡是有效的死亡。 对准标记位于纬向和纵向划线的每个交叉处。 每个镜头包含多个模具。 提供具有多个掩模对准标记的掩模。 掩模对准标记用于与芯片中的对准标记对准。 芯片的对准标记与掩模的掩模对准标记对准。 选择靠近射击中的有效管芯的至少三个对准标记用于检测每个镜头的焦点和焦平面,以便对镜头进行调平,并对每个镜头执行曝光步骤。
    • 9. 发明授权
    • Structure of a phase shifting mask and method of fabricating the same
    • 相移掩模的结构及其制造方法
    • US6007950A
    • 1999-12-28
    • US84765
    • 1998-05-26
    • Benjamin Szu-Min Lin
    • Benjamin Szu-Min Lin
    • G03F1/30G03F9/00
    • G03F1/30
    • A method for fabricating an alternating phase shifting mask includes a transparent substrate, a number of oblique layers formed on the transparent substrate, and a number of embedded phase shift layers inside the transparent substrate. Then, a photolithography process is applied to form a photoresist layer on the transparent substrate corresponding to a desired pattern and, therefore, exposing a portion of the transparent substrate. Then, an ion implantation process utilizing the photoresist layer as a mask is applied to form the embedded phase shift layers and the photoresist layer is removed after ion implantation. The embedded phase shift layers are formed in alternating positions in the transparent portion between the oblique layers.
    • 交替移相掩模的制造方法包括透明基板,在透明基板上形成的多个倾斜层,以及透明基板内部的多个嵌入式相移层。 然后,应用光刻工艺在透明衬底上形成对应于所需图案的光致抗蚀剂层,因此暴露透明衬底的一部分。 然后,使用利用光致抗蚀剂层作为掩模的离子注入工艺以形成嵌入式相移层,并且在离子注入之后去除光致抗蚀剂层。 嵌入式相移层形成在倾斜层之间的透明部分中的交替位置。