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1. 发明申请

US20180035689A1 Method and Apparatus for Partitioning a Material 审中-公开
公开(公告)号：US20180035689A1
公开(公告)日：2018-02-08
申请号：US15641255
申请日：2017-07-04
申请人： Benjamin P. Warner , Francesco de Rege Thesauro
发明人： Benjamin P. Warner , Francesco de Rege Thesauro
IPC分类号： A23G3/32 , A23P30/20
CPC分类号： A23G3/32 , A23P30/20 , A23P2020/253 , B29C48/02 , B29C48/865 , B29C48/872 , B29C48/92 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y70/00
摘要： Methods and apparatus are described for the partitioning of difficult to handle materials such as viscous and sticky materials. The partitioning is accomplished accurately and precisely using an apparatus to extrude the material in portions on or in receptacles disposed on a stage.

2. 发明申请

US20180141277A1 Method and Apparatus for Partitioning a Material 审中-公开
公开(公告)号：US20180141277A1
公开(公告)日：2018-05-24
申请号：US15706719
申请日：2017-09-17
申请人： Benjamin P. Warner , Francesco de Rege Thesauro
发明人： Benjamin P. Warner , Francesco de Rege Thesauro
IPC分类号： B29C64/30 , B33Y50/02 , B29C64/124 , B29C64/209
CPC分类号： B29C64/30 , B29C64/124 , B29C64/209 , B29C64/245 , B29C64/40 , B33Y30/00 , B33Y50/02 , G05B2219/36416
摘要： Methods and apparatus are described for depositing materials at a precise location. The deposition is accomplished by using CNC control and a nozzle guide.

3. 发明申请

US20170361525A1 Method and Apparatus for Partitioning a Material 审中-公开
公开(公告)号：US20170361525A1
公开(公告)日：2017-12-21
申请号：US15619448
申请日：2017-06-10
申请人： Benjamin P. Warner , Francesco de Rege Thesauro
发明人： Benjamin P. Warner , Francesco de Rege Thesauro
IPC分类号： B29C64/112 , A61K9/70 , B33Y10/00 , B33Y70/00 , A61K31/352 , A61K36/185
CPC分类号： B29C64/112 , A61K9/006 , A61K9/148 , A61K9/703 , A61K31/352 , A61K36/185 , A61K2236/00 , B33Y10/00 , B33Y70/00
摘要： Methods and apparatus are described for the partitioning of difficult to handle materials such as viscous and sticky materials. The partitioning is accomplished accurately and precisely using an apparatus to extrude the material in portions on or in receptacles disposed on a stage.

4. 发明申请

US20050211950A1 Chemical-mechanical polishing composition and method for using the same 审中-公开
标题翻译：化学机械抛光组合物及其使用方法
公开(公告)号：US20050211950A1
公开(公告)日：2005-09-29
申请号：US10807944
申请日：2004-03-24
申请人： Francesco de Rege Thesauro , Kevin Moeggenborg , Vlasta Brusic , Benjamin Bayer
发明人： Francesco de Rege Thesauro , Kevin Moeggenborg , Vlasta Brusic , Benjamin Bayer
IPC分类号： C09G1/02 , H01L21/321 , C09K13/00 , B44C1/22 , H01L21/302
CPC分类号： C09G1/02
摘要： The invention provides a chemical-mechanical polishing composition comprising: (a) an abrasive comprising α-alumina, (b) about 0.05 to about 50 mmol/kg of ions of at least one metal selected from the group consisting of calcium, strontium, barium, and mixtures thereof, based on the total weight of the polishing composition, and (c) a liquid carrier comprising water. The invention also provides a chemical-mechanical polishing composition comprising: (a) an abrasive selected from the group consisting of α-alumina, γ-alumina, δ-alumina, θ-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of at least one metal selected from the group consisting of calcium, strontium, barium, magnesium, zinc, and mixtures thereof, based on the total weight of the polishing composition, and (c) a liquid carrier comprising water. The invention further provides methods of polishing a substrate using each of the above-described chemical-mechanical polishing compositions.
摘要翻译：本发明提供一种化学机械抛光组合物，其包括：（a）包含α-氧化铝的磨料，（b）约0.05至约50mmol / kg的选自钙，锶，钡中的至少一种金属的离子，及其混合物，基于抛光组合物的总重量，和（c）包含水的液体载体。本发明还提供一种化学机械抛光组合物，其包含：（a）选自α-氧化铝，γ-氧化铝，δ-氧化铝，θ-氧化铝，金刚石，碳化硼，碳化硅，碳化钨，氮化钛及其混合物，（b）基于总重量，约0.05至约3.5mmol / kg的选自钙，锶，钡，镁，锌及其混合物的至少一种金属的离子的抛光组合物，和（c）包含水的液体载体。本发明还提供了使用上述每种化学 - 机械抛光组合物抛光基材的方法。

5. 发明申请

US20090152240A1 CHEMICAL-MECHANICAL POLISHING COMPOSITION AND METHOD FOR USING THE SAME 有权
标题翻译：化学机械抛光组合物及其使用方法
公开(公告)号：US20090152240A1
公开(公告)日：2009-06-18
申请号：US12393489
申请日：2009-02-26
申请人： Francesco de Rege Thesauro , Kevin J. Moeggenborg , Vlasta Brusic , Benjamin P. Bayer
发明人： Francesco de Rege Thesauro , Kevin J. Moeggenborg , Vlasta Brusic , Benjamin P. Bayer
IPC分类号： B44C1/22
CPC分类号： C09G1/02
摘要： The invention provides methods of polishing a noble metal-containing substrate with one of two chemical-mechanical polishing compositions. The first chemical-mechanical polishing composition comprises (a) an abrasive comprising α-alumina, (b) about 0.05 to about 50 mmol/kg of ions of calcium, strontium, barium, or mixtures thereof, and (c) a liquid carrier comprising water. The second chemical-mechanical polishing composition comprises (a) an abrasive selected from the group consisting of α-alumina, γ-alumina, δ-alumina, θ-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of calcium, strontium, barium, magnesium, zinc, or mixtures thereof, and (c) a liquid carrier comprising water.
摘要翻译：本发明提供了用两种化学机械抛光组合物之一抛光含贵金属的基材的方法。第一化学机械抛光组合物包含（a）包含α-氧化铝的磨料，（b）约0.05至约50mmol / kg的钙，锶，钡或其混合物的离子，和（c）液体载体，水。第二化学机械抛光组合物包含（a）选自α-氧化铝，γ-氧化铝，δ-氧化铝，θ-氧化铝，金刚石，碳化硼，碳化硅，碳化钨，氮化钛和其混合物，（b）约0.05-约3.5mmol / kg的钙，锶，钡，镁，锌或其混合物的离子，和（c）包含水的液体载体。

6. 发明授权

US08101093B2 Chemical-mechanical polishing composition and method for using the same 有权
标题翻译：化学机械抛光组合物及其使用方法
公开(公告)号：US08101093B2
公开(公告)日：2012-01-24
申请号：US12393489
申请日：2009-02-26
申请人： Francesco de Rege Thesauro , Kevin J. Moeggenborg , Vlasta Brusic , Benjamin P. Bayer
发明人： Francesco de Rege Thesauro , Kevin J. Moeggenborg , Vlasta Brusic , Benjamin P. Bayer
IPC分类号： C03C15/00
CPC分类号： C09G1/02
摘要： The invention provides methods of polishing a noble metal-containing substrate with one of two chemical-mechanical polishing compositions. The first chemical-mechanical polishing composition comprises (a) an abrasive comprising α-alumina, (b) about 0.05 to about 50 mmol/kg of ions of calcium, strontium, barium, or mixtures thereof, and (c) a liquid carrier comprising water. The second chemical-mechanical polishing composition comprises (a) an abrasive selected from the group consisting of α-alumina, γ-alumina, δ-alumina, θ-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of calcium, strontium, barium, magnesium, zinc, or mixtures thereof, and (c) a liquid carrier comprising water.
摘要翻译：本发明提供了用两种化学机械抛光组合物之一抛光含贵金属的基材的方法。第一化学机械抛光组合物包含（a）包含α-氧化铝的磨料，（b）约0.05至约50mmol / kg的钙，锶，钡或其混合物的离子，和（c）液体载体，水。第二化学机械抛光组合物包含（a）选自α-氧化铝，γ-氧化铝，δ-氧化铝，氧化铝，氧化铝，金刚石，碳化硼，碳化硅，碳化钨，氮化钛，（b）约0.05至约3.5mmol / kg的钙，锶，钡，镁，锌或其混合物的离子，和（c）包含水的液体载体。

7. 发明授权

US07563383B2 CMP composition with a polymer additive for polishing noble metals 有权
标题翻译：具有用于抛光贵金属的聚合物添加剂的CMP组合物
公开(公告)号：US07563383B2
公开(公告)日：2009-07-21
申请号：US10963108
申请日：2004-10-12
申请人： Francesco de Rege Thesauro , Benjamin P. Bayer
发明人： Francesco de Rege Thesauro , Benjamin P. Bayer
IPC分类号： C03C15/00 , C03C25/68
CPC分类号： C09G1/02 , H01L21/3212 , H01L28/65
摘要： The invention provides a method of polishing a substrate comprising contacting a substrate comprising a noble metal on a surface of the substrate with a chemical-mechanical polishing system comprising (a) a polishing component selected from the group consisting of an abrasive, a polishing pad, and a combination thereof, (b) an oxidizing agent, (c) an ethylene-oxide containing polymer, and (d) a liquid carrier, and abrading at least a portion of the noble metal with the chemical-mechanical polishing system to polish the substrate.
摘要翻译：本发明提供一种抛光衬底的方法，包括将包含贵金属的衬底与衬底表面接触的化学机械抛光系统，该系统包括：（a）抛光组分，其选自磨料，抛光垫，及其组合，（b）氧化剂，（c）含环氧乙烷的聚合物和（d）液体载体，并用化学 - 机械抛光系统研磨至少一部分贵金属以抛光基质。

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