专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050040540A1 Microelectronic assemblies with springs 有权
标题翻译：带弹簧的微电子组件
公开(公告)号：US20050040540A1
公开(公告)日：2005-02-24
申请号：US10901407
申请日：2004-07-28
申请人： Belgacem Haba , Jae Park , Teck-Gyu Kang , Nicholas Colella
发明人： Belgacem Haba , Jae Park , Teck-Gyu Kang , Nicholas Colella
IPC分类号： H01L21/60 , H01L23/48
CPC分类号： H01L24/16 , H01L24/11 , H01L24/12 , H01L24/81 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/13655 , H01L2224/81143 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4913 , H01L2924/00015 , H01L2924/00014 , H01L2224/13099
摘要： A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding the distal ends of the springs, remote from the microelectronic element, to the panel. The springs can also serve as antennas so as to provide a miniaturized phased array.
摘要翻译：诸如半导体芯片的微电子元件具有弹簧，例如键合到触点的螺旋弹簧，使得弹簧用作与电路板的电连接。该单元可以容易地测试，并且可以通过将远离微电子元件的弹簧的远端粘合到面板上而被表面安装到电路板。弹簧也可以用作天线，以便提供小型化的相控阵列。

2. 发明申请

US20080003402A1 Fine pitch microcontacts and method for forming thereof 有权
标题翻译：细间距微接触及其形成方法
公开(公告)号：US20080003402A1
公开(公告)日：2008-01-03
申请号：US11717587
申请日：2007-03-13
申请人： Belgacem Haba , Yoichi Kubota , Teck-Gyu Kang , Jae Park
发明人： Belgacem Haba , Yoichi Kubota , Teck-Gyu Kang , Jae Park
IPC分类号： C23F1/00 , B32B7/00
CPC分类号： H01L24/14 , H01L21/4828 , H01L21/4853 , H01L21/563 , H01L23/49811 , H01L24/11 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13099 , H01L2224/16225 , H01L2224/73203 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H05K3/061 , H05K3/4007 , H05K2201/0367 , H05K2203/0369 , H05K2203/0597 , H05K2203/1476 , Y10T29/49126 , Y10T428/24174 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method includes applying a final etch-resistant material to an in-process substrate so that the final etch-resistant material at least partially covers first microcontact portions integral with the substrate and projecting upwardly from a surface of the substrate, and etching the surface of the substrate so as to leave second microcontact portions below the first microcontact portions and integral therewith, the final etch-resistant material at least partially protecting the first microcontact portions from etching during the further etching step. A microelectronic unit includes a substrate, and a plurality of microcontacts projecting in a vertical direction from the substrate, each microcontact including a base region adjacent the substrate and a tip region remote from the substrate, each microcontact having a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region.
摘要翻译：一种方法包括将最终的耐蚀刻材料施加到工艺衬底，使得最终耐蚀刻材料至少部分地覆盖与衬底成一体的第一微接触部分并从衬底的表面向上突出，并且蚀刻表面衬底，以便将第二微接触部分留在第一微接触部分下方并与之成一体，最后的抗蚀刻材料在另外的蚀刻步骤期间至少部分地保护第一微接触部分免受蚀刻。微电子单元包括衬底以及从衬底沿垂直方向突出的多个微接点，每个微接触器包括邻近衬底的基极区域和远离衬底的尖端区域，每个微接触体具有作为第一功能的水平尺寸在基部区域中垂直位置，并且其是尖端区域中垂直位置的第二函数。

3. 发明申请

US20050279916A1 Image sensor package and fabrication method 有权
标题翻译：图像传感器封装及制作方法
公开(公告)号：US20050279916A1
公开(公告)日：2005-12-22
申请号：US11120711
申请日：2005-05-03
申请人： Teck-Gyu Kang , Michael Estrella , Jae Park , Kenneth Thompson , Craig Mitchell , Belgacem Haba
发明人： Teck-Gyu Kang , Michael Estrella , Jae Park , Kenneth Thompson , Craig Mitchell , Belgacem Haba
IPC分类号： H01L27/00 , H01L27/146 , H01L31/0203 , H04N5/225
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73253 , H01L2924/07811 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H04M2250/52 , H04N5/2253 , H01L2224/16225 , H01L2924/00012 , H01L2924/00
摘要： An image sensor package is disclosed that reduces the overall size of known image sensor packages. The image sensor package includes an image sensor and image sensor controller that are arranged on a substrate so that the surfaces of the image sensor and image sensor controller are directly adjacent one another. A package in accordance with the present invention reduces the amount of space in the package by allowing at least one surface of the image sensor controller and at least one surface of the image sensor to be directly attached or connected to one another. Electrical conductive material in the nature of anisotropic conductive materials is also preferably applied to the substrate in the form of an adhesive layer to allow for the image sensor controller and the image sensor to be in electrical communication with one another.
摘要翻译：公开了一种降低已知图像传感器封装的总体尺寸的图像传感器封装。图像传感器封装包括图像传感器和图像传感器控制器，其布置在基板上，使得图像传感器和图像传感器控制器的表面彼此直接相邻。根据本发明的包装通过允许图像传感器控制器的至少一个表面和图像传感器的至少一个表面直接附接或彼此连接来减少包装中的空间量。各向异性导电材料性质的导电材料也优选以粘合剂层的形式施加到基底上，以允许图像传感器控制器和图像传感器彼此电连通。

4. 发明申请

US20050284658A1 Components with posts and pads 有权
标题翻译：具有柱和垫的组件
公开(公告)号：US20050284658A1
公开(公告)日：2005-12-29
申请号：US11166982
申请日：2005-06-24
申请人： Yoichi Kubota , Teck-Gyu Kang , Jae Park , Belgacem Haba
发明人： Yoichi Kubota , Teck-Gyu Kang , Jae Park , Belgacem Haba
IPC分类号： H01L23/13 , H01L23/31 , H01L23/498 , H01L25/065 , H05K1/11 , H05K3/06 , H05K3/40
CPC分类号： H05K1/0366 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/48091 , H01L2224/4824 , H01L2224/49175 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H05K3/06 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2203/063 , H05K2203/0733 , Y10T29/49126 , Y10T29/49156 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
摘要翻译：封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48））暴露在介电层的外表面处，焊盘通过迹线连接到柱。电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。还公开了制造连接部件的方法。

5. 发明申请

US20060038542A1 Solid state lighting device 审中-公开
标题翻译：固态照明装置
公开(公告)号：US20060038542A1
公开(公告)日：2006-02-23
申请号：US10887986
申请日：2004-07-09
申请人： Jae Park , Teck-Gyu Kang
发明人： Jae Park , Teck-Gyu Kang
IPC分类号： G05F1/613
CPC分类号： H05B33/0821 , H01L2224/04042 , H01L2224/16145 , H01L2224/48227 , H01L2224/48465 , H01L2924/01322 , H01L2924/12032 , H01L2924/13091 , H01L2924/3011 , H05B33/0803 , H05B33/0815 , Y02B20/347 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A light assembly for use with a low voltage power source. The light assembly semiconductor photo-emitters are electrically in series with a higher forward voltage drop than the associated low voltage power supply. To provide the necessary voltage the light assembly includes a current regulated step-up DC/DC converter. The semiconductor photo-emitters that are electrically in series are in the form of a monolithic light emitting diode array with a plurality of light emitting diode elements electrically and mechanically in series with a conductive, rigid bond region between the cathode region of the first light emitting diode element and the anode region of the second light emitting diode element. The first and second light emitting diode elements may differ in band gaps to emit different colors, that are additive to a non-primary color, such as white.
摘要翻译：用于低压电源的灯组件。光组件半导体光发射器与相关联的低压电源相比具有更高的正向压降的串联电。为了提供必要的电压，灯组件包括电流调节的升压DC / DC转换器。电串联的半导体光发射器是单片发光二极管阵列的形式，其具有多个发光二极管元件，电子和机械地与第一发光的阴极区域之间的导电刚性接合区域串联二极管元件和第二发光二极管元件的阳极区域。第一和第二发光二极管元件可以在带隙上不同以发射不同于不是原色（例如白色）的颜色。

6. 发明申请

US20070096160A1 High frequency chip packages with connecting elements 审中-公开
公开(公告)号：US20070096160A1
公开(公告)日：2007-05-03
申请号：US11640765
申请日：2006-12-18
申请人： Masud Beroz , Michael Warner , Lee Smith , Glenn Urbish , Teck-Gyu Kang , Jae Park , Yoichi Kubota
发明人： Masud Beroz , Michael Warner , Lee Smith , Glenn Urbish , Teck-Gyu Kang , Jae Park , Yoichi Kubota
IPC分类号： H01L27/148
摘要： A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame incorporating a large thermally-conductive plate and leads projecting upwardly from the plane of the plate. The assembly step places the rear surfaces of the chips on the bottom side of the connecting element into proximity with the thermal conductor and joins the conductive traces on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board. The leads provide robust electrical connections between the connecting element and the circuit board.

7. 发明申请

US20060223227A1 Molding method for foldover package 审中-公开
标题翻译：成型包装方法
公开(公告)号：US20060223227A1
公开(公告)日：2006-10-05
申请号：US11098650
申请日：2005-04-04
申请人： Yoichi Kubota , Ellis Chau , Teck-Gyu Kang , Jae Park
发明人： Yoichi Kubota , Ellis Chau , Teck-Gyu Kang , Jae Park
IPC分类号： H01L21/00
CPC分类号： H01L21/565 , H01L23/3121 , H01L23/5387 , H01L24/48 , H01L25/105 , H01L2224/48091 , H01L2224/48227 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H05K1/189 , H05K3/284 , H05K2201/042 , H05K2203/1316 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of making a microelectronic assembly including the steps of depositing one or more microelectronic elements onto a flexible substrate and folding the substrate so that a first region of the substrate forms a first run and a second region of the substrate forms a second run overlaying the first run. The first run and the second run form a pocket therebetween. While temporarily maintaining the folded structure, providing an encapsulant material into the pocket. The encapsulant material is next cured, so that the cured encapsulant material holds the flexible substrate in the folded state.
摘要翻译：一种制造微电子组件的方法，包括以下步骤：将一个或多个微电子元件沉积到柔性衬底上并折叠衬底，使得衬底的第一区域形成第一行程，并且衬底的第二区域形成覆盖第先跑第一次跑步和第二次跑步形成一个口袋。在暂时保持折叠结构的同时，将密封剂材料提供到口袋中。接着固化密封剂材料，使得固化的密封剂材料将柔性基材保持在折叠状态。

8. 发明申请

US20050133800A1 Solid state lighting device 有权
标题翻译：固态照明装置
公开(公告)号：US20050133800A1
公开(公告)日：2005-06-23
申请号：US11010077
申请日：2004-12-09
申请人： Jae Park , Teck-Gyu Kang
发明人： Jae Park , Teck-Gyu Kang
IPC分类号： F21L4/02 , F21L4/08 , F21S9/02 , H01L25/075 , H01L27/15
CPC分类号： H01L25/0756 , F21L4/027 , F21L4/085 , F21S9/02 , F21Y2115/10 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A light assembly for use with a low voltage power source. The light assembly semiconductor photo-emitters are electrically in series with a higher forward voltage drop than the associated low voltage power supply. To provide the necessary voltage the light assembly includes a current regulated step-up DC/DC converter. The semiconductor photo-emitters that are electrically in series are in the form of a monolithic light emitting diode array with a plurality of light emitting diode elements electrically and mechanically in series with a conductive, rigid bond region between the cathode region of the first light emitting diode element and the anode region of the second light emitting diode element. The first and second light emitting diode elements may differ in band gaps to emit different colors, that are additive to a non-primary color, such as white.
摘要翻译：用于低压电源的灯组件。光组件半导体光发射器与相关联的低压电源相比具有更高的正向压降的串联电。为了提供必要的电压，灯组件包括电流调节的升压DC / DC转换器。电串联的半导体光发射器是单片发光二极管阵列的形式，其具有多个发光二极管元件，电子和机械地与第一发光的阴极区域之间的导电刚性接合区域串联二极管元件和第二发光二极管元件的阳极区域。第一和第二发光二极管元件可以在带隙上不同以发射不同于不是原色（例如白色）的颜色。

9. 发明申请

US20050139984A1 Package element and packaged chip having severable electrically conductive ties 审中-公开
标题翻译：封装元件和封装芯片具有可分离的导电连接
公开(公告)号：US20050139984A1
公开(公告)日：2005-06-30
申请号：US11016034
申请日：2004-12-17
申请人： David Tuckerman , Richard Crisp , Belgacem Haba , Giles Humpston , Jae Park
发明人： David Tuckerman , Richard Crisp , Belgacem Haba , Giles Humpston , Jae Park
IPC分类号： H01L21/00 , H01L21/50 , H01L23/52 , H01L23/60 , H03H9/02 , H03H9/10
CPC分类号： H03H9/1092 , H01L23/60 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H03H9/02921 , H01L2924/00
摘要： According to one aspect of the invention, a capped chip is provided which includes a chip having a front surface, a back surface opposite the front surface and a plurality of bond pads exposed at at least one of the front and back surfaces. A cap is joined to the chip, the cap overlying one of the front and back surfaces of the chip. The cap includes a plurality of contacts which are conductively interconnected to the bond pads, and one or more temporary ties which conductively connect two or more of the contacts. The temporary ties are severable after the contacts are conductively interconnected to the bond pads.
摘要翻译：根据本发明的一个方面，提供了一种封盖芯片，其包括具有前表面，与前表面相对的后表面的芯片和暴露在前表面和后表面中的至少一个上的多个接合焊盘。盖子连接到芯片，盖子覆盖芯片的前表面和后表面之一。盖包括导电地互连到接合焊盘的多个触点，以及一个或多个导电地连接两个或更多个触点的临时连接。在触点与接合垫导电互连之后，临时接头是可分离的。

10. 发明申请

US20050243529A1 Microelectronic connection components having bondable wires 有权
标题翻译：具有可焊接线的微电子连接部件
公开(公告)号：US20050243529A1
公开(公告)日：2005-11-03
申请号：US11111145
申请日：2005-04-21
申请人： Masud Beroz , Jae Park , Belgacem Haba , Fion Tan , Philip Osborn
发明人： Masud Beroz , Jae Park , Belgacem Haba , Fion Tan , Philip Osborn
IPC分类号： H01L21/60 , H01L23/13 , H01L23/31 , H01L23/495 , H01L23/498 , H01R9/00 , H01R12/04 , H05K1/11
CPC分类号： H01L23/13 , H01L23/3114 , H01L23/4951 , H01L23/4952 , H01L23/49811 , H01L23/49816 , H01L24/48 , H01L24/85 , H01L2224/05647 , H01L2224/48091 , H01L2224/48095 , H01L2224/4824 , H01L2224/48463 , H01L2224/48471 , H01L2224/85447 , H01L2924/00014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/19107 , H01L2224/45099 , H01L2924/00
摘要： A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads across the gap. In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads is juxtaposed and transferred to the substrate. The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap may have one end detached and bonded to an underlying chip contact.
摘要翻译：用于半导体芯片的连接部件包括具有间隙的基板，多个平行间隔开的引线延伸。引线的端部通过结合到触点或嵌入基板中而粘附到基板上。在一个实施例中，连接部件可以通过将导线穿过间隙缝合而形成。在另一个实施例中，支撑间隔开的平行引线的预制引线组件并置并转移到衬底。连接部件并置在半导体芯片上，由此在间隙上延伸的引线可以具有一端分离并结合到下面的芯片触点。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式