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    • 4. 发明授权
    • Semiconductor inspection system
    • 半导体检测系统
    • US07235782B2
    • 2007-06-26
    • US10082286
    • 2002-02-26
    • Atsushi TakaneHaruo YodaShoji YoshidaMitsuji IkedaYasuhiko Ozawa
    • Atsushi TakaneHaruo YodaShoji YoshidaMitsuji IkedaYasuhiko Ozawa
    • H01J37/28
    • H01J37/28
    • An operator-free and fully automated semiconductor inspection system with high throughput is realized. All conditions required for capturing and inspection are generated from design information such as CAD data. In order to perform actual inspection under the conditions, a semiconductor inspection system is composed of a navigation system for generating all the conditions required for capturing and inspection from the design information and a scanning electron microscope system for actually performing capturing and inspection. Moreover, in the case of performing a matching process between designed data and a SEM image, deformed parts are corrected by use of edge information in accordance with multiple directions and smoothing thereof. Furthermore, a SEM image corresponding to a detected position is re-registered as a template, and the matching process is thereby performed.
    • 实现了高吞吐量的无操作员和全自动半导体检测系统。 捕获和检查所需的所有条件都是从CAD数据等设计信息生成的。 为了在条件下进行实际检查,半导体检查系统由用于从设计信息产生捕获和检查所需的所有条件的导航系统和用于实际执行捕获和检查的扫描电子显微镜系统组成。 此外,在进行设计数据和SEM图像之间的匹配处理的情况下,通过使用根据多个方向的边缘信息和平滑来校正变形部分。 此外,将与检测位置对应的SEM图像重新登记为模板,由此进行匹配处理。