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    • 6. 发明授权
    • Method for manufacturing semiconductor memory
    • 半导体存储器的制造方法
    • US06333231B1
    • 2001-12-25
    • US09668308
    • 2000-09-25
    • Hiroaki TakahashiMasaru Seto
    • Hiroaki TakahashiMasaru Seto
    • H01L21336
    • H01L27/1126H01L27/112
    • A method for manufacturing read-only memory. In each memory cell on a wafer, a gate electrode 3a is formed on a silicon substrate 1 with an intermediary of a gate oxide film 2, and an oxide film 4 is formed to cover the surface of the silicon substrate. After an inter-layer dielectric film 6 is grown on the oxide film 4 by LPCVD, this inter-layer dielectric film 6 is put to rapid thermal processing at 700° C. to 800° C. for about 60 seconds to remove the water content of the inter-layer dielectric film 6. This eliminates chances of insulation deterioration when semi-finished wafers are put into long-term storage. After the steps just before data writing have been finished, the wafers can be put into long-term storage, so that time from decision of data to write until product completion can be reduced.
    • 一种用于制造只读存储器的方法。 在晶片上的每个存储单元中,在具有栅极氧化膜2的介质的硅衬底1上形成栅电极3a,并且形成氧化物膜4以覆盖硅衬底的表面。 在通过LPCVD在氧化物膜4上生长层间电介质膜6之后,将该层间电介质膜6在700℃〜800℃进行快速热处理约60秒以除去含水量 这消除了半成品晶片长期保存时绝缘劣化的可能性。 在完成数据写入之后的步骤之后,晶片可以进行长期存储,从而可以减少从数据到写入到产品完成的时间。
    • 9. 发明授权
    • Scan program communication method and X-ray CT apparatus
    • 扫描程序通信方法和X射线CT装置
    • US07336762B2
    • 2008-02-26
    • US11179872
    • 2005-07-12
    • Masaru SetoYasushi Sato
    • Masaru SetoYasushi Sato
    • G01N23/00
    • A61B6/032G06F19/00
    • An X-ray CT apparatus includes a host and a scanner that executes a scan based on a scan program communicated from the host by means of communicating means. The X-ray CT apparatus also includes a communicating means which collectively communicate the calculated values of X-ray applied amounts at every scan positions or original data for the calculation of the amount of X-ray application even with respect to unprogrammed scan positions. Each of the calculated values of X-ray applied amounts corresponds to a tube current value of an X-ray tube. The original data for the calculation of the amount of X-ray application corresponds to X-ray penetrated image data of a subject.
    • X射线CT装置包括主机和扫描器,其基于通过通信装置从主机传送的扫描程序执行扫描。 X射线CT装置还包括通信装置,其在每个扫描位置或原始数据中共同传送计算的X射线量值,以用于计算X射线应用量,即使相对于未编程的扫描位置。 X射线施加量的计算值中的每一个对应于X射线管的管电流值。 用于计算X射线应用量的原始数据对应于被摄体的X射线穿透图像数据。
    • 10. 发明申请
    • Semiconductor memory device and method of manufacturing the same
    • 半导体存储器件及其制造方法
    • US20060202260A1
    • 2006-09-14
    • US11364175
    • 2006-03-01
    • Masaru SetoJunya Maneki
    • Masaru SetoJunya Maneki
    • H01L29/788
    • H01L27/11521H01L27/115H01L29/42336H01L29/7881
    • A semiconductor memory device includes: a laminated body which has a floating-gate-forming groove and includes a semiconductor support layer, an impurity diffusion layer, an ion-implantation-damage protection film, and an interlayer insulating film; a floating-gate-insulating film; a floating gate disposed on the floating-gate-insulating film so as to be buried in the floating-gate-forming groove; a control-gate-insulating film disposed on a surface area of the floating gate; and a control gate disposed on the control-gate-insulating film above the floating gate, wherein the floating-gate-insulating film contacts with the semiconductor support layer at the bottom of the floating-gate-forming groove, the floating-gate-insulating film contacts with the impurity diffusion layer, the ion-implantation-damage protection film, and the interlayer insulating film at the side wall of the floating-gate-forming groove.
    • 半导体存储器件包括:具有浮栅形成槽并且包括半导体支撑层,杂质扩散层,离子注入损伤保护膜和层间绝缘膜的层叠体; 浮栅绝缘膜; 设置在所述浮栅绝缘膜上以浮置在所述浮栅形成沟槽中的浮置栅极; 设置在所述浮动栅极的表面区域上的控制栅极绝缘膜; 以及控制栅极,其设置在所述浮栅上方的所述控制栅极绝缘膜上,其中所述浮栅绝缘膜与所述浮栅形成槽的底部处的所述半导体支撑层接触,所述浮栅绝缘膜 与杂质扩散层的膜接触,离子注入损伤保护膜和浮栅形成槽的侧壁处的层间绝缘膜。