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1. 发明授权

US06391146B1 Erosion resistant gas energizer 有权
标题翻译：耐腐蚀气体发生器
公开(公告)号：US06391146B1
公开(公告)日：2002-05-21
申请号：US09547423
申请日：2000-04-11
申请人： Ashish Bhatnagar , Kartik Ramaswamy , Tony S. Kaushal , Kwok Manus Wong , Shamouil Shamouilian
发明人： Ashish Bhatnagar , Kartik Ramaswamy , Tony S. Kaushal , Kwok Manus Wong , Shamouil Shamouilian
IPC分类号： H05H100
CPC分类号： C23C16/4412 , B01D53/34 , B01D53/70
摘要： An apparatus and method for reducing hazardous gases exhausted from a process chamber 25 includes an effluent gas treatment system 200 with a gas energizing reactor 210 with an erosion resistant inner surface 280. Optionally, an additive gas source 230 may be provided to introduce additive gas into the gas energizing reactor 210. In one embodiment, the inner surface comprises a fluorine-containing compound. In another embodiment, the inner surface comprises an oxide and a stabilizing agent.
摘要翻译：用于减少从处理室25排出的有害气体的装置和方法包括具有带有耐腐蚀内表面280的气体激励反应器210的废气处理系统200.任选地，可以提供添加气体源230以将添加气体引入气体通电反应器210.在一个实施方案中，内表面包含含氟化合物。在另一个实施方案中，内表面包含氧化物和稳定剂。

2. 发明授权

US06367412B1 Porous ceramic liner for a plasma source 失效
标题翻译：用于等离子体源的多孔陶瓷衬垫
公开(公告)号：US06367412B1
公开(公告)日：2002-04-09
申请号：US09506111
申请日：2000-02-17
申请人： Kartik Ramaswamy , Kwok Manus Wong , Ashish Bhatnagar , Mehran Moalem , Tony S. Kaushal , Shamouil Shamouilian
发明人： Kartik Ramaswamy , Kwok Manus Wong , Ashish Bhatnagar , Mehran Moalem , Tony S. Kaushal , Shamouil Shamouilian
IPC分类号： C23C1600
CPC分类号： H01J37/32495 , B01D53/8662 , B01D2257/2066 , B01D2259/818 , C23C16/4412 , Y02C20/30
摘要： A plasma tube comprising a vacuum sealing ceramic outer tube, a porous ceramic insert disposed on the inside wall of the outer tube, and a source of high frequency radiation, for example, an RF coil wrapped around the tube, to excite gas flowing through the bore of the insert into a plasma. The invention is particularly useful as an exhaust scrubber for oxidizing exhaust gases from a semiconductor processing chamber. A catalyst may be embedded in the porous insert to promote the scrubbing reaction. The invention may also be used in an applicator of a remote plasma source.
摘要翻译：一种等离子体管，包括真空密封陶瓷外管，设置在外管内壁上的多孔陶瓷插入件和高频辐射源，例如缠绕在管上的RF线圈，以激发流过将插入孔插入等离子体。本发明特别可用作用于氧化来自半导体处理室的废气的排气洗涤器。催化剂可以嵌入多孔插入物中以促进洗涤反应。本发明也可以用于远程等离子体源的施加器中。

3. 发明授权

US06824748B2 Heated catalytic treatment of an effluent gas from a substrate fabrication process 有权
标题翻译：对基板制造工艺中的废气进行加热催化处理
公开(公告)号：US06824748B2
公开(公告)日：2004-11-30
申请号：US09872254
申请日：2001-06-01
申请人： Tony S. Kaushal , Shamouil Shamouilian , Harshad Borgaonkar , Kwok Manus Wong , Michael G. Chafin , Ashish Bhatnagar
发明人： Tony S. Kaushal , Shamouil Shamouilian , Harshad Borgaonkar , Kwok Manus Wong , Michael G. Chafin , Ashish Bhatnagar
IPC分类号： F28D2100
CPC分类号： H01J37/32844 , B01D53/8662 , B01D53/885 , B01J19/12 , B01J19/129 , B01J2219/0809 , B01J2219/083 , B01J2219/0835 , B01J2219/0871 , B01J2219/0875 , B01J2219/0892 , C23C16/4412 , H01J37/3244 , Y02C20/30
摘要： A substrate processing apparatus has a process chamber with a substrate support, a gas supply to introduce a gas into the chamber, and a gas energizer to energize the gas in the processing of a substrate, thereby generating an effluent gas. A catalytic reactor has an effluent gas inlet to receive the effluent gas and an effluent gas outlet to exhaust treated effluent gas. A heater is adapted to heat the effluent gas in the catalytic reactor. The heated catalytic treatment of the effluent gas abates the hazardous gases in the effluent. An additive gas source and a prescrubber may also be used to further treat the effluent.
摘要翻译：基板处理装置具有具有基板支撑件的处理室，向室内引入气体的气体供给部，以及在基板的加工中使气体通电的气体增压器，从而产生流出气体。催化反应器具有用于接收废气的废气入口和用于排出经处理的废气的废气出口。加热器适于加热催化反应器中的废气。流出气体的加热催化处理减少流出物中的有害气体。还可以使用添加气体源和预饱和物来进一步处理流出物。

4. 发明授权

US06673323B1 Treatment of hazardous gases in effluent 有权
标题翻译：污水中有害气体的处理
公开(公告)号：US06673323B1
公开(公告)日：2004-01-06
申请号：US09535461
申请日：2000-03-24
申请人： Ashish Bhatnagar , Tony S. Kaushal , Kwok Manus Wong , Shamouil Shamouilian
发明人： Ashish Bhatnagar , Tony S. Kaushal , Kwok Manus Wong , Shamouil Shamouilian
IPC分类号： B01D4700
CPC分类号： B01D53/70 , B01D53/34 , C23C16/4412
摘要： A method for reducing hazardous gases exhausted from a process chamber includes an effluent gas treatment system with a gas energizing reactor and an additive gas source. Additive gas comprising reactive gas is introduced into the effluent from the process chamber in a volumetric flow rate in relation to the hazardous gas content in the effluent.
摘要翻译：用于减少从处理室排出的有害气体的方法包括具有气体激励反应器和添加气体源的废气处理系统。包含反应性气体的添加剂气体以相对于流出物中的有害气体含量的体积流量被引入来自处理室的流出物中。

5. 发明授权

US06689252B1 Abatement of hazardous gases in effluent 失效
标题翻译：废水中有害气体的消除
公开(公告)号：US06689252B1
公开(公告)日：2004-02-10
申请号：US09363250
申请日：1999-07-28
申请人： Shamouil Shamouilian , Tony S. Kaushal
发明人： Shamouil Shamouilian , Tony S. Kaushal
IPC分类号： B01J1908
CPC分类号： B01D53/8659 , B01D53/68 , B01D53/70 , B01D53/74 , B01D53/8662 , B01D2257/2066 , B01J19/08 , B01J19/12 , B01J19/129 , Y02C20/30
摘要： An apparatus and method for reducing hazardous gases exhausted from a process chamber 25 includes an effluent plasma reactor 210 and a downstream catalytic reactor 220. The reactor 210 may include a consumable liner that reacts with the energized effluent to remove the hazardous gases. The catalytic reactor 220 may also include catalytic surfaces 227 in a honeycomb, foam, or pellet structure 225 to catalyze reactions that further reduce hazardous gas content.
摘要翻译：用于减少从处理室25排出的有害气体的装置和方法包括流出物等离子体反应器210和下游催化反应器220.反应器210可包括消耗性衬里，其与通电的流出物反应以除去有害气体。催化反应器220还可以包括在蜂窝状，泡沫状或颗粒结构225中的催化表面227，以催化进一步减少有害气体含量的反应。

6. 发明授权

US06468490B1 Abatement of fluorine gas from effluent 失效
标题翻译：从排出物中减少氟气
公开(公告)号：US06468490B1
公开(公告)日：2002-10-22
申请号：US09607918
申请日：2000-06-29
申请人： Shamouil Shamouilian , Mehran Moalem , Tony S. Kaushal
发明人： Shamouil Shamouilian , Mehran Moalem , Tony S. Kaushal
IPC分类号： B01D5368
CPC分类号： C23C16/4412 , B01D53/75 , B01D53/8659 , B01D53/8662
摘要： An effluent abatement system 200 that may be used to abate F2 gas content of effluent exhausted from a process chamber 35, such as effluent from a CVD chamber cleaning process includes a catalytic reactor 250 to reduce the content of F2 in the effluent 100. The system may further include a prescrubber 230 to add reactive gases to the effluent 100 and/or to treat the effluent 100 prior to treatment in the catalytic reactor 250. Alternatively reactive gases can be added to the effluent 100 by a gas source 220.
摘要翻译：可用于消除从处理室35排出的流出物（例如来自CVD室清洁过程）的二氧化碳气体含量的流出物消除系统200包括催化反应器250，以减少流出物100中的F2含量。系统可以进一步包括预催化剂230以在催化反应器250中处理之前向流出物100中添加反应性气体和/或处理流出物100.可以通过气体源220将反应性气体加入到流出物100中。

7. 发明授权

US06709314B2 Chemical mechanical polishing endpoinat detection 有权
标题翻译：化学机械抛光endpoinat检测
公开(公告)号：US06709314B2
公开(公告)日：2004-03-23
申请号：US10005658
申请日：2001-11-07
申请人： Tony S. Kaushal , Chuong Quang Dam , Yongqi Hu
发明人： Tony S. Kaushal , Chuong Quang Dam , Yongqi Hu
IPC分类号： B24B4900
CPC分类号： B24B37/013 , B24B49/10
摘要： Endpoint of a chemical mechanical polishing process is detected by monitoring acoustical emissions produced by contact between a polishing pad and a wafer. The acoustic information is resolved into a frequency spectrum utilizing techniques such as fast Fourier transformation. Characteristic changes in frequency spectra of the acoustic emissions reveal transition in polishing between different material layers. CMP endpoint indicated by a change in the acoustic frequency spectrum is validated by correlation with other sensed properties, including but not limited to time-based changes in amplitude of acoustic emissions, frictional coefficient, capacitance, and/or resistance. CMP endpoint revealed by a change in acoustic frequency spectrum can also be validated by comparison with characteristic frequency spectra obtained at endpoints or polishing transitions of prior operational runs.
摘要翻译：通过监测由抛光垫和晶片之间的接触产生的声发射来检测化学机械抛光工艺的端点。利用诸如快速傅里叶变换的技术将声信息解析成频谱。声发射频谱的特征变化显示不同材料层之间的抛光过渡。由声频谱变化指示的CMP端点通过与其他感测特性的相关性来验证，包括但不限于声发射幅度，摩擦系数，电容和/或电阻的基于时间的变化。通过声频频谱变化揭示的CMP终点也可以通过与在先前操作运行的端点或抛光转换处获得的特征频谱进行比较来验证。

8. 发明授权

US07670688B2 Erosion-resistant components for plasma process chambers 有权
标题翻译：等离子体处理室的耐腐蚀组件
公开(公告)号：US07670688B2
公开(公告)日：2010-03-02
申请号：US09892212
申请日：2001-06-25
申请人： Tony S. Kaushal , You Wang , Ananda H. Kumar
发明人： Tony S. Kaushal , You Wang , Ananda H. Kumar
IPC分类号： B32B15/04 , B32B9/00 , C23C16/00
CPC分类号： H01J37/32467 , H01J37/32477 , Y10T428/12576 , Y10T428/1259 , Y10T428/12736
摘要： An erosion-resistant article for use as a component in plasma process chamber. The erosion-resistant article comprises a support and an oxide coating comprising yttrium, which is disposed over the support. The support and the oxide coating preferably have material compositions that differ from one another in coefficient of thermal expansion by no more than 5×10−6/K. Preferred oxide coating compositions include yttria and yttrium aluminum garnet. Preferred supports include alumina supports and aluminum-silicon carbide supports.
摘要翻译：用作等离子体处理室中的组分的耐腐蚀制品。防侵蚀制品包括载体和包含钇的氧化物涂层，其被设置在载体上。载体和氧化物涂层优选具有不同于热膨胀系数不超过5×10-6 / K的材料组成。优选的氧化物涂层组合物包括氧化钇和钇铝石榴石。优选的载体包括氧化铝载体和铝 - 碳化硅载体。

9. 发明授权

US06960521B2 Method and apparatus for polishing metal and dielectric substrates 失效
标题翻译：抛光金属和电介质基板的方法和装置
公开(公告)号：US06960521B2
公开(公告)日：2005-11-01
申请号：US10939750
申请日：2004-09-13
申请人： Yongsik Moon , David Mai , Kapila Wijekoon , Rajeev Bajaj , Rahul Surana , Yongqi Hu , Tony S. Kaushal , Shijian Li , Jui-Lung Li , Shi-Ping Wang , Gary Lam , Fred C. Redeker
发明人： Yongsik Moon , David Mai , Kapila Wijekoon , Rajeev Bajaj , Rahul Surana , Yongqi Hu , Tony S. Kaushal , Shijian Li , Jui-Lung Li , Shi-Ping Wang , Gary Lam , Fred C. Redeker
IPC分类号： B24B1/00 , B24B5/00 , B24B29/00 , B24B37/04 , C23F1/00 , H01L21/306 , H01L21/321 , H01L21/461 , H01L21/4763 , H01L21/768
CPC分类号： H01L21/3212 , B24B37/042 , B24B37/30 , H01L21/7684
摘要： Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material formed thereon in a polishing apparatus having one or more rotational carrier heads and one or more rotatable platens, wherein the carrier head comprises a retaining ring and a membrane for securing a substrate and the platen has a polishing article disposed thereon, contacting the substrate surface and the polishing article to each other at a retaining ring contact pressure of about 0.4 psi or greater than a membrane pressure, and polishing the substrate to remove conductive material.
摘要翻译：提供了用于抛光衬底的方法和装置，其包括具有降低或最小衬底表面损伤和分层的导电和低k电介质材料。在一个方面，提供了一种用于处理衬底的方法，包括将具有形成在其上的导电材料的衬底定位在具有一个或多个旋转载体头和一个或多个可旋转压板的抛光设备中，其中所述载体头包括保持环和用于固定基板的薄膜和压板具有设置在其上的抛光制品，其以约0.4psi或更大于膜压力的保持环接触压力将基板表面和抛光制品彼此接触，并抛光基板以去除导电材料。

10. 发明授权

US06789498B2 Elements having erosion resistance 失效
标题翻译：元素具有抗侵蚀性
公开(公告)号：US06789498B2
公开(公告)日：2004-09-14
申请号：US10085670
申请日：2002-02-27
申请人： Tony S. Kaushal , Chuong Quang Dam , Daniel Ashkin
发明人： Tony S. Kaushal , Chuong Quang Dam , Daniel Ashkin
IPC分类号： C23C600
CPC分类号： C04B35/44 , C04B2235/3225 , C04B2235/764 , C04B2235/768 , C04B2235/94 , C04B2235/96 , C04B2235/9692 , C23C16/4581 , H01J37/32495 , H01J37/32642
摘要： A component of a plasma reactor chamber for processing a semiconductor workpiece, the component being a monolithic ceramic piece formed from a mixture of yttrium aluminum perovskite (YAP) and yttrium aluminum garnet (YAG) formed from a mixture of yttria and alumina powders, the ratio the powders in said mixture being within a range between one ratio at which at least nearly pure yttrium aluminum perovskite is formed and another ratio at which at least nearly pure yttrium aluminum garnet is formed.
摘要翻译：用于处理半导体工件的等离子体反应器室的组件，该组件是由由氧化钇和氧化铝粉末的混合物形成的由钇铝钙钛矿（YAP）和钇铝石榴石（YAG）的混合物形成的整体陶瓷件，所述混合物中的粉末在形成至少几乎纯的钇铝钙钛矿的一个比例和形成至少几乎纯的钇铝石榴石的另一比例之间的范围内。

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