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1. 发明授权

US08009407B2 Adjustable capacitor and circuit provided therewith 有权
标题翻译：可调节电容器和电路
公开(公告)号：US08009407B2
公开(公告)日：2011-08-30
申请号：US12064869
申请日：2006-09-12
申请人： Anton Leidl , Wolfgang Sauer , Stefan Seitz
发明人： Anton Leidl , Wolfgang Sauer , Stefan Seitz
IPC分类号： H01G4/06
CPC分类号： H01G7/06
摘要： A capacitor includes a multi layer structure on a ceramic or crystalline substrate. The multilayer structure includes a lower electrode, an upper electrode, and a dielectric that is tunable by a voltage applied to the electrodes. The multilayer structure is configured such that resonant oscillation modes of bulk acoustic waves can be propagated in the multilayer structure and such that the resonant frequencies of the oscillation modes are outside a first band range of between 810 and 1000 MHz, second band range of between 1700 and 2205 MHz and third band range of between 2400 and 2483.5 MHz.
摘要翻译：电容器包括在陶瓷或晶体衬底上的多层结构。多层结构包括下电极，上电极和可通过施加到电极的电压来调节的电介质。多层结构被配置为使得能够在多层结构中传播体声波的共振振荡模式，并且使得振荡模式的谐振频率在810和1000MHz之间的第一频带范围之外，第二频带范围在1700 和2205MHz，以及在2400和2483.5MHz之间的第三频带范围。

2. 发明申请

US20080253056A1 Adjustable Capacitor and Circuit Provided Therewith 有权
标题翻译：可调电容器及电路
公开(公告)号：US20080253056A1
公开(公告)日：2008-10-16
申请号：US12064869
申请日：2006-09-12
申请人： Anton Leidl , Wolfgang Sauer , Stefan Seitz
发明人： Anton Leidl , Wolfgang Sauer , Stefan Seitz
IPC分类号： H01G7/06
CPC分类号： H01G7/06
摘要： A capacitor with a multilayer structure on a ceramic or crystalline substrate is proposed that comprises at least one lower and one upper electrode as well as a tunable dielectric arranged therebetween in which resonant oscillation modes of bulk acoustic waves can be propagated, wherein, by suitable selection regarding material and thickness and a suitable number of layers in the multilayer structure, the latter is tuned such that the resonant frequencies of the oscillation modes lie outside of band ranges used in mobile telephones. Circuits with tunable capacitors that find multiple uses inside terminal devices for mobile communication are additionally proposed.
摘要翻译：提出了一种在陶瓷或晶体衬底上具有多层结构的电容器，其包括至少一个下电极和一个上电极以及布置在其间的可调电介质，其中可以传播体声波的共振振荡模式，其中通过适当的选择关于多层结构中的材料和厚度以及合适数量的层，后者被调整为使得振荡模式的谐振频率位于移动电话中使用的频带范围之外。另外提出了具有在移动通信终端设备内发现多种用途的可调电容器的电路。

3. 发明授权

US08865499B2 MEMS microphone and method for producing the MEMS microphone 有权
标题翻译： MEMS麦克风和MEMS麦克风的制造方法
公开(公告)号：US08865499B2
公开(公告)日：2014-10-21
申请号：US13805630
申请日：2011-07-07
申请人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
发明人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
IPC分类号： H01L21/00
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2207/096 , B81C1/00309 , H01L2224/16225 , H01L2924/15151 , H01L2924/16151 , H04R1/086 , H04R1/38 , H04R19/005 , H04R19/04 , H04R29/004 , H04R31/006
摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S01) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S01) is closed; and a second sound inlet opening (S02) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S01) is prepared but closed.
摘要翻译：本发明涉及一种用于制造麦克风的方法，其中换能器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（S01）; 进行麦克风的功能测试; 第一声音入口（S01）关闭; 并且在盖中产生第二声音入口（S02）。本发明还涉及由该方法产生的麦克风，其中第一声音入口开口（S01）准备但关闭。

4. 发明授权

US08432007B2 MEMS package and method for the production thereof 有权
标题翻译： MEMS封装及其制造方法
公开(公告)号：US08432007B2
公开(公告)日：2013-04-30
申请号：US13075936
申请日：2011-03-30
申请人： Anton Leidl , Hans Krueger , Alois Stelzl , Wolfgang Pahl , Stefan Seitz
发明人： Anton Leidl , Hans Krueger , Alois Stelzl , Wolfgang Pahl , Stefan Seitz
IPC分类号： H01L29/84
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/07811 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
摘要翻译：本文描述了微机电系统（MEMS）封装。封装包括具有顶侧的载体衬底，安装在载体衬底的顶侧上的MEMS芯片以及在载体衬底的顶侧上或上方嵌入载体衬底中的至少一个芯片组件。封装还包括覆盖MEMS芯片和芯片部件的薄金属屏蔽层，并与载体基板的顶侧形成密封。

5. 发明申请

US20110186943A1 MEMS Package and Method for the Production Thereof 有权
标题翻译： MEMS封装及其制造方法
公开(公告)号：US20110186943A1
公开(公告)日：2011-08-04
申请号：US13075936
申请日：2011-03-30
申请人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
发明人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
IPC分类号： H01L29/84 , H01L21/00
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/07811 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
摘要翻译：本文描述了微机电系统（MEMS）封装。封装包括具有顶侧的载体衬底，安装在载体衬底的顶侧上的MEMS芯片以及在载体衬底的顶侧上或上方嵌入载体衬底中的至少一个芯片组件。封装还包括覆盖MEMS芯片和芯片部件的薄金属屏蔽层，并与载体基板的顶侧形成密封。

6. 发明申请

US20130140656A1 MEMS Microphone And Method For Producing The MEMS Microphone 有权
标题翻译： MEMS麦克风及其制造方法
公开(公告)号：US20130140656A1
公开(公告)日：2013-06-06
申请号：US13805630
申请日：2011-07-07
申请人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
发明人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2207/096 , B81C1/00309 , H01L2224/16225 , H01L2924/15151 , H01L2924/16151 , H04R1/086 , H04R1/38 , H04R19/005 , H04R19/04 , H04R29/004 , H04R31/006
摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (SO1) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (SO1) is closed; and a second sound inlet opening (SO2) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (SO1) is prepared but closed.
摘要翻译：本发明涉及一种用于制造麦克风的方法，其中传感器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（SO1）; 进行麦克风的功能测试; 第一声音入口开口（SO1）关闭; 并且在盖中产生第二声音入口开口（SO2）。本发明还涉及一种由该方法产生的麦克风，其中第一声音入口开口（SO1）准备但关闭。

7. 发明申请

US20090001553A1 Mems Package and Method for the Production Thereof 有权
标题翻译： Mems包及其制作方法
公开(公告)号：US20090001553A1
公开(公告)日：2009-01-01
申请号：US12092439
申请日：2006-11-06
申请人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
发明人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
IPC分类号： H01L23/12 , H01L21/00
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/07811 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
摘要翻译：本文描述了微机电系统（MEMS）封装。封装包括具有顶侧的载体衬底，安装在载体衬底的顶侧上的MEMS芯片以及在载体衬底的顶侧上或上方嵌入载体衬底中的至少一个芯片组件。封装还包括覆盖MEMS芯片和芯片部件的薄金属屏蔽层，并与载体基板的顶侧形成密封。

8. 发明授权

US08169041B2 MEMS package and method for the production thereof 有权
标题翻译： MEMS封装及其制造方法
公开(公告)号：US08169041B2
公开(公告)日：2012-05-01
申请号：US12092439
申请日：2006-11-06
申请人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
发明人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
IPC分类号： H01L29/84
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/07811 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
摘要翻译：本文描述了微机电系统（MEMS）封装。封装包括具有顶侧的载体衬底，安装在载体衬底的顶侧上的MEMS芯片以及在载体衬底的顶侧上或上方嵌入载体衬底中的至少一个芯片组件。封装还包括覆盖MEMS芯片和芯片部件的薄金属屏蔽层，并与载体基板的顶侧形成密封。

9. 发明授权

US07771053B2 Method and apparatus for online contact lens evaluation 有权
标题翻译：在线隐形眼镜评估方法和装置
公开(公告)号：US07771053B2
公开(公告)日：2010-08-10
申请号：US10565877
申请日：2004-07-22
申请人： Hans-Joachim Polland , Stefan Seitz , Kristian Hohla , Gerhard Youssefi , Ernst Hegels , Birte Jansen , Christoph Sappel
发明人： Hans-Joachim Polland , Stefan Seitz , Kristian Hohla , Gerhard Youssefi , Ernst Hegels , Birte Jansen , Christoph Sappel
IPC分类号： A61B3/00 , G02C7/04 , A61B3/10
CPC分类号： G02C7/021 , G02C7/04 , G02C7/047
摘要： A selectively marked contact lens having, in one aspect, marks in an optical zone region on a surface thereof and, in another aspect, different marks outside an optical zone region of the lens, for an in-vivo lens. With the lens in-vivo, the subject's eye is illuminated and the lens is imaged. A fast algorithm is used to determine the mark coordinates in relation to a measured pupil coordinate to determine position and/or orientation of the contact lens. A wavefront aberration measurement can also be obtained simultaneously with the contact lens position measurement, as well as pupil size. A fast algorithm provides for online measurements; i.e., at a repetition rate of 10 Hz or greater, over a selected time interval. Blinking periods are determined and anomalous lens position and/or wavefront information is discarded. A most frequently occurring wavefront and/or contact lens position/orientation is determined over the selected time interval.
摘要翻译：一个选择性标记的隐形眼镜，在一个方面，在其表面上的光学区域中标记，并且在另一方面，对于体内透镜，在透镜的光学区域外部具有不同的标记。使用镜片在体内，受试者的眼睛被照亮并且镜片被成像。使用快速算法来确定相对于测量的瞳孔坐标的标记坐标以确定隐形眼镜的位置和/或取向。也可以与隐形眼镜位置测量以及瞳孔尺寸同时获得波前像差测量。快速算法提供在线测量; 即在10Hz或更大的重复频率下，在选定的时间间隔内。确定闪烁周期，并丢弃异常透镜位置和/或波前信息。在所选择的时间间隔内确定最频繁出现的波前和/或隐形眼镜位置/取向。

10. 发明授权

US06518084B1 Method of producing a micromechanical structure for a micro-electromechanical element 失效
标题翻译：微机电元件的微机械结构的制造方法
公开(公告)号：US06518084B1
公开(公告)日：2003-02-11
申请号：US09868402
申请日：2001-09-12
申请人： Stefan Seitz , Leonhard Hoefter , Juergen Kruckow , Karl Neumeier , Dieter Bollmann
发明人： Stefan Seitz , Leonhard Hoefter , Juergen Kruckow , Karl Neumeier , Dieter Bollmann
IPC分类号： H01L2100
CPC分类号： G01P15/0802 , B81B2203/0127 , B81C1/00246 , B81C2201/019 , B81C2203/0728 , G01L9/0042 , G01L9/0073
摘要： In a method of producing a micromechanical structure for a micro-electromechanical element, a first intermediate layer, which is applied to a first main surface of a first semiconductor wafer, is structured in a first step so as to produce a recess. The first semiconductor wafer is then connected via the first intermediate layer to a second semiconductor wafer in such a way that a hermetically sealed cavity is defined by the recess. Finally, one of the wafers is thinned from a surface facing away from said first intermediate layer so as to produce a diaphragm-like structure on top of the cavity. At least one further intermediate layer is provided between the two semiconductor wavers which, prior to the connection of the two semiconductor wafers, is structured in such a way that the structure formed in said at least one further intermediate layer and the recess in said first intermediate layer define the cavity.
摘要翻译：在制造微电子机电元件的微机械结构的方法中，施加到第一半导体晶片的第一主表面的第一中间层被构造成第一步骤以产生凹陷。然后将第一半导体晶片经由第一中间层连接到第二半导体晶片，使得由凹部限定气密密封腔。最后，其中一个晶片从背离所述第一中间层的表面变薄，从而在空腔的顶部产生隔膜状结构。在两个半导体波幅之间提供至少一个另外的中间层，其在两个半导体晶片的连接之前被构造成使得在所述至少一个另外的中间层中形成的结构和所述第一中间层层定义空腔。

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