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1. 发明授权

US06712670B2 Method and apparatus for applying downward force on wafer during CMP 失效
标题翻译：在CMP期间向晶片施加向下的力的方法和装置
公开(公告)号：US06712670B2
公开(公告)日：2004-03-30
申请号：US10033671
申请日：2001-12-27
申请人： Anthony de la Llera , Xuyen Pham , Andrew Siu , Tuan A. Nguyen , Tony Luong
发明人： Anthony de la Llera , Xuyen Pham , Andrew Siu , Tuan A. Nguyen , Tony Luong
IPC分类号： B24B4900
CPC分类号： B24B37/30 , B24B49/16
摘要： An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.
摘要翻译：在CMP操作期间将晶片施加到研磨带的装置包括具有上端和下端的心轴。晶片载体联接到主轴的下端。线轴力发生器设置在主轴的上端。称重传感器位于线性力发生器和主轴上端之间。控制器耦合到负载传感器，用于控制由线性力发生器施加的力。还描述了在CMP期间在晶片上施加向下的力的方法。

2. 发明授权

US07018276B2 Air platen for leading edge and trailing edge control 失效
公开(公告)号：US07018276B2
公开(公告)日：2006-03-28
申请号：US10876415
申请日：2004-06-25
申请人： Anthony de la Llera , Xuyen Pham , Cangshan Xu , David Wei , Tony Luong
发明人： Anthony de la Llera , Xuyen Pham , Cangshan Xu , David Wei , Tony Luong
IPC分类号： B24B7/22 , B24B21/08
CPC分类号： B24B21/10 , B24B37/04
摘要： An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.

3. 发明授权

US06761626B2 Air platen for leading edge and trailing edge control 失效
标题翻译：用于前缘和后缘控制的气压盘
公开(公告)号：US06761626B2
公开(公告)日：2004-07-13
申请号：US10037452
申请日：2001-12-20
申请人： Anthony de la Llera , Xuyen Pham , Cangshan Xu , David Wei , Tony Luong
发明人： Anthony de la Llera , Xuyen Pham , Cangshan Xu , David Wei , Tony Luong
IPC分类号： B24B722
CPC分类号： B24B21/10 , B24B37/04
摘要： An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.
摘要翻译：描述了空气压板组件，并且包括具有多个同心环的压板。每个环具有多个开口，以便向CMP带提供空气缓冲。至少一个环延伸超过晶片的外边缘以由CMP带平坦化。支撑件与压板连接，并且具有多个用于加压空气的空气端口以传递到压板的环。垫片定位在支撑件和压板之间，并且具有与开口和空气端口对准的多个切口。还包括基地并支持支持。

4. 发明授权

US06949016B1 Gimballed conditioning apparatus 失效
标题翻译：金球调节装置
公开(公告)号：US06949016B1
公开(公告)日：2005-09-27
申请号：US10112399
申请日：2002-03-29
申请人： Anthony de la Llera , Xuyen Pham
发明人： Anthony de la Llera , Xuyen Pham
IPC分类号： B24B5/00 , B24B21/18 , B24B37/04 , B24B53/007
CPC分类号： B24B53/017 , B24B21/18
摘要： A chemical mechanical planarization (CMP) conditioning apparatus is provided. The CMP conditioning apparatus is designed to connect to a positioning arm which is capable of applying the conditioning apparatus to a processing surface. Embodiments of the CMP conditioning apparatus include a housing configured to connect to the positioning arm, and one side of the housing having a concave gimbal surface. A puck holder that a convex gimbal surface configured to mate with the concave gimbal surface of the housing is further provided. Thee puck holder receives a conditioning puck that has an attach surface and an active surface. The concave gimbal surface and the convex gimbal surface define a projected gimbal point at about a plane defined at about the active surface of the conditioning puck.
摘要翻译：提供化学机械平面化（CMP）调理装置。 CMP调节装置被设计成连接到能够将调节装置应用于处理表面的定位臂。 CMP调节装置的实施例包括构造成连接到定位臂的壳体，并且壳体的一侧具有凹形万向面。进一步提供了构造成与壳体的凹面万向节表面配合的凸面万向面的圆盘保持架。冰球座接收一个具有附着表面和活动表面的调理盘。凹面万向节表面和凸面万向节表面在约定义在调理盘的活动表面处的平面处限定投影的万向节点。

5. 发明授权

US06746313B1 Polishing head assembly in an apparatus for chemical mechanical planarization 失效
标题翻译：用于化学机械平面化的设备中的抛光头组件
公开(公告)号：US06746313B1
公开(公告)日：2004-06-08
申请号：US09999066
申请日：2001-10-24
申请人： Xuyen Pham , Anthony de la Llera
发明人： Xuyen Pham , Anthony de la Llera
IPC分类号： B24B100
CPC分类号： B24B37/32
摘要： A polishing head assembly for use in a chemical mechanical planarization apparatus is provided. The polishing head assembly includes a carrier head shaped substantially like a disk having a circumference, a top surface, a bottom surface, and an outer wall, the outer wall having a groove therein, the groove extending into the carrier head from the bottom surface of the carrier head, and the groove running the entire circumference of the carrier head; and a retainer ring having an interior wall and an exterior wall, the interior wall of the retainer ring being in contact with the outer wall of the carrier head, the interior wall having a slot therein, the slot defining a lower portion of the interior wall as a flexible leg, the flexible leg having a receiving end that is adapted to secure an object having a surface to be polished, the slot having a first terminal end adjacent to the groove in the carrier head and a second terminal end, opposite the first terminal end, in the body of the retainer ring. A carrier head is provided, as is a retainer ring. A method of compensating for uneven force distribution in a chemical mechanical planarization apparatus is also provided.
摘要翻译：提供了一种用于化学机械平面化装置的抛光头组件。抛光头组件包括基本上类似于具有圆周，顶表面，底表面和外壁的盘的托架头，该外壁在其中具有槽，该槽从底表面延伸到承载头中所述承载头和所述槽围绕所述承载头的整个圆周延伸; 以及具有内壁和外壁的保持环，所述保持环的内壁与所述承载头的外壁接触，所述内壁在其中具有槽，所述槽限定所述内壁的下部作为柔性腿，柔性腿具有适于固定具有待抛光表面的物体的接收端，所述狭槽具有与载体头部中的凹槽相邻的第一端部端部和与第一端子相对的第二端子端部终端，在保持环的主体中。保持环也是一个承载头。还提供了补偿化学机械平面化装置中的不均匀力分布的方法。

6. 发明授权

US07040970B2 Apparatus and method for distributing a polishing fluid 失效
标题翻译：用于分配抛光液的装置和方法
公开(公告)号：US07040970B2
公开(公告)日：2006-05-09
申请号：US10892428
申请日：2004-07-15
申请人： Simon McClatchie , Sabir Majumder , Ren Zhou , Xuyen Pham , Tuan A. Nguyen
发明人： Simon McClatchie , Sabir Majumder , Ren Zhou , Xuyen Pham , Tuan A. Nguyen
IPC分类号： B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： An apparatus and method for evenly distributing a polishing fluid onto a polishing pad during a chemical mechanical planarization process, wherein the polishing fluid is dispersed by way of a spray being emitted from a spray nozzle. The pattern of polishing fluid applied to the polishing pad can be modified by adjustment of geometric parameters of the spray nozzle. The apparatus is configured with actuating mechanisms for translating and rotating the spray nozzle relative to the polishing pad in order to adjust a pattern of distribution of the polishing fluid. The method of dispersing polishing fluid onto the polishing pad produces an even distribution of polishing fluid across a width of the polishing pad.
摘要翻译：一种用于在化学机械平面化工艺期间将抛光流体均匀地分布到抛光垫上的装置和方法，其中抛光液通过从喷嘴喷射的喷雾而分散。可以通过调整喷嘴的几何参数来修改施加到抛光垫的抛光液的图案。该装置配置有用于相对于抛光垫平移和旋转喷嘴的致动机构，以便调节抛光流体的分布模式。将抛光液分散在抛光垫上的方法产生抛光液在抛光垫宽度上的均匀分布。

7. 发明授权

US06953750B1 Methods and systems for controlling belt surface temperature and slurry temperature in linear chemical mechanical planarization 失效
标题翻译：在线性化学机械平面化中控制带表面温度和浆料温度的方法和系统
公开(公告)号：US06953750B1
公开(公告)日：2005-10-11
申请号：US10261568
申请日：2002-09-30
申请人： Patrick P. H. Wu , Xuyen Pham , Tuan A. Nguyen , Ren Zhou
发明人： Patrick P. H. Wu , Xuyen Pham , Tuan A. Nguyen , Ren Zhou
IPC分类号： B24B21/04 , B24B37/015 , B24B49/14 , B24B57/02 , H01L21/302
CPC分类号： B24B37/015 , B24B21/04 , B24B57/02
摘要： A linear chemical mechanical planarization (CMP) system includes a belt pad, a slurry bar having a plurality of nozzles, and a heating module for heating slurry. The heating module has a plurality of heating elements, each of which is coupled in flow communication with one of the plurality of nozzles of the slurry bar. The system also may include a control system for controlling the heating elements of the heating module and first and second temperature sensors coupled to the control system. The first temperature sensors measure the temperature of slurry heated by each of the heating elements, and the second temperature sensors measure the temperature of the surface of the belt pad. A method for dispensing slurry in a linear CMP system, and methods for controlling the temperature of the surface of the belt pad and the temperature of slurry in a linear CMP system also are described.
摘要翻译：线性化学机械平面化（CMP）系统包括带式衬垫，具有多个喷嘴的浆料棒和用于加热浆料的加热模块。加热模块具有多个加热元件，每个加热元件与浆料棒的多个喷嘴中的一个流体连通地联接。该系统还可以包括用于控制加热模块的加热元件的控制系统和耦合到控制系统的第一和第二温度传感器。第一温度传感器测量由每个加热元件加热的浆料的温度，第二温度传感器测量带垫表面的温度。还描述了用于在线性CMP系统中分配浆料的方法，以及用于控制带衬垫的表面的温度和在线性CMP系统中的浆料的温度的方法。

8. 发明授权

US06896600B1 Liquid dispense manifold for chemical-mechanical polisher 失效
标题翻译：用于化学机械抛光机的液体分配歧管
公开(公告)号：US06896600B1
公开(公告)日：2005-05-24
申请号：US10112421
申请日：2002-03-29
申请人： Patrick P. H. Wu , Xuyen Pham , Tony Luong
发明人： Patrick P. H. Wu , Xuyen Pham , Tony Luong
IPC分类号： B24B21/04 , B24B37/04 , B24B57/02 , B24B57/00
CPC分类号： B24B37/04 , B24B21/04 , B24B57/02
摘要： A liquid dispense manifold having drip nozzles configured to form controlled droplets is provided for use in chemical-mechanical polisher (CMP) systems. The liquid dispense manifold includes a plurality of drip nozzles that are secured to the side of the liquid dispense manifold. Each of the plurality of drip nozzles has a passage defined between a first end and a second end. A bend is defined within the drip nozzle passage such that droplets are directed downward toward a polishing surface. The nozzles are configured with respect to the manifold to provide an even flow rate of substantially uniform drops onto the polishing surface.
摘要翻译：具有配置成形成受控液滴的滴注嘴的液体分配歧管被提供用于化学机械抛光机（CMP）系统。液体分配歧管包括固定在液体分配歧管一侧的多个滴水嘴。多个滴水喷嘴中的每一个具有在第一端和第二端之间限定的通道。在滴水喷嘴通道内限定弯曲，使得液滴朝向研磨表面向下。喷嘴相对于歧管配置，以提供基本均匀的液滴到抛光表面上的均匀流速。

9. 发明授权

US06896586B2 Method and apparatus for heating polishing pad 失效
标题翻译：抛光垫加热方法和装置
公开(公告)号：US06896586B2
公开(公告)日：2005-05-24
申请号：US10112628
申请日：2002-03-29
申请人： Xuyen Pham , Tuan Nguyen , Ren Zhou , David Wei , Linda Jiang , Katgenhalli Y. Ramanujam , Joseph P. Simon , Tony Luong , Sridharan Srivatsan , Anjun Jerry Jin
发明人： Xuyen Pham , Tuan Nguyen , Ren Zhou , David Wei , Linda Jiang , Katgenhalli Y. Ramanujam , Joseph P. Simon , Tony Luong , Sridharan Srivatsan , Anjun Jerry Jin
IPC分类号： B24B21/10 , B24B37/12 , B24B49/14 , H01L21/304 , B24B49/00
CPC分类号： B24B37/12 , B24B21/10 , B24B49/14
摘要： A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.
摘要翻译：提供了一种用于具有线性抛光带的化学机械平面化（CMP）系统的温度控制系统，能够在线性抛光带上的准备位置上施加基底的载体。温度控制系统包括具有多个区域的压板。温度控制系统还包括配置的温度传感器，其确定在准备位置之后的位置处的线性抛光带的温度。该系统还包括控制器，用于响应于从温度传感器接收到的输出，调节调节温度的流体流到压板的多个区域中的选定区域。

10. 发明申请

US20070246079A1 Multi zone shower head for cleaning and drying wafer and method of cleaning and drying wafer 审中-公开
标题翻译：用于清洗和干燥晶圆的多区域淋浴头以及清洗和干燥晶圆的方法
公开(公告)号：US20070246079A1
公开(公告)日：2007-10-25
申请号：US11408664
申请日：2006-04-21
申请人： Xuyen Pham
发明人： Xuyen Pham
IPC分类号： B08B3/00 , B08B7/00
CPC分类号： H01L21/67051 , H01L21/6708
摘要： A method and system to clean and rinse and dry wafer comprises a precision control of an outward-moving inner boundary condition and a steady state edge boundary condition. The edge boundary condition can confine the liquid within the substrate by an edge liquid flow step, to create an outer liquid boundary, to confine the liquid within the wafer, and to compensate for liquid lost through process conditions such as wafer spinning. The outward-moving inner boundary condition can control or distribute the liquid within the substrate by an inner liquid boundary condition that moves outward to the edge of the wafer, to create an outward-moving inner liquid boundary, to uniformly distribute liquid within the wafer, and to uniformly drying the wafer.
摘要翻译：清洗和干燥晶片的方法和系统包括向外移动的内边界条件和稳态边界边界条件的精确控制。边缘边界条件可以通过边缘液流步骤将液体限制在基板内，以产生外部液体边界，以将液体限制在晶片内，并补偿在诸如晶片旋转之类的工艺条件下损失的液体。向外移动的内边界条件可以通过向外移动到晶片边缘的内部液体边界条件来控制或分布在基板内的液体，以产生向外移动的内部液体边界，以将液体均匀地分布在晶片内，并均匀干燥晶片。

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