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1. 发明申请

US20100198999A1 METHOD AND SYSTEM FOR WIRELESS USB TRANSFER OF ISOCHRONOUS DATA USING BULK DATA TRANSFER TYPE 审中-公开
标题翻译：使用大容量数据传输类型进行无缝数据传输的方法和系统
公开(公告)号：US20100198999A1
公开(公告)日：2010-08-05
申请号：US12366591
申请日：2009-02-05
申请人： Anoop Nair , Criag Smith , Greg Christison , Thomas R. Miller
发明人： Anoop Nair , Criag Smith , Greg Christison , Thomas R. Miller
IPC分类号： G06F13/14
CPC分类号： G06F13/387 , G06F13/4282 , G06F2213/3814
摘要： A method and system for transferring data in a wireless USB system having a first USB enabled device and a second USB enabled device are provided. The method includes providing a first data having a first data transfer type, converting the first data to a second data having a second data transfer type, wirelessly transferring the second data from the first USB enabled device to the second USB enabled device using the second data transfer type, and converting the wirelessly transferred second data to a third data having the first data transfer type.
摘要翻译：提供了一种用于在具有第一USB启用设备和第二USB启用设备的无线USB系统中传送数据的方法和系统。该方法包括提供具有第一数据传输类型的第一数据，将第一数据转换为具有第二数据传输类型的第二数据，使用第二数据将第二数据从第一USB启用设备无线地传送到第二USB使能设备传输类型，并将无线传送的第二数据转换为具有第一数据传输类型的第三数据。

2. 发明授权

US07615477B2 Method of fabricating a BGA package having decreased adhesion 有权
标题翻译：制造具有降低的附着力的BGA封装的方法
公开(公告)号：US07615477B2
公开(公告)日：2009-11-10
申请号：US11566956
申请日：2006-12-05
申请人： John U. Knickerbocker , Voya R. Markovich , Thomas R. Miller , William J. Rudik
发明人： John U. Knickerbocker , Voya R. Markovich , Thomas R. Miller , William J. Rudik
IPC分类号： H01L31/058 , H01L23/495 , H01L23/48 , H01L21/44
CPC分类号： H05K1/0271 , H01L23/49866 , H01L2924/0002 , H05K1/111 , H05K3/384 , H05K3/4092 , H05K2201/0133 , H05K2201/0355 , H05K2203/0307 , H05K2203/1152 , H01L2924/00
摘要： Ball Grid Array packages having decreased adhesion of the BGA pad to the laminate surface and methods for producing same are provided.
摘要翻译：提供了具有降低的BGA焊盘与层压体表面的粘附性的球栅阵列封装及其制造方法。

3. 发明申请

US20080301933A1 Method of providing a printed circuit board with an edge connection portion 失效
标题翻译：提供具有边缘连接部分的印刷电路板的方法
公开(公告)号：US20080301933A1
公开(公告)日：2008-12-11
申请号：US11808140
申请日：2007-06-07
申请人： Thomas R. Miller , Duane A. Stanke , Robert J. Testa
发明人： Thomas R. Miller , Duane A. Stanke , Robert J. Testa
IPC分类号： H05K3/36 , H05K3/20
CPC分类号： H05K1/117 , H05K3/4611 , H05K2201/09127 , H05K2201/09845 , H05K2203/061 , H05K2203/1147 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49155 , Y10T29/49156 , Y10T29/49163 , Y10T29/49165
摘要： A method of making a printed circuit board in which at least two circuitized substrates are aligned and bonded together (e.g., using lamination). A gasket is provided on one of these and a facing circuitized portion on the other. The gasket forms an effective seal about the circuitized portion to prevent heated dielectric material from contacting the circuitry. After bonding, parts of the bonded structure, including the gasket, are removed to leave a projecting edge portion having circuitry thereon. This edge portion is then adapted for being positioned within an edge connector.
摘要翻译：制造印刷电路板的方法，其中至少两个电路化基板对准并结合在一起（例如，使用层压）。在其中一个和另一个面上的电路部分上设有垫片。垫圈围绕电路部分形成有效的密封，以防止加热的电介质材料接触电路。在粘合之后，去除包括垫圈的粘合结构的部分，以留下其上具有电路的突出边缘部分。然后该边缘部分适于定位在边缘连接器内。

4. 发明授权

US07148566B2 Method and structure for an organic package with improved BGA life 失效
公开(公告)号：US07148566B2
公开(公告)日：2006-12-12
申请号：US09817843
申请日：2001-03-26
申请人： John U. Knickerbocker , Voya R. Markovich , Thomas R. Miller , William J. Rudik
发明人： John U. Knickerbocker , Voya R. Markovich , Thomas R. Miller , William J. Rudik
IPC分类号： H01L21/44
CPC分类号： H05K1/0271 , H01L23/49866 , H01L2924/0002 , H05K1/111 , H05K3/384 , H05K3/4092 , H05K2201/0133 , H05K2201/0355 , H05K2203/0307 , H05K2203/1152 , H01L2924/00
摘要： Ball Grid Array packages having decreased adhesion of the BGA pad to the laminate surface and methods for producing same are provided.

5. 发明授权

US06840391B2 Roll of product having parallel display strips thereon 失效
标题翻译：在其上具有平行显示条的产品卷
公开(公告)号：US06840391B2
公开(公告)日：2005-01-11
申请号：US10291918
申请日：2002-11-11
申请人： Thomas R. Miller , William J. Hale
发明人： Thomas R. Miller , William J. Hale
IPC分类号： B65D73/00 , A47F5/08
CPC分类号： B65D73/0028 , A47F2005/0012
摘要： A display strip for packages includes an elongated backing member and transverse adhesive strips that extend completely across the backing member for adheringly holding individual packages. A plurality of the display strips are adhered transversely to a roll of release paper in a side-by-side arrangement. This allows the adhesive strips to form a substantially continuous strip of adhesive running parallel the length of the roll, and also allows the display strips to be presented one by one as the roll is unwound a short distance equal to a width of the display strips. Due to the short distance of the roll as it is unwound, the display strips are easily removed one at a time off an end of the roll.
摘要翻译：用于包装的显示条包括细长背衬构件和横向粘合剂条，其完全延伸穿过背衬构件，以便于保持单独的包装。多个显示条以并排布置横向粘附到一卷脱模纸上。这允许粘合剂条形成平行于辊的长度的基本上连续的粘合带，并且还允许显示条一个接一个地放置，因为卷展开等于显示条的宽度的短距离。由于卷筒退绕的距离很短，所以显示条可以容易地从辊的端部一次移除。

6. 发明授权

US06613162B1 Multicomponent homogeneous alloys and method for making same 有权
标题翻译：多组分均质合金及其制备方法
公开(公告)号：US06613162B1
公开(公告)日：2003-09-02
申请号：US09696626
申请日：2000-10-25
申请人： Partha S. Dutta , Thomas R. Miller
发明人： Partha S. Dutta , Thomas R. Miller
IPC分类号： C30B2940
CPC分类号： C30B11/002 , C30B29/40
摘要： The present application discloses a method for preparing a homogeneous ternary or quaternary alloy from a quaternary melt. The method includes providing a family of phase diagrams for the quaternary melt which shows (i) composition/temperature data, (ii) tie lines connecting equilibrium liquid and solid compositions, and (iii) isotherms representing boundaries of a miscibility gap. Based on the family of phase diagrams, a quaternary melt composition and an alloy growth temperature is selected. A quaternary melt having the selected quaternary melt composition is provided and a ternary or quaternary alloy is grown from the quaternary melt at the selected alloy growth temperature. A method for making homogeneous ternary or quaternary alloy from a ternary or quaternary melt is also disclosed, as are homogeneous quaternary single-crystal alloys which are substantially free from crystal defects and which have the formula AxB1−xCyD1−y, x and y being the same or different and in the range of 0.001 to 0.999.
摘要翻译：本申请公开了一种从四次熔体制备均匀的三元或四元合金的方法。该方法包括为四元熔体提供一系列相图，其显示（i）组成/温度数据，（ii）连接平衡液体和固体组合物的连接线，以及（iii）表示混合间隙的边界的等温线。基于相图系列，选择四次熔体组成和合金生长温度。提供具有所选择的四级熔融组合物的四级熔体，并且在所选择的合金生长温度下从季熔体生长三元或四元合金。还公开了从三元或四元熔体制备均匀的三元或四元合金的方法，以及基本上没有晶体缺陷并且具有式AxB1-xCyD1-y的均匀的四元单晶合金，x和y是相同或不同，在0.001至0.999的范围内。

7. 发明授权

US06479093B2 Composite laminate circuit structure and methods of interconnecting the same 失效
标题翻译：复合层压电路结构及其相互连接方法
公开(公告)号：US06479093B2
公开(公告)日：2002-11-12
申请号：US10062100
申请日：2002-01-31
申请人： John M. Lauffer , Voya R. Markovich , Thomas R. Miller , Konstantinos I. Papathomas , William E. Wilson
发明人： John M. Lauffer , Voya R. Markovich , Thomas R. Miller , Konstantinos I. Papathomas , William E. Wilson
IPC分类号： B05D512
CPC分类号： H05K3/462 , H01R4/26 , H05K3/0023 , H05K3/4069 , H05K3/4623 , H05K3/4641 , H05K2201/0347 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/10378 , H05K2203/0307 , Y10S428/901 , Y10T156/1089 , Y10T428/24917
摘要： A laminate circuit structure assembly is provided that comprises at least two modularized circuitized plane subassemblies; a joining layer located between each of the subassemblies and wherein the subassemblies and joining layer are bonded together with a cured dielectric from a bondable, curable dielectric. The subassemblies and joining layer are electrically interconnected with bondable electrically conductive material. The joining layer comprises dielectric layers disposed about an internal electrically conductive layer. The electrically conductive layer has a via and the dielectric layers each have a via of smaller diameter than the vias in the electrically conductive layer and are aligned with the vias in the electrically conductive layer. The vias are filled with electrically bondable electrically conductive material for providing electrical contact between the subassemblies.
摘要翻译：提供了一种层叠电路结构组件，其包括至少两个模块化电路化的平面子组件; 位于每个子组件之间的接合层，并且其中所述子组件和接合层与来自可结合的可固化电介质的固化电介质结合在一起。子组件和接合层与可结合的导电材料电互连。接合层包括围绕内部导电层设置的电介质层。导电层具有通孔，并且介电层各自具有比导电层中的通孔更小的直径的通孔，并且与导电层中的通孔对准。通孔填充有电可焊接的导电材料，用于在子组件之间提供电接触。

8. 发明授权

US06381218B1 Network controller system that uses directed heartbeat packets 失效
标题翻译：使用定向心跳数据包的网络控制器系统
公开(公告)号：US06381218B1
公开(公告)日：2002-04-30
申请号：US09152165
申请日：1998-09-11
申请人： Michael S. McIntyre , Thomas R. Miller , Daniel B. McCarthy , Brice Bartek
发明人： Michael S. McIntyre , Thomas R. Miller , Daniel B. McCarthy , Brice Bartek
IPC分类号： G01R3108
CPC分类号： G06F11/3041 , G06F11/0757 , G06F11/2005 , G06F11/2007 , G06F11/3006 , G06F11/3055
摘要： A network controller system including a plurality of network ports and a driver system that operates the network ports as a team. The team is operated to simulate a single logical device in one of several team modes, such as fault tolerance or load balancing modes, to enhance performance of communication of the computer in a network. The driver system periodically determines and updates the status of each of the network ports, where the status of each is based at least on whether at least one directed packet has been received and transferred to the driver system by a respective network port. If any one of the network ports has not received a directed packet within a predetermined time period, the driver system commands another network port to transmit a directed heartbeat packet to the network port that has not received a directed packet. The team may include a primary and one or more secondary ports. The primary port sends a directed packet to any secondary port that has not received a directed packet within the predetermined time period. One or more of the secondary ports may each send a directed heartbeat packet to the primary port if the primary port has not received a directed packet within the predetermined time period.
摘要翻译：一种包括多个网络端口的网络控制器系统和作为一个团队操作网络端口的驱动器系统。该团队经营以模拟单个逻辑设备，采用几种团队模式之一，例如容错或负载平衡模式，以增强网络中计算机通信的性能。驱动器系统周期性地确定和更新每个网络端口的状态，其中每个网络端口的状态至少基于至少一个有向分组是否已经被相应的网络端口接收并传送到驱动器系统。如果任何一个网络端口在预定时间段内没有接收到定向分组，则驱动器系统命令另一个网络端口向未接收到定向分组的网络端口发送定向心跳分组。团队可以包括主要和一个或多个辅助端口。主端口将定向分组发送到在预定时间段内未接收到定向分组的任何辅助端口。如果主端口在预定时间段内没有接收到定向分组，则一个或多个辅助端口可以各自向主端口发送定向的心跳分组。

9. 发明授权

US06188027B1 Protection of a plated through hole from chemical attack 有权
标题翻译：保护电镀通孔免受化学侵蚀
公开(公告)号：US06188027B1
公开(公告)日：2001-02-13
申请号：US09345474
申请日：1999-06-30
申请人： Thomas R. Miller , Kristen A. Stauffer , Michael Wozniak
发明人： Thomas R. Miller , Kristen A. Stauffer , Michael Wozniak
IPC分类号： H01K909
CPC分类号： H05K3/0094 , H05K3/385 , H05K2201/0959 , Y10S428/901 , Y10T428/24273 , Y10T428/24917 , Y10T428/249985
摘要： An electronic structure, and associated method of formation, in which a plated metallic layer such as a copper layer, of a plated through hole (PTH) is adhesively coupled to holefill material distributed within the PTH. The holefill material includes a resin such as an epoxy and optionally includes a particulate component such as a copper powder. The adhesive coupling is accomplished by forming an adhesion promoter film on the plated metallic layer such that the adhesion promoter film is bonded to the resin. The adhesion promoter film may include a metallic oxide layer such as layer containing cupric oxide and cuprous oxide, which could be formed from bathing the PTH in a solution of sodium chlorite. Application of a reducing solution of dimethylamine borane to the cuprous oxide layer would convert some of the cuprous oxide to cupric oxide in the metallic oxide layer. Another possibility for an adhesion promoter film is an organometallic layer such as a layer that includes a chemical complex of metal and an organic corrosion inhibitor. Useful organic corrosion inhibitors for this purpose include triazoles, tetrazoles, and imidazoles. The organometallic layer could be formed from bathing the PTH in a bath of hydrogen peroxide, sulfuric acid, and an organic corrosion inhibitor.
摘要翻译：将电镀通孔（PTH）的电镀金属层（例如铜层）粘合地耦合到分布在PTH内的孔填充材料的电子结构及其相关联的形成方法。孔填充材料包括诸如环氧树脂的树脂，并且任选地包括诸如铜粉末的颗粒组分。通过在电镀金属层上形成粘合促进剂膜，使粘合促进剂膜与树脂结合，实现粘接剂的连接。粘合促进剂膜可以包括金属氧化物层，例如含有氧化铜和氧化亚铜的层，其可以通过在亚氯酸钠溶液中洗涤PTH而形成。将二甲胺硼烷的还原溶液应用于氧化亚铜层将将一些氧化亚铜转化为金属氧化物层中的氧化铜。粘合促进剂膜的另一种可能性是有机金属层，例如包含金属和有机缓蚀剂的化学络合物的层。用于此目的的有用的有机腐蚀抑制剂包括三唑，四唑和咪唑。可以通过在过氧化氢，硫酸和有机腐蚀抑制剂的浴中洗涤PTH来形成有机金属层。

10. 发明授权

US6136513A Method of uniformly depositing seed and a conductor and the resultant printed circuit structure 失效
标题翻译：均匀沉积种子和导体以及所得印刷电路结构的方法
公开(公告)号：US6136513A
公开(公告)日：2000-10-24
申请号：US65668
申请日：1998-04-23
申请人： Anastasios P. Angelopoulos , Gerald W. Jones , Luis J. Matienzo , Thomas R. Miller , William D. Taylor
发明人： Anastasios P. Angelopoulos , Gerald W. Jones , Luis J. Matienzo , Thomas R. Miller , William D. Taylor
IPC分类号： C23C18/16 , H05K3/18 , H05K3/38 , G03F7/26
CPC分类号： H05K3/387 , C23C18/1605 , C23C18/2033 , C23C18/2086 , C23C18/30 , H05K2203/1105 , H05K2203/122 , H05K3/181 , H05K3/381 , H05K3/389
摘要： The present invention comprises a method of making a circuitized structure. The method comprises the steps of providing a substrate coated with a polymeric dielectric layer, treating the substrate with alkali, baking the substrate to modify the surface of the polymeric dielectric layer, applying a seed layer to the polymeric dielectric layer and applying a conductive layer to the seed layer. The invention also comprises a printed circuit structure produced by the method of the present invention.
摘要翻译：本发明包括一种制造电路化结构的方法。该方法包括以下步骤：提供涂覆有聚合物电介质层的基底，用碱处理基底，烘烤基底以改变聚合物介电层的表面，将种子层施加到聚合物电介质层并将导电层施加到种子层。本发明还包括通过本发明的方法制造的印刷电路结构。

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