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    • 5. 发明授权
    • Conductive porous materials
    • 导电多孔材料
    • US07504550B2
    • 2009-03-17
    • US11514434
    • 2006-08-31
    • Darold Dean TippeyThomas Michael Ales, III
    • Darold Dean TippeyThomas Michael Ales, III
    • A61F13/15
    • A61F13/42A61F13/84A61F2013/8473Y10T442/68
    • A limited use, disposable article (20), comprises a matrix-substrate (22), and an electrically-conductive region (24) of a separately provided, electrically-conductive material that has been operatively applied to the matrix-substrate from a viscous configuration of the electrically-conductive material. The matrix-substrate includes a first matrix-region (26), and at least a second matrix-region (28). At least the second matrix-region (28) can include a treatment that provides for an operative formation of a selected resistivity in the electrically-conductive region. The first matrix-region (26) has a high resistivity, and the electrically-conductive region (24) is positioned operatively adjacent the second matrix-region (28). The electrically-conductive region (24) has a low resistivity, as determined when the electrically-conductive region is positioned operatively adjacent the second matrix-region and configured for its intended use.
    • 有限使用的一次性制品(20)包括矩阵基底(22)和单独提供的导电材料的导电区域(24),该导电区域(24)已经从粘性被操作地施加到基质基底 配置导电材料。 矩阵基板包括第一矩阵区域(26)和至少第二矩阵区域(28)。 至少第二矩阵区域(28)可以包括提供在导电区域中有选择地形成所选电阻率的处理。 第一矩阵区域(26)具有高电阻率,并且导电区域(24)可操作地邻近第二矩阵区域(28)定位。 导电区域(24)具有低电阻率,当导电区域可操作地邻近第二矩阵区域并被配置用于其预期用途时确定。
    • 7. 发明申请
    • Conductive porous materials
    • 导电多孔材料
    • US20080058744A1
    • 2008-03-06
    • US11514434
    • 2006-08-31
    • Darold Dean TippeyThomas Michael Ales
    • Darold Dean TippeyThomas Michael Ales
    • A61F13/15
    • A61F13/42A61F13/84A61F2013/8473Y10T442/68
    • A limited use, disposable article (20), comprises a matrix-substrate (22), and an electrically-conductive region (24) of a separately provided, electrically-conductive material that has been operatively applied to the matrix-substrate from a viscous configuration of the electrically-conductive material. The matrix-substrate includes a first matrix-region (26), and at least a second matrix-region (28). At least the second matrix-region (28) can include a treatment that provides for an operative formation of a selected resistivity in the electrically-conductive region. The first matrix-region (26) has a high resistivity, and the electrically-conductive region (24) is positioned operatively adjacent the second matrix-region (28). The electrically-conductive region (24) has a low resistivity, as determined when the electrically-conductive region is positioned operatively adjacent the second matrix-region and configured for its intended use.
    • 有限使用的一次性制品(20)包括基体 - 基底(22)和单独提供的导电材料的导电区域(24),其已经从粘性被操作地施加到基体基底 配置导电材料。 矩阵基板包括第一矩阵区域(26)和至少第二矩阵区域(28)。 至少第二矩阵区域(28)可以包括提供在导电区域中有选择地形成所选电阻率的处理。 第一矩阵区域(26)具有高电阻率,并且导电区域(24)可操作地邻近第二矩阵区域(28)定位。 导电区域(24)具有低电阻率,当导电区域可操作地邻近第二矩阵区域并被配置用于其预期用途时确定。
    • 8. 发明申请
    • Conduction through a flexible substrate in an article
    • 通过物品中的柔性基底传导
    • US20080054408A1
    • 2008-03-06
    • US11514542
    • 2006-08-31
    • Darold Dean TippeyThomas Michael Ales
    • Darold Dean TippeyThomas Michael Ales
    • H01L29/40
    • A61F13/42A61F2013/8479
    • An article includes a first electrically-conductive circuit-path and a second electrically-conductive circuit-path. A portion of the first circuit-path is positioned proximally adjacent a portion of the second circuit-path at a first predetermined hole location. A first electrically-insulating barrier layer is interposed between the first circuit-path and second circuit-path at the first hole location, and the first circuit-path is conductively connected to the second circuit-path at the first hole location by filling the hole with a conductive filler. The conductive filler is configured such that the first circuit-path is conductively connected to the second circuit-path at the first predetermined hole location to form an interconnecting conductive filler-path between the first circuit-path and the second circuit-path.
    • 物品包括第一导电电路和第二导电电路。 第一电路路径的一部分在第一预定孔位置处定位成邻近第二电路路径的一部分。 第一电绝缘阻挡层介于第一孔位置处的第一电路路径和第二电路之间,并且第一电路路径通过填充孔而在第一孔位置与第二电路路径导电连接 带有导电填料。 导电填料构造成使得第一电路路径在第一预定孔位置处导电连接到第二电路,以在第一电路路径和第二电路路径之间形成互连的导电填料路径。