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    • 8. 发明申请
    • HIDDEN PARTING LINE MOLD AND HIDDEN PARTING LINE MOLDING TECHNIQUE USING ASSOCIATED PART REMOVAL DEVICE
    • 使用相关部件拆卸装置隐藏式线模和隐藏式直线成型技术
    • US20120242004A1
    • 2012-09-27
    • US13071817
    • 2011-03-25
    • Patrick Smith
    • Patrick Smith
    • B29C45/00B29C45/04
    • B29C45/4421B29C33/005B29L2031/3044
    • An injection mold and a cooperating molding system and method that allows for the parting line of a molded vehicle bumper fascia to be hidden within the wheel arch portion thereof. The invention contemplates two different mold designs for producing such a parting line: a double-lifter design and a collapsing slide core design. The bumper fascia remains in the cavity portion of the mold after molding due to the presence of undercuts in the mold cavity. A robotic part removal device is used to remove the molded bumper fascia from the mold cavity after mold opening. The part removal device is adapted to temporarily deform the bumper fascia in the wheel arch flange areas thereof to facilitate its removal from the cavity.
    • 注塑模具和协同模制系统和方法,其允许模制车辆保险杠面板的分型线隐藏在其轮拱部分内。 本发明考虑了用于生产这种分型线的两种不同的模具设计:双升降机设计和塌陷滑动芯体设计。 由于在模腔中存在底切,保险杠面板在模制之后保留在模具的空腔部分中。 在开模后,使用机器人部件去除装置从模腔中去除模制的保险杠面板。 部件去除装置适于将保险杠面板暂时变形在其轮拱凸缘区域中,以便于其从空腔移除。
    • 10. 发明授权
    • Methods and software for printing materials onto a substrate
    • 将材料印刷到基材上的方法和软件
    • US08191018B1
    • 2012-05-29
    • US12175423
    • 2008-07-17
    • Steven MolesaErik ScherPatrick SmithMichael Kocsis
    • Steven MolesaErik ScherPatrick SmithMichael Kocsis
    • G06F17/50G06F19/00G06K9/00
    • G06F17/50G06F17/5081H05K3/0005H05K3/12
    • Methods and software for correcting printable circuit layouts. The methods generally including steps of identifying shapes in an input circuit layout, applying a plurality of correction rules to the shapes, and producing an output printed circuit layout in accordance with the identified shapes and the correction rules. The input circuit layout generally comprises a bitmapped image or other description of at least one printable layer of at least one electronic component, device, or die. Embodiments of the present invention further allow for more precise control of spreading and effective coverage of features (e.g., source/drain terminal regions, gates, capacitors, diodes, interconnects, etc.) on a substrate by a printed ink composition including electronic materials.
    • 可打印电路布局校正的方法和软件。 所述方法通常包括以下步骤:识别输入电路布局中的形状,对形状应用多个校正规则,以及根据所识别的形状和校正规则产生输出印刷电路布局。 输入电路布局通常包括至少一个电子部件,器件或管芯的至少一个可印刷层的位图图像或其它描述。 本发明的实施例还允许通过包括电子材料的印刷油墨组合物更精确地控制基底上的特征(例如,源极/漏极端子区域,栅极,电容器,二极管,互连等)的扩展和有效覆盖。