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    • 8. 发明授权
    • Digitally addressble electronic device with interchanged and inverted
address lines
    • 具有交错和反相地址线的数字地址电子设备
    • US5065154A
    • 1991-11-12
    • US340981
    • 1989-04-20
    • Winfried KaiserAndreas SchoberE.-Peter Salfeld
    • Winfried KaiserAndreas SchoberE.-Peter Salfeld
    • G06F13/14G06F12/06H04Q9/14
    • G06F12/0676
    • In a system comprising a plurality of digitally addressable electronic devices, all devices have the same construction and are designed for being connected in series to a common central monitoring station. The addressing of these devices is accomplished by a plurality of address lines which are connected to input contacts of the respective device. Within each device, a selection gate is connected to the input contacts which provides an enabling signal if the signal on said address lines has a predetermined bit pattern. Each device has output contacts connected to its input contacts to which the input contacts of a next device are connected. The address lines are connected from the input contacts to the output contacts of the device in such a way that the contacts are interchanged, and an inverter is inserted in one of said lines so that the bit pattern forming the address provided at the output contacts is different from the bit pattern received at the input contacts. Thus, along the system of series connected devices a plurality of different bit patterns is produced so that the position of the correct bit pattern to which the device selection means responds, is shifted along the series connected devices in order to address the device which is in a predetermined position. A preferred application of such devices is in medical surveillance systems in which a plurality of racks are connected serially together and to a center monitoring station, each rack being allocated to a different task and including the units which are needed to monitor the vital functions of a patient required for that task.
    • 9. 发明授权
    • Microstructured composite component and method and device for producing the same
    • 微结构复合材料及其制造方法和装置
    • US08703039B2
    • 2014-04-22
    • US13497814
    • 2010-02-24
    • Andreas SchoberAlexander GrossJoerg Hampl
    • Andreas SchoberAlexander GrossJoerg Hampl
    • B29C51/14
    • B29C49/0047B29C2791/006B29C2791/007B29K2027/12B29L2031/756
    • A microstructured composite component is provided including structures for carrying out fluid processes. A device is provided for producing microstructured composite components. A method provided includes a first step during which a first film is arranged above a second film between first and second mold parts. The first and/or second mold parts have microstructured cavities to be filled. In a second step, the first and second mold parts are heated in at least one region in which they contact one of the films. An excess pressure is then produced between the first film and the second film to force the first and/or second films into the cavities. In a further step, the first and second mold parts are pressed together by a pressing force. Once the first mold part, the second mold part, the first film and the second film are cooled, they form a microstrutured composite component.
    • 提供了一种微结构化复合材料组件,包括用于进行流体过程的结构。 提供了用于生产微结构化复合材料组件的装置。 提供的方法包括第一步骤,在第一步骤中,第一薄膜布置在第一和第二模具部件之间的第二薄膜之上。 第一和/或第二模具部件具有要填充的微结构化空腔。 在第二步骤中,第一和第二模具部件在至少一个它们接触薄膜之一的区域中被加热。 然后在第一膜和第二膜之间产生过量的压力,以迫使第一和/或第二膜进入空腔。 在另一步骤中,第一和第二模具部件通过按压力被压在一起。 一旦第一模具部件,第二模具部件,第一薄膜和第二薄膜被冷却,它们形成微导体复合部件。
    • 10. 发明申请
    • MICROSTRUCTURED COMPOSITE COMPONENT AND METHOD AND DEVICE FOR PRODUCING THE SAME
    • 微结构复合组分及其制备方法和装置
    • US20120231226A1
    • 2012-09-13
    • US13497814
    • 2010-02-24
    • Andreas SchoberAlexander GrossJoerg Hampl
    • Andreas SchoberAlexander GrossJoerg Hampl
    • B32B3/10B32B37/10B32B37/06B32B37/02
    • B29C49/0047B29C2791/006B29C2791/007B29K2027/12B29L2031/756
    • A microstructured composite component is provided including structures for carrying out fluid processes. A device is provided for producing microstructured composite components. A method provided includes a first step during which a first film is arranged above a second film between first and second mold parts. The first and/or second mold parts have microstructured cavities to be filled. In a second step, the first and second mold parts are heated in at least one region in which they contact one of the films. An excess pressure is then produced between the first film and the second film to force the first and/or second films into the cavities. In a further step, the first and second mold parts are pressed together by a pressing force. Once the first mold part, the second mold part, the first film and the second film are cooled, they form a microstrutured composite component.
    • 提供了一种微结构化复合材料组件,包括用于进行流体过程的结构。 提供了用于生产微结构化复合材料组件的装置。 提供的方法包括第一步骤,在第一步骤中,第一薄膜布置在第一和第二模具部件之间的第二薄膜之上。 第一和/或第二模具部件具有要填充的微结构化空腔。 在第二步骤中,第一和第二模具部件在至少一个它们接触薄膜之一的区域中被加热。 然后在第一膜和第二膜之间产生过量的压力,以迫使第一和/或第二膜进入空腔。 在另一步骤中,第一和第二模具部件通过按压力被压在一起。 一旦第一模具部件,第二模具部件,第一薄膜和第二薄膜被冷却,它们形成微导体复合部件。