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    • 3. 发明授权
    • System and method for automatic insertion of on-chip decoupling capacitors
    • 自动插入片上去耦电容的系统和方法
    • US07302664B2
    • 2007-11-27
    • US11054916
    • 2005-02-10
    • Anand HaridassAndreas HuberErich KlinkJochen Supper
    • Anand HaridassAndreas HuberErich KlinkJochen Supper
    • G06F17/50
    • G06F17/5045G06F2217/78
    • A system and method for automatic insertion of on-chip decoupling capacitors are provided. With the system and method, an integrated circuit design is partitioned into cells and the noise distribution per cell of an integrated circuit is determined. This noise distribution may be generated using any of a number of different known mechanisms and generally results in a noise-map being generated for the integrated circuit. Thereafter, a mapping function is applied to the noise map for each cell to determine a required capacitance for the cells of the integrated circuit. From this required capacitance per cell, the necessary decoupling capacitors may be identified as well as the location for insertion of these decoupling capacitors. In a similar manner, decoupling capacitors may be removed from cells of the integrated circuit based upon the determined required capacitance per cell.
    • 提供一种用于自动插入片上去耦电容器的系统和方法。 利用该系统和方法,将集成电路设计划分为单元,确定集成电路的每个单元的噪声分布。 该噪声分布可以使用多个不同的已知机构中的任何一个产生,并且通常导致为集成电路产生噪声映射。 此后,将映射函数应用于每个单元的噪声图,以确定集成电路的单元所需的电容。 根据每个电池所需的电容,可以识别必要的去耦电容以及插入这些去耦电容器的位置。 以类似的方式,可以基于每个单元所确定的所需电容从集成电路的单元去除去耦电容器。
    • 4. 发明申请
    • System and method for automatic insertion of on-chip decoupling capacitors
    • 自动插入片上去耦电容的系统和方法
    • US20060190892A1
    • 2006-08-24
    • US11054916
    • 2005-02-10
    • Anand HaridassAndreas HuberErich KlinkJochen Supper
    • Anand HaridassAndreas HuberErich KlinkJochen Supper
    • G06F17/50
    • G06F17/5045G06F2217/78
    • A system and method for automatic insertion of on-chip decoupling capacitors are provided. With the system and method, an integrated circuit design is partitioned into cells and the noise distribution per cell of an integrated circuit is determined. This noise distribution may be generated using any of a number of different known mechanisms and generally results in a noise-map being generated for the integrated circuit. Thereafter, a mapping function is applied to the noise map for each cell to determine a required capacitance for the cells of the integrated circuit. From this required capacitance per cell, the necessary decoupling capacitors may be identified as well as the location for insertion of these decoupling capacitors. In a similar manner, decoupling capacitors may be removed from cells of the integrated circuit based upon the determined required capacitance per cell.
    • 提供一种用于自动插入片上去耦电容器的系统和方法。 利用该系统和方法,将集成电路设计划分为单元,确定集成电路的每个单元的噪声分布。 该噪声分布可以使用多个不同的已知机构中的任何一个产生,并且通常导致为集成电路产生噪声映射。 此后,将映射函数应用于每个单元的噪声图,以确定集成电路的单元所需的电容。 根据每个电池所需的电容,可以识别必要的去耦电容以及插入这些去耦电容器的位置。 以类似的方式,可以基于每个单元所确定的所需电容从集成电路的单元去除去耦电容器。
    • 7. 发明授权
    • Design method and system for minimizing blind via current loops
    • 通过电流回路最小化设计方法和系统
    • US07765504B2
    • 2010-07-27
    • US11829179
    • 2007-07-27
    • Daniel DourietAnand HaridassAndreas HuberRoger D. Weekly
    • Daniel DourietAnand HaridassAndreas HuberRoger D. Weekly
    • G06F17/50
    • G06F17/5081H05K1/0216H05K1/115H05K3/0005H05K2201/09636
    • A design method and system for minimizing blind via current loops provides for improvement of electrical interconnect structure design without requiring extensive electromagnetic analysis. Other vias in the vicinity of a blind via carrying a critical signal are checked for suitability to conduct return current corresponding to the critical signal that is disrupted by the transition from a layer between two metal planes to another layer. The distance to the return current via(s) is checked and the design is adjusted to reduce the distance if the distance is greater than a specified threshold. If the blind via transition is to an external layer, suitable vias connect the reference plane at the internal end of the blind via to an external terminal. If the transition is between internal layers, suitable vias are vias that connect the two reference planes surrounding the reference plane traversed by the blind via.
    • 用于最小化盲通过电流回路的设计方法和系统提供了电互连结构设计的改进,而不需要广泛的电磁分析。 检查通过携带关键信号的盲目附近的其他通孔是否​​适合于进行对应于由两个金属平面之间的层到另一层之间的过渡而被破坏的关键信号的返回电流。 检查通过(s)的返回电流的距离,并且如果距离大于指定的阈值,则设计被调整以减小距离。 如果盲目通过转换到外部层,合适的通孔将盲通孔内部的参考平面连接到外部端子。 如果过渡在内层之间,合适的通孔是连接围绕由盲孔通过的参考平面的两个参考平面的通孔。