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    • 6. 发明申请
    • SRAM VOLTAGE CONTROL FOR IMPROVED OPERATIONAL MARGINS
    • 用于改进操作标准的SRAM电压控制
    • US20070121370A1
    • 2007-05-31
    • US11164556
    • 2005-11-29
    • Wayne EllisRandy MannDavid WagerRobert Wong
    • Wayne EllisRandy MannDavid WagerRobert Wong
    • G11C11/00
    • G11C5/14G11C11/413
    • A static random access memory (“SRAM”) is provided which includes a plurality of SRAM cells arranged in an array. The array includes a plurality of rows and a plurality of columns. The SRAM includes a plurality of voltage control corresponding to respective ones of the plurality of columns of the array. Each of the plurality of voltage control circuits are coupled to an output of a power supply, each voltage control circuit having a function to temporarily reduce a voltage provided to power supply inputs of a plurality of SRAM cells that belong to a selected column of columns of the SRAM. The selected column is selected and the power supply voltage to that column is reduced during a write operation in which a bit is written to one of the SRAM cells belonging to the selected column.
    • 提供了包括以阵列布置的多个SRAM单元的静态随机存取存储器(“SRAM”)。 阵列包括多个行和多个列。 SRAM包括对应于阵列的多个列中的相应列的多个电压控制。 多个电压控制电路中的每一个耦合到电源的输出,每个电压控制电路具有临时降低提供给属于所选列列的多个SRAM单元的电源输入的电压的功能 SRAM。 选择的列被选择,并且在将位写入属于所选列的SRAM单元之一的写操作期间,该列的电源电压减小。
    • 10. 发明申请
    • SINGLE STRESS LINER FOR MIGRATION STABILITY AND SPEED
    • 用于移动稳定性和速度的单应力衬管
    • US20070164365A1
    • 2007-07-19
    • US11306943
    • 2006-01-17
    • Joseph ChanRobert Wong
    • Joseph ChanRobert Wong
    • H01L29/94
    • H01L27/1104H01L29/7843
    • A single stress liner is applied over different type semiconductor devices. The single stress liner avoids the problems of a dual/hybrid stress liner scheme by eliminating the meeting area. The single stress liner may be tensile or compressive. In one embodiment, the semiconductor device includes a static random access memory (SRAM) cell having numerous NFETs and PFETs. In this case, a compressive liner is placed over the SRAM cell, which is normally not ideal for the NFETs therein, but is desirable for the SRAM cell because continued miniaturization of the SRAMs typically requires slowing of the NFETs for the SRAM to maintain stabile. Where SRAM cells require increased speed, a single tensile stress liner can be implemented.
    • 单个应力衬垫施加在不同类型的半导体器件上。 单应力衬垫通过消除会议面积避免双重/混合应力衬垫方案的问题。 单个应力衬垫可以是拉伸或压缩的。 在一个实施例中,半导体器件包括具有许多NFET和PFET的静态随机存取存储器(SRAM)单元。 在这种情况下,压电衬垫放置在SRAM单元上,这对于其中的NFET通常不是理想的,但是对于SRAM单元来说是理想的,因为SRAM的继续小型化通常需要NSTS缓慢以使SRAM保持稳定。 在SRAM单元需要增加速度的情况下,可以实现单个拉伸应力衬垫。