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    • 5. 发明申请
    • Word line voltage boosting circuit and a memory array incorporating same
    • US20070076489A1
    • 2007-04-05
    • US11241582
    • 2005-09-30
    • Ya-Fen LinElbert LinHieu TranJack FrayerBomy Chen
    • Ya-Fen LinElbert LinHieu TranJack FrayerBomy Chen
    • G11C11/34
    • G11C8/08G11C16/08
    • A first embodiment of a word line voltage boosting circuit for use with an array of non-volatile memory cells has a capacitor, having two ends, connected to the word line. One end of the capacitor is electrically connected to the word line. The other end of the capacitor is electrically connected to a first voltage source. The word line is also connected through a switch to a second source voltage source. A sequencing circuit activates the switch such that the word line is connected to the second voltage source, and the other end of the capacitor is not connected to the first voltage source. Then the sequencing circuit causes the switch to disconnect the word line from the second voltage source, and connect the second end of the capacitor to the first voltage source. The alternate switching of the connection boosts the voltage on the word line. In a second embodiment, a first word line is electrically connected to a first switch to a first voltage source. An adjacent word line, capacitively coupled to the first word line, is electrically connected to a second switch to a second voltage source. A sequencing circuit activates the first switch and the second switch such that the first word line is connected to the first voltage source, and the second word line is disconnected from the second voltage source. Then the sequencing circuit causes the first switch to disconnect the first word line from the first voltage source, and causes the second word line to be electrically connected to the second voltage source. The alternate switching of the connection boosts the voltage on the first word line, caused by its capacitive coupling to the second word line. A boosted voltage on the word line may be used to improve cycling and yield, where the memory cells of the array are of the floating gate type and erase through the mechanism of Fowler-Nordheim tunneling from the floating gate to a control gate which is connected to the word line.
    • 6. 发明申请
    • Isolation-less, contact-less array of nonvolatile memory cells each having a floating gate for storage of charges, and methods of manufacturing, and operating therefor
    • 非易失性存储单元的无隔离阵列,每个非易失性存储单元均具有用于存储电荷的浮动栅极,以及制造方法和操作方法
    • US20050224861A1
    • 2005-10-13
    • US10822944
    • 2004-04-12
    • Dana LeeHieu TranJack Frayer
    • Dana LeeHieu TranJack Frayer
    • H01L21/8247G11C16/04G11C16/14H01L21/28H01L21/336H01L27/10H01L27/115H01L29/423H01L29/788H01L29/792
    • H01L29/7881G11C16/0433G11C16/0458G11C16/0491G11C16/14H01L21/28273H01L27/115H01L27/11556H01L29/42328H01L29/42336H01L29/7887
    • An isolation-less, contact-less nonvolatile memory array has a plurality of memory cells each with a floating gate for the storage of charges thereon, arranged in a plurality of rows and columns. Each memory cell can be of a number of different types. All the bit lines and source lines of the various embodiments are buried and are contact-less. In a first embodiment, each cell can be represented by a stacked gate floating gate transistor coupled to a separate assist transistor. The entire array can be planar; or in a preferred embodiment each of the floating gate transistors is in a trench; or each of the assist transistors is in a trench. In a second embodiment, each cell can be represented by a stacked gate floating gate transistor with the transistor in a trench. In a third embodiment, each cell can be represented by two stacked gate floating gate transistors coupled to a separate assist transistor, positioned between the two stacked gate floating gate transistors. The entire array can be planar; or in a preferred embodiment each of the floating gate transistors is in a trench; or each of the assist transistors is in a trench. Novel methods to manufacture the arrays and methods to program, erase, and read each of these embodiments of the memory cells is disclosed.
    • 无隔离的非接触式非易失性存储器阵列具有多个存储单元,每个存储单元具有用于在其上存储电荷的浮动栅极,其布置成多个行和列。 每个存储单元可以是多种不同的类型。 各种实施例的所有位线和源极线被掩埋并且是无接触的。 在第一实施例中,每个单元可以由耦合到单独的辅助晶体管的堆叠栅极浮栅晶体管表示。 整个阵列可以是平面的; 或者在优选实施例中,每个浮栅晶体管处于沟槽中; 或者每个辅助晶体管处于沟槽中。 在第二实施例中,每个单元可以由晶体管在沟槽中的层叠栅极浮栅晶体管表示。 在第三实施例中,每个单元可以由耦合到位于两个堆叠的栅极浮置栅极晶体管之间的单独的辅助晶体管的两个堆叠的栅极浮栅晶体管表示。 整个阵列可以是平面的; 或者在优选实施例中,每个浮栅晶体管处于沟槽中; 或者每个辅助晶体管处于沟槽中。 公开了制造阵列的新方法和编程,擦除和读取存储器单元的这些实施例的每一个的方法。
    • 9. 发明申请
    • Integrated semiconductor metal-insulator-semiconductor capacitor
    • 集成半导体金属绝缘体 - 半导体电容器
    • US20060017084A1
    • 2006-01-26
    • US10897045
    • 2004-07-22
    • Feng GaoChangyuan ChenVishal SarinWilliam SaikiHieu TranDana Lee
    • Feng GaoChangyuan ChenVishal SarinWilliam SaikiHieu TranDana Lee
    • H01L29/76
    • H01L27/0805H01L27/0811H01L29/94
    • An integrated MIS capacitor has two substantially identical MIS capacitors. A first capacitor comprises a first region of a first conductivity type adjacent to a channel region of the first conductivity type in a semiconductor substrate. The semiconductor substrate has a second conductivity type. A gate electrode is insulated and spaced apart from the channel region of the first capacitor. The second capacitor is substantially identical to the first capacitor and is formed in the same semiconductor substrate. The gate electrode of the first capacitor is electrically connected to the first region of the second capacitor and the gate electrode of the second capacitor is electrically connected to the first region of the first capacitor. In this manner, the capacitors are connected in an anti-parallel configuration. A capacitor which has high capacitance densities, low process complexity, ambipolar operation, low voltage and temperature coefficient, low external parasitic resistance and capacitance and good matching characteristics for use in analog designs that can be integrated with existing semiconductor processes results.
    • 集成的MIS电容器具有两个基本相同的MIS电容器。 第一电容器包括在半导体衬底中与第一导电类型的沟道区相邻的第一导电类型的第一区域。 半导体衬底具有第二导电类型。 栅电极与第一电容器的沟道区隔离并隔开。 第二电容器基本上与第一电容器相同,并且形成在相同的半导体衬底中。 第一电容器的栅电极电连接到第二电容器的第一区域,并且第二电容器的栅极电连接到第一电容器的第一区域。 以这种方式,电容器以反并联配置连接。 具有高电容密度,低工艺复杂性,双极性操作,低电压和温度系数,低外部寄生电阻和电容以及用于可与现有半导体工艺结合的模拟设计的良好匹配特性的电容器。