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    • 1. 发明授权
    • Very low voltage reference circuit
    • 极低电压参考电路
    • US08264214B1
    • 2012-09-11
    • US13051648
    • 2011-03-18
    • Albert RatnakumarQi XiangSimardeep MaangatJun Liu
    • Albert RatnakumarQi XiangSimardeep MaangatJun Liu
    • G05F3/16
    • G05F3/30
    • A low-voltage reference circuit may have a pair of semiconductor devices. Each semiconductor device may have an n-type semiconductor region, an n+ region in the n-type semiconductor region, a metal gate, and a gate insulator interposed between the metal gate and the n-type semiconductor region through which carriers tunnel. The metal gate may have a work function matching that of p-type polysilicon. The gate insulator may have a thickness of less than about 25 angstroms. The metal gate may form a first terminal for the semiconductor device and the n+ region and n-type semiconductor region may form a second terminal for the semiconductor device. The second terminals may be coupled to ground. A biasing circuit may use the first terminals to supply different currents to the semiconductor devices and may provide a corresponding reference output voltage at a value that is less than one volt.
    • 低压参考电路可以具有一对半导体器件。 每个半导体器件可以具有n型半导体区域,n型半导体区域中的n +区域,金属栅极和介于金属栅极和n型半导体区域之间的栅极绝缘体,载流子穿过该栅极绝缘体。 金属栅极可以具有与p型多晶硅相匹配的功函数。 栅极绝缘体可以具有小于约25埃的厚度。 金属栅极可以形成用于半导体器件的第一端子,并且n +区域和n型半导体区域可以形成用于半导体器件的第二端子。 第二端子可以接地。 偏置电路可以使用第一端子来向半导体器件提供不同的电流,并且可以将相应的参考输出电压提供在小于1伏的值。
    • 2. 发明申请
    • VERY LOW VOLTAGE REFERENCE CIRCUIT
    • 非常低的电压参考电路
    • US20120235662A1
    • 2012-09-20
    • US13051648
    • 2011-03-18
    • Albert RatnakumarQi XiangSimardeep MaangatJun Liu
    • Albert RatnakumarQi XiangSimardeep MaangatJun Liu
    • G05F3/02
    • G05F3/30
    • A low-voltage reference circuit may have a pair of semiconductor devices. Each semiconductor device may have an n-type semiconductor region, an n+ region in the n-type semiconductor region, a metal gate, and a gate insulator interposed between the metal gate and the n-type semiconductor region through which carriers tunnel. The metal gate may have a work function matching that of p-type polysilicon. The gate insulator may have a thickness of less than about 25 angstroms. The metal gate may form a first terminal for the semiconductor device and the n+ region and n-type semiconductor region may form a second terminal for the semiconductor device. The second terminals may be coupled to ground. A biasing circuit may use the first terminals to supply different currents to the semiconductor devices and may provide a corresponding reference output voltage at a value that is less than one volt.
    • 低压参考电路可以具有一对半导体器件。 每个半导体器件可以具有n型半导体区域,n型半导体区域中的n +区域,金属栅极和介于金属栅极和n型半导体区域之间的栅极绝缘体,载流子穿过该栅极绝缘体。 金属栅极可以具有与p型多晶硅相匹配的功函数。 栅极绝缘体可以具有小于约25埃的厚度。 金属栅极可以形成用于半导体器件的第一端子,并且n +区域和n型半导体区域可以形成用于半导体器件的第二端子。 第二端子可以接地。 偏置电路可以使用第一端子来向半导体器件提供不同的电流,并且可以将相应的参考输出电压提供在小于1伏的值。
    • 4. 发明授权
    • Mixed-gate metal-oxide-semiconductor varactors
    • 混合栅极金属氧化物半导体变容二极管
    • US08242581B1
    • 2012-08-14
    • US12324793
    • 2008-11-26
    • Albert RatnakumarWilson WongJun LiuQi XiangJeffrey Xiaoqi Tung
    • Albert RatnakumarWilson WongJun LiuQi XiangJeffrey Xiaoqi Tung
    • H01L29/93
    • H01L29/94H01L29/4983H01L29/93
    • Mixed gate varactors are provided. The mixed gate varactors may include a semiconductor region of a given doping type. A first terminal for the varactor may be formed from a gate structure on the semiconductor region. A second terminal for the varactor may be formed from a heavily doped region in the semiconductor region that has the same doping type as the given doping type. A third terminal for the varactor may be formed from a heavily doped region in the semiconductor region that has a different doping type than the given doping type. The gate structure may include multiple gate conductors on a gate insulator. The gate insulator may be a high-K dielectric. The gate conductors may be metals or other materials that have different work functions. A conductive layer such as a layer of polysilicon may electrically connect the first and second gate conductors.
    • 提供混合栅极变容二极管。 混合栅极变容二极管可以包括给定掺杂型的半导体区域。 用于变容二极管的第一端可以由半导体区域上的栅极结构形成。 用于变容二极管的第二端子可以由具有与给定掺杂类型相同的掺杂类型的半导体区域中的重掺杂区域形成。 用于变容二极管的第三端子可以由具有与给定掺杂类型不同的掺杂类型的半导体区域中的重掺杂区域形成。 栅极结构可以包括栅极绝缘体上的多个栅极导体。 栅极绝缘体可以是高K电介质。 栅极导体可以是具有不同功函数的金属或其它材料。 诸如多晶硅层的导电层可电连接第一和第二栅极导体。
    • 5. 发明授权
    • Memory element transistors with reversed-workfunction gate conductors
    • 具有反功能栅极导体的存储元件晶体管
    • US08530976B1
    • 2013-09-10
    • US13113896
    • 2011-05-23
    • Albert RatnakumarQi XiangJun Liu
    • Albert RatnakumarQi XiangJun Liu
    • H01L21/70
    • H01L29/7833H01L21/823842H01L27/1104
    • Integrated circuits may be provided that include memory elements that produce output control signals and corresponding programmable logic circuitry that receives the output control signals from the memory elements. The memory elements may include bistable storage elements formed from circuits such as cross-coupled inverters. The inverters may include n-channel metal-oxide-semiconductor transistors with p-metal gate conductors and n-channel metal-oxide-semiconductor transistors with p-metal gate conductors. These gate conductor assignments are the reverse of the gate conductor assignments used in the n-channel and p-channel transistors in other circuitry such as the programmable logic circuitry. The reversed gate conductor assignments increase the threshold voltages of the transistors in the memory elements to improve reliability in scenarios in which the memory elements are overdriving pass transistors in the programmable logic circuitry.
    • 可以提供集成电路,其包括产生输出控制信号的存储器元件和从存储器元件接收输出控制信号的相应的可编程逻辑电路。 存储器元件可以包括由诸如交叉耦合的反相器的电路形成的双稳态存储元件。 反相器可以包括具有p金属栅极导体的n沟道金属氧化物半导体晶体管和具有p型金属栅极导体的n沟道金属氧化物半导体晶体管。 这些栅极导体分配与在诸如可编程逻辑电路的其它电路中的n沟道和p沟道晶体管中使用的栅极导体分配相反。 反向栅极导体分配增加存储器元件中的晶体管的阈值电压,以提高存储元件过驱动可编程逻辑电路中的通过晶体管的情况下的可靠性。
    • 9. 发明授权
    • Stressed transistors with reduced leakage
    • 压力降低的晶体管泄漏
    • US08138791B1
    • 2012-03-20
    • US12694603
    • 2010-01-27
    • Albert RatnakumarJun LiuJeffrey Xiaoqi TungQi Xiang
    • Albert RatnakumarJun LiuJeffrey Xiaoqi TungQi Xiang
    • H03K19/177
    • H03K19/0008H01L27/11807H01L29/78H01L29/7843H01L29/7847H01L29/7848
    • Integrated circuits with stressed transistors are provided. Stressing transistors may increase transistor threshold voltage without the need to increase channel doping. Stressing transistors may reduce total leakage currents. It may be desirable to compressively stress N-channel metal-oxide-semiconductor (NMOS) transistors and tensilely stress P-channel metal-oxide-semiconductor (PMOS) transistors to reduce leakage currents. Techniques that can be used to alter the amount of stressed experienced by transistors may include forming a stress-inducing layer, forming a stress liner, forming diffusion active regions using silicon germanium, silicon carbon, or standard silicon, implementing transistors in single-finger instead of multi-finger configurations, and implanting particles. Any combination of these techniques may be used to provide appropriate amounts of stress to increase the performance or decrease the total leakage current of a transistor.
    • 提供了具有应力晶体管的集成电路。 应力晶体管可以增加晶体管阈值电压,而不需要增加沟道掺杂。 应力晶体管可能会减少总漏电流。 可能需要压缩应力N沟道金属氧化物半导体(NMOS)晶体管和拉伸应力P沟道金属氧化物半导体(PMOS)晶体管以减少漏电流。 可用于改变晶体管经受的应力的技术可包括形成应力诱导层,形成应力衬垫,使用硅锗,硅碳或标准硅形成扩散有源区,以单指代替晶体管 的多指配置和植入颗粒。 可以使用这些技术的任何组合来提供适当量的应力以增加晶体管的性能或降低总泄漏电流。