会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Integrated circuits with asymmetric pass transistors
    • 具有不对称传输晶体管的集成电路
    • US08921170B1
    • 2014-12-30
    • US13408959
    • 2012-02-29
    • Jun LiuAlbert RatnakumarMark T. ChanIrfan Rahim
    • Jun LiuAlbert RatnakumarMark T. ChanIrfan Rahim
    • H01L21/338
    • H01L21/823418H01L21/324H01L21/823814H01L27/082H01L27/088H01L29/1083H01L29/6653H01L29/66659
    • Asymmetric transistors such as asymmetric pass transistors may be formed on an integrated circuit. The asymmetric transistors may have gate structures. Symmetric pocket implants may be formed in source-drains on opposing sides of each transistor gate structure. Selective heating may be used to asymmetrically diffuse the implants. Selective heating may be implemented by patterning the gate structures on a semiconductor substrate so that the spacing between adjacent gate structures varies. A given gate structure may be located between first and second adjacent gate structures spaced at different respective distances from the given gate structure. A larger gate structure spacing leads to a greater substrate temperature rise than a smaller gate structure spacing. The pocket implant diffuses more in portions of the substrate with the greater temperature rise, producing asymmetric transistors. Asymmetric pass transistors may be controlled by static control signals from memory elements to implement circuits such as programmable multiplexers.
    • 不对称晶体管,例如不对称传输晶体管可以形成在集成电路上。 不对称晶体管可以具有栅极结构。 可以在每个晶体管栅极结构的相对侧上的源极漏极中形成对称的袋状植入物。 选择性加热可用于不对称地扩散植入物。 可以通过在半导体衬底上图案化栅极结构来实现选择性加热,使得相邻栅极结构之间的间隔变化。 给定的栅极结构可以位于与给定栅极结构不同的相应距离处间隔开的第一和第二相邻栅极结构之间。 较大的栅极结构间隔导致比较小栅极结构间隔更大的衬底温度升高。 在较大的温度上升的情况下,口袋植入物在衬底的部分扩散,产生不对称晶体管。 不对称传输晶体管可以由来自存储器元件的静态控制信号来控制,以实现诸如可编程多路复用器之类的电路。
    • 5. 发明授权
    • Integrated circuits with asymmetric pass transistors
    • 具有不对称传输晶体管的集成电路
    • US08138797B1
    • 2012-03-20
    • US12790660
    • 2010-05-28
    • Jun LiuAlbert RatnakumarMark T. ChanIrfan Rahim
    • Jun LiuAlbert RatnakumarMark T. ChanIrfan Rahim
    • H01L25/00H03K19/00
    • H01L21/823418H01L21/324H01L21/823814H01L27/082H01L27/088H01L29/1083H01L29/6653H01L29/66659
    • Asymmetric transistors such as asymmetric pass transistors may be formed on an integrated circuit. The asymmetric transistors may have gate structures. Symmetric pocket implants may be formed in source-drains on opposing sides of each transistor gate structure. Selective heating may be used to asymmetrically diffuse the implants. Selective heating may be implemented by patterning the gate structures on a semiconductor substrate so that the spacing between adjacent gate structures varies. A given gate structure may be located between first and second adjacent gate structures spaced at different respective distances from the given gate structure. A larger gate structure spacing leads to a greater substrate temperature rise than a smaller gate structure spacing. The pocket implant diffuses more in portions of the substrate with the greater temperature rise, producing asymmetric transistors. Asymmetric pass transistors may be controlled by static control signals from memory elements to implement circuits such as programmable multiplexers.
    • 不对称晶体管,例如不对称传输晶体管可以形成在集成电路上。 不对称晶体管可以具有栅极结构。 可以在每个晶体管栅极结构的相对侧上的源极漏极中形成对称的袋状植入物。 选择性加热可用于不对称地扩散植入物。 可以通过在半导体衬底上图案化栅极结构来实现选择性加热,使得相邻栅极结构之间的间隔变化。 给定的栅极结构可以位于与给定栅极结构不同的相应距离处间隔开的第一和第二相邻栅极结构之间。 较大的栅极结构间隔导致比较小栅极结构间隔更大的衬底温度升高。 在较大的温度上升的情况下,口袋植入物在衬底的部分扩散,产生不对称晶体管。 不对称传输晶体管可以由来自存储器元件的静态控制信号来控制,以实现诸如可编程多路复用器之类的电路。
    • 6. 发明授权
    • Programmable integrated circuit with thin-oxide passgates
    • 可编程集成电路与薄氧化物通风门
    • US08633731B1
    • 2014-01-21
    • US13206401
    • 2011-08-09
    • Irfan RahimMao DuJeffrey Xiaoqi TungJun LiuQi Xiang
    • Irfan RahimMao DuJeffrey Xiaoqi TungJun LiuQi Xiang
    • G06F7/38
    • H03K19/1733G11C8/16G11C11/419
    • Integrated circuits such as programmable integrated circuits may have configuration random-access memory elements. The configuration random-access memory elements may be loaded with configuration data to customize programmable circuitry on the integrated circuits. Each memory element may have a bistable element that is powered using a positive power supply voltage and a negative power supply voltage. Programmable transistors in the programmable circuitry may have gates coupled to outputs of the bistable elements. The programmable transistors may have gate insulators that are thinner than gate insulators in the transistors of the bistable elements and may have threshold voltages of about zero volts. During operation, some of the configuration random-access memory elements may supply negative voltages to their associated programmable transistors so that the programmable transistors are provided with gate-source voltages of less than zero volts.
    • 诸如可编程集成电路的集成电路可以具有配置随机存取存储器元件。 配置随机存取存储器元件可以被加载配置数据以定制集成电路上的可编程电路。 每个存储元件可以具有使用正电源电压和负电源电压供电的双稳态元件。 可编程电路中的可编程晶体管可以具有耦合到双稳态元件的输出的栅极。 可编程晶体管可以具有比双稳态元件的晶体管中的栅极绝缘体更薄的栅极绝缘体,并且可以具有约零伏特的阈值电压。 在操作期间,一些配置随机存取存储器元件可以向其相关联的可编程晶体管提供负电压,使得可编程晶体管具有小于零伏的栅极 - 源极电压。
    • 8. 发明授权
    • Memory elements with relay devices
    • 具有中继设备的存储器元件
    • US08611137B2
    • 2013-12-17
    • US13304226
    • 2011-11-23
    • Lin-Shih LiuMark T. ChanYanzhong XuIrfan RahimJeffrey T. Watt
    • Lin-Shih LiuMark T. ChanYanzhong XuIrfan RahimJeffrey T. Watt
    • G11C11/00
    • G11C11/52B82Y10/00G11C13/025G11C23/00H01H1/0094H01H1/20H01H59/0009H01L27/101H01L27/11
    • Integrated circuits with memory elements are provided. An integrated circuit may include logic circuitry formed in a first portion having complementary metal-oxide-semiconductor (CMOS) devices and may include at least a portion of the memory elements and associated memory circuitry formed in a second portion having nano-electromechanical (NEM) relay devices. The NEM and CMOS devices may be interconnected through vias in a dielectric stack. Devices in the first and second portions may receive respective power supply voltages. In one suitable arrangement, the memory elements may include two relay switches that provide nonvolatile storage characteristics and soft error upset (SEU) immunity. In another suitable arrangement, the memory elements may include first and second cross-coupled inverting circuits. The first inverting circuit may include relay switches, whereas the second inverting circuit includes only CMOS transistors. Memory elements configured in this way may be used to provide volatile storage characteristics and SEU immunity.
    • 提供具有存储元件的集成电路。 集成电路可以包括形成在具有互补金属氧化物半导体(CMOS)器件的第一部分中的逻辑电路,并且可以包括形成在具有纳米机电(NEM)器件的第二部分中的存储器元件和相关联的存储器电路的至少一部分, 中继设备 NEM和CMOS器件可以通过介电堆叠中的通孔互连。 第一和第二部分中的装置可以接收相应的电源电压。 在一个合适的布置中,存储器元件可以包括提供非易失性存储特性和软错误失真(SEU)抗扰性的两个继电器开关。 在另一种合适的布置中,存储元件可以包括第一和第二交叉耦合反相电路。 第一反相电路可以包括继电器开关,而第二反相电路仅包括CMOS晶体管。 以这种方式配置的存储器元件可用于提供易失性存储特性和SEU抗扰度。
    • 9. 发明授权
    • Configuration random access memory
    • 配置随机存取存储器
    • US08030962B2
    • 2011-10-04
    • US12868575
    • 2010-08-25
    • Irfan RahimAndy L. LeeMyron Wai WongWilliam Bradley VestJeffrey T. Watt
    • Irfan RahimAndy L. LeeMyron Wai WongWilliam Bradley VestJeffrey T. Watt
    • H03K19/173
    • H03K19/1776G11C11/401G11C11/404G11C14/00H03K19/1778
    • Integrated circuits such as programmable logic device integrated circuits are provided that have configuration random-access memory elements. The configuration random-access memory elements are loaded with configuration data to customize programmable logic on the integrated circuits. Each memory element has a capacitor that stores data for that memory element. A pair of cross-coupled inverters are connected to the capacitor. The inverters ensure that the memory elements produce output control signals with voltages than range from one power supply rail to another. Each configuration random-access memory element may have a clear transistor. The capacitor may be formed in a dielectric layer that lies above the transistors of the inverters, the address transistor, and the clear transistor. The inverters may be powered with an elevated power supply voltage.
    • 提供了诸如可编程逻辑器件集成电路的集成电路,其具有配置随机存取存储器元件。 配置随机存取存储器元件装载有配置数据以在集成电路上定制可编程逻辑。 每个存储器元件具有存储该存储器元件的数据的电容器。 一对交叉耦合的反相器连接到电容器。 逆变器确保存储元件产生的输出控制信号的电压低于从一个电源轨到另一个电源的范围。 每个配置随机存取存储器元件可以具有透明晶体管。 电容器可以形成在位于反相器,地址晶体管和透明晶体管的晶体管之上的电介质层中。 逆变器可以用升高的电源电压供电。
    • 10. 发明授权
    • Integrated circuit well isolation structures
    • 集成电路阱隔离结构
    • US07902611B1
    • 2011-03-08
    • US11998016
    • 2007-11-27
    • Irfan RahimBradley JensenPeter J. McElheny
    • Irfan RahimBradley JensenPeter J. McElheny
    • H01L21/70H01L23/52H01L29/00
    • H01L27/0928H01L21/76224H01L21/765H01L21/823878H01L21/823892
    • An integrated circuit is provided with transistor body regions that may be independently biased. Some of the bodies may be forward body biased to lower threshold voltages and increase transistor switching speed. Some of the bodies may be reverse body biased to increase threshold voltages and decrease leakage current. The integrated circuit may be formed on a silicon substrate. Body bias isolation structures may be formed in the silicon substrate to isolate the bodies from each other. Body bias isolation structures may be formed from shallow trench isolation trenches. Doped regions may be formed at the bottom of the trenches using ion implantation. Oxide may be used to fill the trenches above the doped region. A deep well may be formed under the body regions. The deep well may contact the doped regions that are formed at the bottom of the trenches.
    • 集成电路设置有可独立偏置的晶体管本体区域。 一些物体可能被向前偏置,以降低阈值电压并增加晶体管切换速度。 一些物体可能被反向体偏置以增加阈值电压并减小漏电流。 集成电路可以形成在硅衬底上。 可以在硅衬底中形成体偏置隔离结构以将体彼此隔离。 体偏置隔离结构可以由浅沟槽隔离沟槽形成。 可以使用离子注入在沟槽的底部形成掺杂区域。 氧化物可用于填充掺杂区域上方的沟槽。 可以在身体区域下方形成深井。 深阱可以接触形成在沟槽底部的掺杂区域。