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    • 2. 发明授权
    • One or multiple-times programmable device
    • 一个或多个可编程器件
    • US07535758B2
    • 2009-05-19
    • US11703922
    • 2007-02-06
    • Albert BergemontDavid Kuan-Yu LiuVenkatraman Prabhakar
    • Albert BergemontDavid Kuan-Yu LiuVenkatraman Prabhakar
    • G11C16/04
    • H01L29/7885G11C16/0416H01L21/28273H01L27/115H01L27/11521H01L29/42324
    • Methods and apparatus, including computer program products, for a one or multiple-times programmable memory device. A semiconductor may include an active region of a substrate, a thin oxide layer over a substrate, a first and second polysilicon layer, and a first and second metal layer. The first polysilicon layer may have a floating gate, the active region may be substantially perpendicular to the floating gate, and the second polysilicon layer may include a control gate. The first metal layer may include a bit line connected to a first n-diffused region, where the bit line is substantially perpendicular to the floating gate. The second metal layer may include a word line and source line. The word line may be connected to the control gate, and the source line may be connected to a second n-diffused region. The thin gate oxide may have a thickness between 65 and 75 angstroms.
    • 用于一次或多次可编程存储器件的方法和装置,包括计算机程序产品。 半导体可以包括衬底的有源区,衬底上的薄氧化层,第一和第二多晶硅层以及第一和第二金属层。 第一多晶硅层可以具有浮置栅极,有源区可以基本上垂直于浮置栅极,并且第二多晶硅层可以包括控制栅极。 第一金属层可以包括连接到第一n扩散区域的位线,其中位线基本上垂直于浮动栅极。 第二金属层可以包括字线和源极线。 字线可以连接到控制栅极,并且源极线可以连接到第二n扩散区域。 薄栅氧化物可以具有65和75埃之间的厚度。
    • 3. 发明申请
    • One or multiple-times programmable device
    • 一个或多个可编程器件
    • US20080186773A1
    • 2008-08-07
    • US11703922
    • 2007-02-06
    • Albert BergemontDavid Kuan-Yu LiuVenkatraman Prabhakar
    • Albert BergemontDavid Kuan-Yu LiuVenkatraman Prabhakar
    • G11C16/06H01L21/336H01L29/788
    • H01L29/7885G11C16/0416H01L21/28273H01L27/115H01L27/11521H01L29/42324
    • Methods and apparatus, including computer program products, for a one or multiple-times programmable memory device. A semiconductor may include an active region of a substrate, a thin oxide layer over a substrate, a first and second polysilicon layer, and a first and second metal layer. The first polysilicon layer may have a floating gate, the active region may be substantially perpendicular to the floating gate, and the second polysilicon layer may include a control gate. The first metal layer may include a bit line connected to a first n-diffused region, where the bit line is substantially perpendicular to the floating gate. The second metal layer may include a word line and source line. The word line may be connected to the control gate, and the source line may be connected to a second n-diffused region. The thin gate oxide may have a thickness between 65 and 75 angstroms.
    • 用于一次或多次可编程存储器件的方法和装置,包括计算机程序产品。 半导体可以包括衬底的有源区,衬底上的薄氧化层,第一和第二多晶硅层以及第一和第二金属层。 第一多晶硅层可以具有浮置栅极,有源区可以基本上垂直于浮置栅极,并且第二多晶硅层可以包括控制栅极。 第一金属层可以包括连接到第一n扩散区域的位线,其中位线基本上垂直于浮动栅极。 第二金属层可以包括字线和源极线。 字线可以连接到控制栅极,并且源极线可以连接到第二n扩散区域。 薄栅氧化物可以具有65和75埃之间的厚度。
    • 4. 发明申请
    • METHOD OF ERASING A BLOCK OF MEMORY CELLS
    • 擦除记忆细胞块的方法
    • US20080273401A1
    • 2008-11-06
    • US12168863
    • 2008-07-07
    • Nirmal RatnakumarVenkatraman PrabhakarDavid Kuan-Yu Liu
    • Nirmal RatnakumarVenkatraman PrabhakarDavid Kuan-Yu Liu
    • G11C16/16
    • G11C16/0441G11C16/3427G11C2216/10H01L27/115H01L27/11521H01L27/11558
    • A memory device including a plurality of memory cells, each with a control gate NMOS transistor sharing a floating gate with a program/erase PMOS transistor which is, in turn, connected in series with an access PMOS transistor. The memory cells are formed in a common N-Well formed in a P-substrate, the NMOS transistor being formed in a p-doped pocket or base. The program/erase PMOS includes a gate, and first and second P+ doped regions formed in the N-Well, wherein the first P+ region is electrically connected to a corresponding bit line. The access PMOS includes a gate, and first and second P+ regions formed within the N-Well, wherein the first P+ region is electrically connected to the second P+ region of the program/erase PMOS, and the gate is electrically connected to a corresponding word line. The control gate NMOS includes source, drain, and gate, wherein the source and third drain as well as the p-doped pocket are electrically connected to a corresponding control gate line, and the gate is electrically connected to the gate of the program/erase PMOS, forming floating gate of the cell.
    • 一种包括多个存储单元的存储器件,每个存储器单元具有与编程/擦除PMOS晶体管共享浮置栅极的控制栅极NMOS晶体管,该晶体管又与访问PMOS晶体管串联连接。 存储单元形成在形成在P基板中的公共N阱中,NMOS晶体管形成在p掺杂的凹穴或基底中。 编程/擦除PMOS包括栅极和形成在N阱中的第一和第二P +掺杂区域,其中第一P +区域电连接到相应的位线。 存取PMOS包括栅极和形成在N阱内的第一和第二P +区,其中第一P +区电连接到编程/擦除PMOS的第二P +区,并且栅极电连接到相应的字 线。 控制栅极NMOS包括源极,漏极和栅极,其中源极和第三漏极以及p掺杂的阱电连接到相应的控制栅极线,并且栅极电连接到编程/擦除的栅极 PMOS,形成电池的浮动栅极。
    • 5. 发明申请
    • EEPROM MEMORY CELL WITH FIRST-DOPANT-TYPE CONTROL GATE TRANSISTOR, AND SECOND-DOPANT TYPE PROGRAM/ERASE AND ACCESS TRANSISTORS FORMED IN COMMON WELL
    • 具有第一种类型控制栅极晶体管的EEPROM存储器单元和通常形成的第二种类型的程序/擦除和访问晶体管
    • US20090014772A1
    • 2009-01-15
    • US12233294
    • 2008-09-18
    • Nirmal RatnakumarVenkatraman PrabhakarDavid Kuan-Yu Liu
    • Nirmal RatnakumarVenkatraman PrabhakarDavid Kuan-Yu Liu
    • H01L29/788
    • G11C16/0441G11C16/3427G11C2216/10H01L27/115H01L27/11521H01L27/11558
    • A memory device including a plurality of memory cells, each with a control gate NMOS transistor sharing a floating gate with a program/erase PMOS transistor which is, in turn, connected in series with an access PMOS transistor. The memory cells are formed in a common N-Well formed in a P-substrate, the NMOS transistor being formed in a p-doped pocket or base. The program/erase PMOS includes a gate, and first and second P+ doped regions formed in the N-Well, wherein the first P+ region is electrically connected to a corresponding bit line. The access PMOS includes a gate, and first and second P+ regions formed within the N-Well, wherein the first P+ region is electrically connected to the second P+ region of the program/erase PMOS, and the gate is electrically connected to a corresponding word line. The control gate NMOS includes source, drain, and gate, wherein the source and third drain as well as the p-doped pocket are electrically connected to a corresponding control gate line, and the gate is electrically connected to the gate of the program/erase PMOS, forming floating gate of the cell.
    • 一种包括多个存储单元的存储器件,每个存储器单元具有与编程/擦除PMOS晶体管共享浮置栅极的控制栅极NMOS晶体管,该晶体管又与访问PMOS晶体管串联连接。 存储单元形成在形成在P基板中的公共N阱中,NMOS晶体管形成在p掺杂的凹穴或基底中。 编程/擦除PMOS包括栅极和形成在N阱中的第一和第二P +掺杂区域,其中第一P +区域电连接到相应的位线。 存取PMOS包括栅极和形成在N阱内的第一和第二P +区,其中第一P +区电连接到编程/擦除PMOS的第二P +区,栅极电连接到相应的字 线。 控制栅极NMOS包括源极,漏极和栅极,其中源极和第三漏极以及p掺杂的阱电连接到相应的控制栅极线,并且栅极电连接到编程/擦除的栅极 PMOS,形成电池的浮动栅极。
    • 6. 发明申请
    • METHOD OF PROGRAMMING A SELECTED MEMORY CELL
    • 编程选择的记忆细胞的方法
    • US20080273392A1
    • 2008-11-06
    • US12168858
    • 2008-07-07
    • Nirmal RatnakumarVenkatraman PrabhakarDavid Kuan-Yu Liu
    • Nirmal RatnakumarVenkatraman PrabhakarDavid Kuan-Yu Liu
    • G11C16/06
    • G11C16/0441G11C16/3427G11C2216/10H01L27/115H01L27/11521H01L27/11558
    • A memory device including a plurality of memory cells, each with a control gate NMOS transistor sharing a floating gate with a program/erase PMOS transistor which is, in turn, connected in series with an access PMOS transistor. The memory cells are formed in a common N-Well formed in a P-substrate, the NMOS transistor being formed in a p-doped pocket or base. The program/erase PMOS includes a gate, and first and second P+ doped regions formed in the N-Well, wherein the first P+ region is electrically connected to a corresponding bit line. The access PMOS includes a gate, and first and second P+ regions formed within the N-Well, wherein the first P+ region is electrically connected to the second P+ region of the program/erase PMOS, and the gate is electrically connected to a corresponding word line. The control gate NMOS includes source, drain, and gate, wherein the source and third drain as well as the p-doped pocket are electrically connected to a corresponding control gate line, and the gate is electrically connected to the gate of the program/erase PMOS, forming floating gate of the cell.
    • 一种包括多个存储单元的存储器件,每个存储器单元具有与编程/擦除PMOS晶体管共享浮置栅极的控制栅极NMOS晶体管,该晶体管又与访问PMOS晶体管串联连接。 存储单元形成在形成在P基板中的公共N阱中,NMOS晶体管形成在p掺杂的凹穴或基底中。 编程/擦除PMOS包括栅极和形成在N阱中的第一和第二P +掺杂区域,其中第一P +区域电连接到相应的位线。 存取PMOS包括栅极和形成在N阱内的第一和第二P +区,其中第一P +区电连接到编程/擦除PMOS的第二P +区,栅极电连接到相应的字 线。 控制栅极NMOS包括源极,漏极和栅极,其中源极和第三漏极以及p掺杂的阱电连接到相应的控制栅极线,并且栅极电连接到编程/擦除的栅极 PMOS,形成电池的浮动栅极。
    • 7. 发明授权
    • EEPROM memory device with cell having NMOS in a P pocket as a control gate, PMOS program/erase transistor, and PMOS access transistor in a common well
    • 具有在P口中具有NMOS的单元的EEPROM存储器件作为控制栅极,PMOS编程/擦除晶体管以及公共阱中的PMOS存取晶体管
    • US07436710B2
    • 2008-10-14
    • US11685111
    • 2007-03-12
    • Nirmal RatnakumarVenkatraman PrabhakarDavid Kuan-Yu Liu
    • Nirmal RatnakumarVenkatraman PrabhakarDavid Kuan-Yu Liu
    • G11C11/34
    • G11C16/0441G11C16/3427G11C2216/10H01L27/115H01L27/11521H01L27/11558
    • A memory device including a plurality of memory cells, each with a control gate NMOS transistor sharing a floating gate with a program/erase PMOS transistor which is, in turn, connected in series with an access PMOS transistor. The memory cells are formed in a common N-Well formed in a P-substrate, the NMOS transistor being formed in a p-doped pocket or base. The program/erase PMOS includes a gate, and first and second P+ doped regions formed in the N-Well, wherein the first P+ region is electrically connected to a corresponding bit line. The access PMOS includes a gate, and first and second P+ regions formed within the N-Well, wherein the first P+ region is electrically connected to the second P+ region of the program/erase PMOS, and the gate is electrically connected to a corresponding word line. The control gate NMOS includes source, drain, and gate, wherein the source and third drain as well as the p-doped pocket are electrically connected to a corresponding control gate line, and the gate is electrically connected to the gate of the program/erase PMOS, forming floating gate of the cell.
    • 一种包括多个存储单元的存储器件,每个存储器单元具有与编程/擦除PMOS晶体管共享浮置栅极的控制栅极NMOS晶体管,该晶体管又与访问PMOS晶体管串联连接。 存储单元形成在形成在P基板中的公共N阱中,NMOS晶体管形成在p掺杂的凹穴或基底中。 编程/擦除PMOS包括栅极和形成在N阱中的第一和第二P +掺杂区域,其中第一P +区域电连接到相应的位线。 存取PMOS包括栅极和形成在N阱内的第一和第二P +区,其中第一P +区电连接到编程/擦除PMOS的第二P +区,栅极电连接到相应的字 线。 控制栅极NMOS包括源极,漏极和栅极,其中源极和第三漏极以及p掺杂的阱电连接到相应的控制栅极线,并且栅极电连接到编程/擦除的栅极 PMOS,形成电池的浮动栅极。
    • 8. 发明授权
    • Method of programming a selected memory cell
    • 编程选定存储单元的方法
    • US07835186B2
    • 2010-11-16
    • US12168858
    • 2008-07-07
    • Nirmal RatnakumarVenkatraman PrabhakarDavid Kuan-Yu Liu
    • Nirmal RatnakumarVenkatraman PrabhakarDavid Kuan-Yu Liu
    • G11C11/34
    • G11C16/0441G11C16/3427G11C2216/10H01L27/115H01L27/11521H01L27/11558
    • A memory device including a plurality of memory cells, each with a control gate NMOS transistor sharing a floating gate with a program/erase PMOS transistor which is, in turn, connected in series with an access PMOS transistor. The memory cells are formed in a common N-Well formed in a P-substrate, the NMOS transistor being formed in a p-doped pocket or base. The program/erase PMOS includes a gate, and first and second P+ doped regions formed in the N-Well, wherein the first P+ region is electrically connected to a corresponding bit line. The access PMOS includes a gate, and first and second P+ regions formed within the N-Well, wherein the first P+ region is electrically connected to the second P+ region of the program/erase PMOS, and the gate is electrically connected to a corresponding word line. The control gate NMOS includes source, drain, and gate, wherein the source and third drain as well as the p-doped pocket are electrically connected to a corresponding control gate line, and the gate is electrically connected to the gate of the program/erase PMOS, forming floating gate of the cell.
    • 一种包括多个存储单元的存储器件,每个存储器单元具有与编程/擦除PMOS晶体管共享浮置栅极的控制栅极NMOS晶体管,该晶体管又与访问PMOS晶体管串联连接。 存储单元形成在形成在P基板中的公共N阱中,NMOS晶体管形成在p掺杂的凹穴或基底中。 编程/擦除PMOS包括栅极和形成在N阱中的第一和第二P +掺杂区域,其中第一P +区域电连接到相应的位线。 存取PMOS包括栅极和形成在N阱内的第一和第二P +区,其中第一P +区电连接到编程/擦除PMOS的第二P +区,并且栅极电连接到相应的字 线。 控制栅极NMOS包括源极,漏极和栅极,其中源极和第三漏极以及p掺杂的阱电连接到相应的控制栅极线,并且栅极电连接到编程/擦除的栅极 PMOS,形成电池的浮动栅极。
    • 9. 发明授权
    • EEPROM memory cell with first-dopant-type control gate transister, and second-dopant type program/erase and access transistors formed in common well
    • 具有第一掺杂剂型控制栅极转移器的EEPROM存储器单元,以及形成在共同阱中的第二掺杂型编程/擦除和存取晶体管
    • US07835184B2
    • 2010-11-16
    • US12233294
    • 2008-09-18
    • Nirmal RatnakumarVenkatraman PrabhakarDavid Kuan-Yu Liu
    • Nirmal RatnakumarVenkatraman PrabhakarDavid Kuan-Yu Liu
    • G11C11/34
    • G11C16/0441G11C16/3427G11C2216/10H01L27/115H01L27/11521H01L27/11558
    • A memory device including a plurality of memory cells, each with a control gate NMOS transistor sharing a floating gate with a program/erase PMOS transistor which is, in turn, connected in series with an access PMOS transistor. The memory cells are formed in a common N-Well formed in a P-substrate, the NMOS transistor being formed in a p-doped pocket or base. The program/erase PMOS includes a gate, and first and second P+ doped regions formed in the N-Well, wherein the first P+ region is electrically connected to a corresponding bit line. The access PMOS includes a gate, and first and second P+ regions formed within the N-Well, wherein the first P+ region is electrically connected to the second P+ region of the program/erase PMOS, and the gate is electrically connected to a corresponding word line. The control gate NMOS includes source, drain, and gate, wherein the source and third drain as well as the p-doped pocket are electrically connected to a corresponding control gate line, and the gate is electrically connected to the gate of the program/erase PMOS, forming floating gate of the cell.
    • 一种包括多个存储单元的存储器件,每个存储器单元具有与编程/擦除PMOS晶体管共享浮置栅极的控制栅极NMOS晶体管,该晶体管又与访问PMOS晶体管串联连接。 存储单元形成在形成在P基板中的公共N阱中,NMOS晶体管形成在p掺杂的凹穴或基底中。 编程/擦除PMOS包括栅极和形成在N阱中的第一和第二P +掺杂区域,其中第一P +区域电连接到相应的位线。 存取PMOS包括栅极和形成在N阱内的第一和第二P +区,其中第一P +区电连接到编程/擦除PMOS的第二P +区,栅极电连接到相应的字 线。 控制栅极NMOS包括源极,漏极和栅极,其中源极和第三漏极以及p掺杂的阱电连接到相应的控制栅极线,并且栅极电连接到编程/擦除的栅极 PMOS,形成电池的浮动栅极。
    • 10. 发明授权
    • Method of erasing a block of memory cells
    • 擦除存储单元块的方法
    • US07791955B2
    • 2010-09-07
    • US12168863
    • 2008-07-07
    • Nirmal RatnakumarVenkatraman PrabhakarDavid Kuan-Yu Liu
    • Nirmal RatnakumarVenkatraman PrabhakarDavid Kuan-Yu Liu
    • G11C11/34
    • G11C16/0441G11C16/3427G11C2216/10H01L27/115H01L27/11521H01L27/11558
    • A memory device including a plurality of memory cells, each with a control gate NMOS transistor sharing a floating gate with a program/erase PMOS transistor which is, in turn, connected in series with an access PMOS transistor. The memory cells are formed in a common N-Well formed in a P-substrate, the NMOS transistor being formed in a p-doped pocket or base. The program/erase PMOS includes a gate, and first and second P+ doped regions formed in the N-Well, wherein the first P+ region is electrically connected to a corresponding bit line. The access PMOS includes a gate, and first and second P+ regions formed within the N-Well, wherein the first P+ region is electrically connected to the second P+ region of the program/erase PMOS, and the gate is electrically connected to a corresponding word line. The control gate NMOS includes source, drain, and gate, wherein the source and third drain as well as the p-doped pocket are electrically connected to a corresponding control gate line, and the gate is electrically connected to the gate of the program/erase PMOS, forming floating gate of the cell.
    • 一种包括多个存储单元的存储器件,每个存储器单元具有与编程/擦除PMOS晶体管共享浮置栅极的控制栅极NMOS晶体管,该晶体管又与访问PMOS晶体管串联连接。 存储单元形成在形成在P基板中的公共N阱中,NMOS晶体管形成在p掺杂的凹穴或基底中。 编程/擦除PMOS包括栅极和形成在N阱中的第一和第二P +掺杂区域,其中第一P +区域电连接到相应的位线。 存取PMOS包括栅极和形成在N阱内的第一和第二P +区,其中第一P +区电连接到编程/擦除PMOS的第二P +区,栅极电连接到相应的字 线。 控制栅极NMOS包括源极,漏极和栅极,其中源极和第三漏极以及p掺杂的阱电连接到相应的控制栅极线,并且栅极电连接到编程/擦除的栅极 PMOS,形成电池的浮动栅极。