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1. 发明授权

US07943235B2 Adhesive sheet for processing semiconductor substrates 有权
标题翻译：用于处理半导体衬底的粘合片
公开(公告)号：US07943235B2
公开(公告)日：2011-05-17
申请号：US11969023
申请日：2008-01-03
申请人： Akiyoshi Yamamoto , Toshio Shintani , Fumiteru Asai , Kouichi Hashimoto
发明人： Akiyoshi Yamamoto , Toshio Shintani , Fumiteru Asai , Kouichi Hashimoto
IPC分类号： B32B7/12 , B32B15/04 , C08L33/06 , C09B67/00
CPC分类号： H01L21/6836 , C08G18/672 , C08L61/00 , C08L2666/16 , C09D175/16 , C09J7/385 , C09J133/02 , C09J2201/622 , C09J2203/326 , C09J2205/31 , H01L2221/68327 , Y10T428/28 , Y10T428/2809 , Y10T428/2852 , Y10T428/2883 , Y10T428/2891
摘要： An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer is formed using a multifunctional acrylate oligomer and/or monomer having a double bond, and is blended so as to result in 1 double bond per total average molecular weight of 225 to 8000 as determined on the basis of the weight average molecular weight of the multifunctional acrylate oligomer and/or monomer.
摘要翻译：用于处理半导体衬底的粘合片包括紫外线和/或辐射透射性底膜和通过紫外线和/或辐射进行聚合固化反应的粘合剂层，其中粘合剂层使用多官能丙烯酸酯低聚物和/或具有双键的单体，并且根据多官能丙烯酸酯低聚物和/或单体的重均分子量测定，共混以达到每平均分子量为225至8000的1双键。

2. 发明申请

US20100028662A1 ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES 审中-公开
标题翻译：用于加工半导体基板的粘合片
公开(公告)号：US20100028662A1
公开(公告)日：2010-02-04
申请号：US12521822
申请日：2007-12-20
申请人： Toshio Shintani , Akiyoshi Yamamoto , Fumiteru Asai , Kouichi Hashimoto
发明人： Toshio Shintani , Akiyoshi Yamamoto , Fumiteru Asai , Kouichi Hashimoto
IPC分类号： B32B5/00
CPC分类号： C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/31 , C09J2433/00 , H01L21/568 , H01L21/6835 , H01L2221/68381 , H01L2924/0002 , Y10T428/265 , H01L2924/00
摘要： An object of the present invention is to provide a stable adhesive sheet in which the disappearance of the laser-printings prevents almost entirely, without leaving adhesive residue whatsoever during the cut of the substrate. An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer has a thickness of 7 to 15 μm.
摘要翻译：本发明的目的是提供一种稳定的粘合片，其中激光打印的消失几乎完全防止，而在基片的切割期间不会留下粘合剂残留物。用于处理半导体衬底的粘合片包括通过紫外线和/或辐射进行聚合固化反应的紫外线和/或辐射透射性底膜和粘合剂层，其中所述粘合剂层的厚度为7至 15妈妈

3. 发明申请

US20080261038A1 ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES 有权
标题翻译：用于加工半导体基板的粘合片
公开(公告)号：US20080261038A1
公开(公告)日：2008-10-23
申请号：US11969023
申请日：2008-01-03
申请人： Akiyoshi Yamamoto , Toshio Shintani , Fumiteru Asai , Kouichi Hashimoto
发明人： Akiyoshi Yamamoto , Toshio Shintani , Fumiteru Asai , Kouichi Hashimoto
IPC分类号： B32B7/12
CPC分类号： H01L21/6836 , C08G18/672 , C08L61/00 , C08L2666/16 , C09D175/16 , C09J7/385 , C09J133/02 , C09J2201/622 , C09J2203/326 , C09J2205/31 , H01L2221/68327 , Y10T428/28 , Y10T428/2809 , Y10T428/2852 , Y10T428/2883 , Y10T428/2891
摘要： An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer is formed using a multifunctional acrylate oligomer and/or monomer having a double bond, and is blended so as to result in 1 double bond per total average molecular weight of 225 to 8000 as determined on the basis of the weight average molecular weight of the multifunctional acrylate oligomer and/or monomer.
摘要翻译：用于处理半导体衬底的粘合片包括紫外线和/或辐射透射性底膜和通过紫外线和/或辐射进行聚合固化反应的粘合剂层，其中粘合剂层使用多官能丙烯酸酯低聚物和/或具有双键的单体，并且根据多官能丙烯酸酯低聚物和/或单体的重均分子量测定，共混以达到每平均分子量为225至8000的1双键。

4. 发明申请

US20080118764A1 ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFERS AND/OR SUBSTRATES 审中-公开
标题翻译：用于加工半导体波导和/或基板的粘合片
公开(公告)号：US20080118764A1
公开(公告)日：2008-05-22
申请号：US11875169
申请日：2007-10-19
申请人： Toshio SHINTANI , Akiyoshi Yamamoto , Fumiteru Asai , Kouichi Hashimoto
发明人： Toshio SHINTANI , Akiyoshi Yamamoto , Fumiteru Asai , Kouichi Hashimoto
IPC分类号： B32B27/00
CPC分类号： C09J11/06 , C09J7/38 , C09J11/08 , C09J2203/326 , C09J2205/102 , C09J2205/31 , C09J2433/00 , H01L21/67005 , H01L21/67132 , H01L21/6836 , H01L2221/68327 , Y10T428/31855
摘要： An adhesive sheet for processing semiconductor wafers and/or substrates comprises a UV- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer comprises at least a tackifier and a surfactant. The adhesive sheet of the present invention can be to lower the adhesive strength to the optimal level during pick up or the like after irradiation with UV rays and/or radiation, while maintaining adhesion with adherends before irradiation with UV rays and/or radiation by ensuring that, regardless of the texture on the surface of adherends such as semiconductor wafers and/or substrates, the adhering surface favorably conforms to the texture with preserving enough adhesive and cohesive strength.
摘要翻译：用于处理半导体晶片和/或基板的粘合片包括通过UV射线和/或辐射进行聚合固化反应的UV和/或辐射透射性底膜和粘合剂层，其中粘合剂层至少包括增粘剂和表面活性剂。本发明的粘合片可以在用紫外线和/或辐射照射之后将粘合强度降低到拾取等期间的最佳水平，同时在用紫外线和/或辐射照射之前保持与被粘物的粘附，确保无论在诸如半导体晶片和/或基板的被粘附体的表面上的纹理如何，粘合表面有利地符合纹理，同时保持足够的粘合力和内聚强度。

5. 发明申请

US20090239222A1 COMPOSITION FOR NUCLEIC-ACID TRANSFECTION 有权
标题翻译：用于核酸转运的组合物
公开(公告)号：US20090239222A1
公开(公告)日：2009-09-24
申请号：US12306620
申请日：2007-06-29
申请人： Hiroshi Kikuchi , Hideo Kobayashi , Kouichi Hashimoto , Ayako Iijima , Daigo Asano
发明人： Hiroshi Kikuchi , Hideo Kobayashi , Kouichi Hashimoto , Ayako Iijima , Daigo Asano
IPC分类号： C12Q1/68 , C07C233/00
CPC分类号： C12N15/88 , A61K9/1272
摘要： To provide a nucleic-acid-transfecting composition which exhibits low cytotoxicity, which facilitates a nucleic acid transfection into cells, and which improves expression of the nucleic acid in the cells.The invention provides a composition for transfecting a nucleic acid into a cell, including a compound represented by the following formula (I) (wherein each of R1 and R2, which are identical to or different from each other, represents a saturated or unsaturated hydrocarbon group; R3 represents a C1-6 alkyl group or a C1-6 hydroxyalkyl group; m is an integer from 1 to 10; and X represents a halogen atom), and a phospholipid.
摘要翻译：提供显示低细胞毒性的核酸转染组合物，其有助于核酸转染入细胞，并且其改善核酸在细胞中的表达。本发明提供一种用于将核酸转染入细胞的组合物，包括由下式（I）表示的化合物（其中R 1和R 2各自彼此相同或不同，表示饱和或不饱和的烃基 R 3表示C 1-6烷基或C 1-6羟基烷基; m表示1〜10的整数，X表示卤素原子）和磷脂。

6. 发明授权

US07479317B2 Adhesive sheet roll for wafer processing 有权
标题翻译：用于晶片加工的粘合片卷
公开(公告)号：US07479317B2
公开(公告)日：2009-01-20
申请号：US11054826
申请日：2005-02-10
申请人： Kouichi Hashimoto , Kazuhiko Yamamoto
发明人： Kouichi Hashimoto , Kazuhiko Yamamoto
IPC分类号： B32B9/00 , B32B33/00 , D06N7/04
CPC分类号： C09J7/22 , C09J7/38 , C09J7/403 , C09J2203/326 , C09J2205/31 , H01L21/67132 , Y10S428/906 , Y10T428/14 , Y10T428/1476 , Y10T428/24355
摘要： An adhesive film in roll for wafer processing is constituted by laminated multiple layers including a base film, a radiation curing type adhesive layer, and a releasing film in this sequence, in which the arithmetic average roughness (Ra) of the side of the base film and/or releasing film opposite to the radiation curing type adhesive layer is 1 μm or more, and the weight of the radical polymerization initiator contained in the radiation curing type adhesive layer is less than 1000 ppm.
摘要翻译：用于晶片处理的辊用粘合膜由具有基膜，辐射固化型粘合剂层和脱模膜的层叠多层构成，其中基膜的侧面的算术平均粗糙度（Ra）和/或与放射线固化型粘合剂层相反的释放膜为1μm以上，辐射固化型粘合剂层中所含的自由基聚合引发剂的重量小于1000ppm。

7. 发明授权

US06258426B1 Ultraviolet curing pressure-sensitive adhesive sheet 有权
标题翻译：紫外线固化压敏粘合片
公开(公告)号：US06258426B1
公开(公告)日：2001-07-10
申请号：US09350887
申请日：1999-07-12
申请人： Shouji Yamamoto , Yoshio Nakagawa , Tatsuya Kubozono , Kouji Akazawa , Kouichi Hashimoto , Takahiro Fukuoka
发明人： Shouji Yamamoto , Yoshio Nakagawa , Tatsuya Kubozono , Kouji Akazawa , Kouichi Hashimoto , Takahiro Fukuoka
IPC分类号： C09J702
CPC分类号： H01L21/6835 , C09J7/201 , C09J7/22 , C09J7/38 , C09J2201/122 , C09J2203/326 , C09J2205/31 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2924/3025 , Y10S428/913 , Y10T428/14 , Y10T428/1405 , Y10T428/1414 , Y10T428/1438 , Y10T428/1467 , Y10T428/1476 , Y10T428/1486 , Y10T428/24479
摘要： An ultraviolet curing pressure-sensitive adhesive sheet prepared by forming an ultraviolet curing pressure-sensitive adhesive layer on at least one surface of a substrate film and adhering a separator to the surface of the ultraviolet curing pressure-sensitive adhesive layer, wherein the separator has an ultraviolet transmittance at a wavelength of 300 to 400 nm of 65% or lower. The separator is obtained by forming a layer containing an ultraviolet absorber on the surface of the substrate film opposite the surface adhering to the pressure-sensitive adhesive layer or incorporating an ultraviolet absorber in the film. The ultraviolet curing pressure-sensitive adhesive sheet is useful as a semiconductor-protective pressure-sensitive adhesive sheet and a semiconductor wafer-fixing sheet, which can be used without causing a curing reaction with the exposure of a slight amount of ultraviolet rays from a surrounding environment at the standby for adhering wafers.
摘要翻译：一种紫外线固化型粘合片，其通过在基材膜的至少一个表面上形成紫外线固化型粘合剂层并将隔膜粘附到紫外线固化型粘合剂层的表面而制备，其中，隔膜具有波长300〜400nm的紫外线透过率为65％以下。通过在与膜片相粘合的表面相反的表面上形成含有紫外线吸收剂的层或者在该膜上并入紫外线吸收剂而形成隔膜。紫外线固化型粘合片可用作半导体保护压敏粘合片和半导体晶片固定片，其可以在待机时暴露来自周围环境的少量紫外线而不引起固化反应而使用，用于粘合晶片。

8. 发明授权

US4167949A Coin jamming detecting device in coin sorting machine 失效
标题翻译：硬币分选机中的硬币干扰检测装置
公开(公告)号：US4167949A
公开(公告)日：1979-09-18
申请号：US824301
申请日：1977-08-12
申请人： Kouichi Hashimoto , Tokunori Kobayashi
发明人： Kouichi Hashimoto , Tokunori Kobayashi
IPC分类号： G07D3/16 , G07F3/04
CPC分类号： G07D3/16
摘要： A plurality of coin detecting switches are provided in the coin passages in a coin sorting machine so that jammed coins are located according to the following principle; when one coin detecting switch detects coins, and the succeeding coin detecting switch detects no coins, it is determined that coins are jammed therebetween.
摘要翻译：在硬币分拣机的硬币通道中设置有多个硬币检测开关，以便根据以下原理定位卡住的硬币; 当一个硬币检测开关检测到硬币，并且随后的硬币检测开关检测不到硬币时，确定硬币被卡住。

9. 发明申请

US20130149369A1 COMPOSITION FOR NUCLEIC ACID TRANSFECTION 有权
标题翻译：用于核酸转运的组合物
公开(公告)号：US20130149369A1
公开(公告)日：2013-06-13
申请号：US13249120
申请日：2011-09-29
申请人： Hiroshi KIKUCHI , Hideo Kobayashi , Kouichi Hashimoto , Ayako Iijima , Daigo Asano , Junko Yasuda
发明人： Hiroshi KIKUCHI , Hideo Kobayashi , Kouichi Hashimoto , Ayako Iijima , Daigo Asano , Junko Yasuda
IPC分类号： A61K31/7088
CPC分类号： A61K31/7088 , A61K48/0025
摘要： The invention provides a nucleic-acid-transfecting composition which exhibits low cytotoxicity, which facilitates an effective nucleic acid transfection into a cell, and which improves expression of the nucleic acid in the cell.The composition for transfecting a nucleic acid into a cell, contains a di(C12-16 alkyl)dimethylammonium halide and a phospholipid.
摘要翻译：本发明提供了一种显示低细胞毒性的核酸转染组合物，其有利于有效的核酸转染到细胞中，并且其改善细胞中核酸的表达。用于将核酸转染入细胞的组合物含有二（C 12-16烷基）二甲基卤化铵和磷脂。

10. 发明申请

US20050191456A1 Adhesive sheet roll for wafer processing 有权
标题翻译：用于晶片加工的粘合片卷
公开(公告)号：US20050191456A1
公开(公告)日：2005-09-01
申请号：US11054826
申请日：2005-02-10
申请人： Kouichi Hashimoto , Kazuhiko Yamamoto
发明人： Kouichi Hashimoto , Kazuhiko Yamamoto
IPC分类号： C09J7/02 , C09J133/00 , C09J175/14 , C09J201/02 , H01L21/00 , H01L21/301 , H01L21/304 , B32B9/00
CPC分类号： C09J7/22 , C09J7/38 , C09J7/403 , C09J2203/326 , C09J2205/31 , H01L21/67132 , Y10S428/906 , Y10T428/14 , Y10T428/1476 , Y10T428/24355
摘要： To present an adhesive sheet roll for wafer processing excellent in storage stability, radiation curing property, and low contamination to wafer. To present an adhesive sheet for wafer processing prepared by cutting the adhesive sheet roll for wafer processing, and an adhesive sheet with semiconductor wafer. To present a manufacturing method of semiconductor device using adhesive sheet for wafer processing or adhesive sheet with semiconductor wafer, and a semiconductor device obtained in this manufacturing method. An adhesive film for roll wafer processing which laminating multiple layers of laminated film stacking up base film, radiation curing type adhesive layer, and releasing film in this sequence, in which the arithmetic average roughness (Ra) of the other surface of the side of the base film and/or releasing film contacting with the radiation curing type adhesive layer is 1 μm or more, and the weight of the radical polymerization initiator contained in the radiation curing type adhesive layer is less than 1000 ppm.
摘要翻译：提供用于晶片处理的粘合片卷，其具有优异的储存稳定性，辐射固化性能和对晶片的低污染。呈现通过切割用于晶片加工的粘合片卷制备的用于晶片加工的粘合片，以及具有半导体晶片的粘合片。介绍使用晶片加工用粘合片或半导体晶片的半导体器件的制造方法以及在该制造方法中获得的半导体器件。一种用于辊晶片处理的粘合膜，其中以层叠多层叠层膜叠层基膜，辐射固化型粘合剂层和脱模膜，其中该层的另一面的算术平均粗糙度（Ra）与辐射固化型粘合剂层接触的基膜和/或脱模膜为1μm以上，辐射固化型粘合剂层中所含的自由基聚合引发剂的重量小于1000ppm。

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