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    • 4. 发明申请
    • LITHOGRAPHY TOOL ALIGNMENT CONTROL SYSTEM
    • LITHOGRAPHY工具对齐控制系统
    • US20130090877A1
    • 2013-04-11
    • US13268248
    • 2011-10-07
    • Satoshi Nagai
    • Satoshi Nagai
    • G06F19/00
    • G03F7/70633G03F9/7034
    • Described herein are methods and systems for aligning a wafer using a wafer leveling map with alignment marks. A set of alignment marks can be selected to create overlay correction parameters to realign the wafer. Alignment marks that are near wafer leveling hotspots, or alignment marks that have poor reproducibility are not selected for realignment purposes. The wafer leveling data is used to determine which alignment marks have poor reproducibility and can create an unstable offset. The wafer leveling data identifies areas on the wafer that are uneven. Only alignment marks which have a stable offset are used to calculate the associated overlay correction parameters.
    • 这里描述了使用晶片调平图与对准标记对准晶片的方法和系统。 可以选择一组对准标记来创建重叠校正参数以重新对准晶片。 靠近晶片调平热点的对准标记或重复性差的对准标记未被选择用于重新对准。 晶圆调平数据用于确定哪些对准标记具有差的再现性,并可能产生不稳定的偏移。 晶片调平数据识别晶片上不均匀的区域。 仅使用具有稳定偏移的对准标记来计算相关联的重叠校正参数。
    • 5. 发明申请
    • Polishing apparatus
    • 抛光设备
    • US20070032174A1
    • 2007-02-08
    • US10555004
    • 2004-04-28
    • Satoshi Nagai
    • Satoshi Nagai
    • B24B7/30B24B1/00
    • B24B37/16
    • The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer to form a flat surface thereon. The polishing apparatus includes a polishing table (20), a polishing tool (1) attached to an upper surface of the polishing table (20), and a fluid passage (40) having openings on the upper surface of the polishing table (20). The apparatus is operable to bring a workpiece (W) into sliding contact with the polishing tool (1) to polish the workpiece while supplying a polishing liquid onto the polishing tool (1). The polishing tool (1) is fixed to the polishing table (20) by a vacuum produced in the fluid passage (40).
    • 本发明涉及一种抛光装置,用于抛光诸如半导体晶片的工件以在其上形成平坦表面。 抛光装置包括:研磨台(20),安装在研磨台(20)的上表面的研磨工具(1)和在研磨台(20)的上表面上具有开口的流体通道(40) 。 该装置可操作以使工件(W)与抛光工具(1)滑动接触,以在将抛光液体供应到抛光工具(1)上时抛光工件。 抛光工具(1)通过在流体通道(40)中产生的真空固定在抛光台(20)上。