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1. 发明授权

US06363791B1 Pressure sensor 失效
标题翻译：压力传感器
公开(公告)号：US06363791B1
公开(公告)日：2002-04-02
申请号：US09356666
申请日：1999-07-19
申请人： Akihito Kurosaka , Osamu Nakao , Takanao Suzuki , Masahiro Sato , Hitoshi Nishimura
发明人： Akihito Kurosaka , Osamu Nakao , Takanao Suzuki , Masahiro Sato , Hitoshi Nishimura
IPC分类号： G01L912
CPC分类号： G01L9/0073
摘要： A capacitance pressure sensor that prevents leakage from outside the sensor to the reference pressure cavity, has a structure that can decrease defects due to leakage compared to conventional technology. An electrode comprising a thin metallic layer is formed on the upper surface of a glass substrate that forms one of the substrates of a pressure sensor and an external electrode is formed on the surface edge of the substrate. In addition, in the region where the silicon substrate is bonded, a feedthrough extending from the electrode to the external electrode is formed, and spine shaped layers with three braches for blocking leakage gas are formed perpendicularly to the feedthrough.
摘要翻译：阻止传感器外部泄漏到参考压力腔的电容式压力传感器具有与传统技术相比能够减少泄漏的缺陷的结构。在形成压力传感器的基板之一的玻璃基板的上表面上形成有薄金属层的电极，在基板的表面边缘上形成外部电极。此外，在硅基板接合的区域中，形成从电极延伸到外部电极的馈通，并且与馈通垂直地形成具有三个用于阻断泄漏气体的支柱的脊形层。

2. 发明授权

US06387734B1 Semiconductor package, semiconductor device, electronic device and production method for semiconductor package 有权
标题翻译：半导体封装，半导体器件，电子器件及半导体封装的生产方法
公开(公告)号：US06387734B1
公开(公告)日：2002-05-14
申请号：US09762681
申请日：2001-05-24
申请人： Masatoshi Inaba , Takanao Suzuki , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka
发明人： Masatoshi Inaba , Takanao Suzuki , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka
IPC分类号： H01L2144
CPC分类号： H01L23/3114 , H01L24/05 , H01L24/11 , H01L24/12 , H01L2224/0231 , H01L2224/0401 , H01L2224/05551 , H01L2224/05557 , H01L2224/05558 , H01L2224/11334 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/12033 , H01L2924/12042 , H01L2924/14 , H01L2924/351 , H01L2924/00
摘要： An insulating layer (3) is formed on a Si wafer (1). An opening portion is made in this insulating layer (3), and subsequently a rerouting layer (2) is formed. Next, a resin layer (4) is formed on the rerouting layer (2). The resin layer (4) is then cured so that the rerouting layer (2) and a Cu foil (5) are bonded to each other through the resin layer (4). Thereafter, a ring-like opening portion (4a) is made in the resin layer (4), and a Cu plating layer (8) is formed inside this opening portion (4a).
摘要翻译：在Si晶片（1）上形成绝缘层（3）。在该绝缘层（3）中形成开口部，随后形成重路由层（2）。接着，在重路由层（2）上形成树脂层（4）。然后使树脂层（4）固化，使得重新布线层（2）和Cu箔（5）通过树脂层（4）彼此接合。之后，在树脂层（4）中形成有环状的开口部（4a），在该开口部（4a）的内部形成有Cu镀层（8）。

3. 发明授权

US07157363B2 Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion 有权
标题翻译：用于制造半导体封装的方法，其具有形成在树脂突出部上的重路由电极
公开(公告)号：US07157363B2
公开(公告)日：2007-01-02
申请号：US10949386
申请日：2004-09-27
申请人： Takanao Suzuki , Masatoshi Inaba , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka , Masatoshi Inaba , Nobuyuki Sadakata , Mutsumi Masumoto , Kenji Masumoto
发明人： Takanao Suzuki , Masatoshi Inaba , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka , Masatoshi Inaba , Nobuyuki Sadakata , Mutsumi Masumoto , Kenji Masumoto
IPC分类号： H01L21/44
CPC分类号： H01L24/10 , H01L21/56 , H01L23/3107 , H01L23/3114 , H01L23/525 , H01L24/13 , H01L2224/02125 , H01L2224/0231 , H01L2224/02351 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05548 , H01L2224/05567 , H01L2224/05572 , H01L2224/05644 , H01L2224/13 , H01L2224/13021 , H01L2224/13022 , H01L2224/13023 , H01L2224/13099 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2224/05552 , H01L2924/00 , H01L2924/00014
摘要： An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.
摘要翻译：形成在与电极焊盘（2）相适应的位置处具有开口部（3a）的绝缘层（3）。接着，在绝缘层（3）上形成树脂突起部（4）。此后，形成抗蚀剂膜，该抗蚀剂膜具有在与开口部分（31a）相适应的区域中形成的开口部分，树脂突出部分（4）和夹在其间的区域。通过使用抗蚀剂膜作为掩模，通过电解铜电镀形成Cu镀层（6）。

4. 发明授权

US07023088B2 Semiconductor package, semiconductor device and electronic device 失效
标题翻译：半导体封装，半导体器件和电子器件
公开(公告)号：US07023088B2
公开(公告)日：2006-04-04
申请号：US10442298
申请日：2003-05-21
申请人： Takanao Suzuki , Masatoshi Inaba , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka , Masatoshi Inaba , Nobuyuki Sadakata , Mutsumi Masumoto , Kenji Masumoto
发明人： Takanao Suzuki , Masatoshi Inaba , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka , Masatoshi Inaba , Nobuyuki Sadakata , Mutsumi Masumoto , Kenji Masumoto
IPC分类号： H01L23/48
CPC分类号： H01L24/10 , H01L21/56 , H01L23/3107 , H01L23/3114 , H01L23/525 , H01L24/13 , H01L2224/02125 , H01L2224/0231 , H01L2224/02351 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05548 , H01L2224/05567 , H01L2224/05572 , H01L2224/05644 , H01L2224/13 , H01L2224/13021 , H01L2224/13022 , H01L2224/13023 , H01L2224/13099 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2224/05552 , H01L2924/00 , H01L2924/00014
摘要： An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.
摘要翻译：形成在与电极焊盘（2）相适应的位置处具有开口部（3a）的绝缘层（3）。接着，在绝缘层（3）上形成树脂突起部（4）。此后，形成抗蚀剂膜，该抗蚀剂膜具有在与开口部分（31a）相适应的区域中形成的开口部分，树脂突出部分（4）和夹在其间的区域。通过使用抗蚀剂膜作为掩模，通过电解铜电镀形成Cu镀层（6）。

5. 发明申请

US20050037539A1 Semiconductor package, semiconductor device, electronic device, and method for producing semiconductor package 有权
标题翻译：半导体封装，半导体器件，电子器件以及半导体封装的制造方法
公开(公告)号：US20050037539A1
公开(公告)日：2005-02-17
申请号：US10949386
申请日：2004-09-27
申请人： Takanao Suzuki , Masatoshi Inaba , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka , Masatoshi Inaba , Nobuyuki Sadakata , Mutsumi Masumoto , Kenji Masumoto
发明人： Takanao Suzuki , Masatoshi Inaba , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka , Masatoshi Inaba , Nobuyuki Sadakata , Mutsumi Masumoto , Kenji Masumoto
IPC分类号： H01L21/56 , H01L23/31 , H01L23/485 , H01L23/525 , H01L21/44
CPC分类号： H01L24/10 , H01L21/56 , H01L23/3107 , H01L23/3114 , H01L23/525 , H01L24/13 , H01L2224/02125 , H01L2224/0231 , H01L2224/02351 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05548 , H01L2224/05567 , H01L2224/05572 , H01L2224/05644 , H01L2224/13 , H01L2224/13021 , H01L2224/13022 , H01L2224/13023 , H01L2224/13099 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2224/05552 , H01L2924/00 , H01L2924/00014
摘要： An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.
摘要翻译：形成在与电极焊盘（2）一致的位置具有开口部（3a）的绝缘层（3）。接着，在绝缘层（3）上形成树脂突起部（4）。此后，形成抗蚀剂膜，其具有在与开口部分（3a），树脂突出部分（4）和夹在其间的区域相适应的区域中形成的开口部分。通过使用抗蚀剂膜作为掩模，通过电解铜电镀形成Cu镀层（6）。

6. 发明授权

US06835595B1 Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor package 失效
标题翻译：半导体封装，半导体器件，电子器件以及半导体封装的制造方法
公开(公告)号：US06835595B1
公开(公告)日：2004-12-28
申请号：US09744976
申请日：2001-06-04
申请人： Takanao Suzuki , Masatoshi Inaba , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka , Masatoshi Inaba , Nobuyuki Sadakata , Mutsumi Masumoto , Kenji Masumoto
发明人： Takanao Suzuki , Masatoshi Inaba , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka , Masatoshi Inaba , Nobuyuki Sadakata , Mutsumi Masumoto , Kenji Masumoto
IPC分类号： H01L2144
CPC分类号： H01L24/10 , H01L21/56 , H01L23/3107 , H01L23/3114 , H01L23/525 , H01L24/13 , H01L2224/02125 , H01L2224/0231 , H01L2224/02351 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05548 , H01L2224/05567 , H01L2224/05572 , H01L2224/05644 , H01L2224/13 , H01L2224/13021 , H01L2224/13022 , H01L2224/13023 , H01L2224/13099 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2224/05552 , H01L2924/00 , H01L2924/00014
摘要： An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.
摘要翻译：形成在与电极焊盘（2）一致的位置具有开口部（3a）的绝缘层（3）。接着，在绝缘层（3）上形成树脂突起部（4）。此后，形成抗蚀剂膜，其具有在与开口部分（3a），树脂突出部分（4）和夹在其间的区域相适应的区域中形成的开口部分。通过使用抗蚀剂膜作为掩模，通过电解铜电镀形成Cu镀层（6）。

7. 发明授权

US07849591B2 Method of manufacturing a printed wiring board 有权
标题翻译：制造印刷电路板的方法
公开(公告)号：US07849591B2
公开(公告)日：2010-12-14
申请号：US12089480
申请日：2006-10-13
申请人： Masahiro Okamoto , Shouji Itou , Osamu Nakao , Takanao Suzuki , Satoshi Okude
发明人： Masahiro Okamoto , Shouji Itou , Osamu Nakao , Takanao Suzuki , Satoshi Okude
IPC分类号： H05K3/30 , H05K1/16
CPC分类号： H05K1/186 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/73267 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07811 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3511 , H05K3/0058 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K2201/10674 , H05K2203/063 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00015
摘要： A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion.According to the invention, therefore, it is allowed to provide a multi-layer printed wing board with highly defined components implemented, allowing for a fabrication by facile processes, without causing, among others, increased costs or decreased yields.
摘要翻译：根据本发明的结构包括至少一种配置有具有粘合性的绝缘基材的布线基材和形成在绝缘基材的一侧上的导电层，由导电浆料制成的封孔电极，导电层和贯穿绝缘基材的IC芯片和具有再布线部分的IC芯片，IC芯片被埋在层间粘合材料中，再布线部分连接到封堵电极，具有支撑设置在与IC芯片的再布线部分相对的一侧，其间具有粘合层，并且具有由布线基材和重新布线部分构成的重新布线层。因此，根据本发明，允许提供具有高度限定的部件的多层印刷翼板，允许通过简单的工艺制造，而不引起增加的成本或降低的产量。

8. 发明申请

US20090154132A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 有权
标题翻译：印刷线路板和制造印刷线路板的方法
公开(公告)号：US20090154132A1
公开(公告)日：2009-06-18
申请号：US12089480
申请日：2006-10-13
申请人： Masahiro Okamoto , Shouji Itou , Osamu Nakao , Takanao Suzuki , Satoshi Okude
发明人： Masahiro Okamoto , Shouji Itou , Osamu Nakao , Takanao Suzuki , Satoshi Okude
IPC分类号： H05K1/11 , H05K1/16 , B29C65/02
CPC分类号： H05K1/186 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/73267 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07811 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3511 , H05K3/0058 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K2201/10674 , H05K2203/063 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00015
摘要： A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion.According to the invention, therefore, it is allowed to provide a multi-layer printed wing board with highly defined components implemented, allowing for a fabrication by facile processes, without causing, among others, increased costs or decreased yields.
摘要翻译：根据本发明的结构包括至少一种配置有具有粘合性的绝缘基材的布线基材和形成在绝缘基材的一侧上的导电层，由导电浆料制成的封孔电极，导电层和贯穿绝缘基材的IC芯片和具有再布线部分的IC芯片，IC芯片被埋在层间粘合材料中，再布线部分连接到封堵电极，具有支撑设置在与IC芯片的再布线部分相对的一侧，其间具有粘合层，并且具有由布线基材和重新布线部分构成的重新布线层。因此，根据本发明，允许提供具有高度限定的部件的多层印刷翼板，允许通过简单的工艺制造，而不引起增加的成本或降低的产量。

9. 发明授权

US06944649B1 Electronic control unit having single non-volatile memory for multiple central processing units and data retrieval method 失效
标题翻译：具有用于多个中央处理单元的单个非易失性存储器和数据检索方法的电子控制单元
公开(公告)号：US06944649B1
公开(公告)日：2005-09-13
申请号：US09717270
申请日：2000-11-22
申请人： Takanao Suzuki
发明人： Takanao Suzuki
IPC分类号： G06F15/167 , G06F9/52 , G06F12/00 , G06F15/177
CPC分类号： G06F9/3824 , G06F9/3885 , G06F9/3891 , G06F9/52
摘要： An electronic control unit for engines or vehicles has multiple CPUs and a single non-volatile memory such as an EEPROM. The CPUs are programmed to directly receive data from the EEPROM. The CPUs may be programmed to generate respective data retrieving commands when the EEPROM is not being accessed for data retrieval. In this instance, the CPUs execute respective system register initialization processing differently from each other after a start of power supply. For instance, the system register initialization processing of a first CPU is divided while the system register initialization processing of a second CPU is not divided. Alternatively, the CPUs may be programmed to generate a data retrieving command only from the first CPU and receive the retrieved data by both the first CPU and the second CPU at the same time.
摘要翻译：用于发动机或车辆的电子控制单元具有多个CPU和诸如EEPROM的单个非易失性存储器。 CPU被编程为直接从EEPROM接收数据。当EEPROM不被访问以用于数据检索时，CPU可以被编程为产生相应的数据检索命令。在这种情况下，CPU在开始供电之后彼此不同地执行相应的系统寄存器初始化处理。例如，第一CPU的系统寄存器初始化处理被划分，而第二CPU的系统寄存器初始化处理未被划分。或者，CPU可以被编程为仅从第一CPU生成数据检索命令，并且同时由第一CPU和第二CPU同时接收检索的数据。

10. 发明授权

US4981570A Ion carrier membrane, and ion sensor having same 失效
标题翻译：离子载体膜和离子传感器
公开(公告)号：US4981570A
公开(公告)日：1991-01-01
申请号：US378233
申请日：1989-08-07
申请人： Shuichiro Yamaguchi , Takanao Suzuki , Norio Daikuhara , Takeshi Shimomura , Noboru Oyama
发明人： Shuichiro Yamaguchi , Takanao Suzuki , Norio Daikuhara , Takeshi Shimomura , Noboru Oyama
IPC分类号： G01N27/333
CPC分类号： G01N27/3335
摘要： The surface of an electrically conductive substrate (1) is provided with a redox layer (5) by an electrolytic polymerization process, and the surface of the resulting member is further provided with an ion carrier membrane (6) which includes polyvinyl chloride, a plasticizer and an ion carrier, thereby forming an ion sensor. Used as the plasticizer is one selected from among phthalate plasticizers, maleate plasticizers, adipate plasticizers, carboxylate plasticizers and polycaprolactone plasticizers, or one selected from among plasticizers comprising modified ethylene - vinyl acetate copolymer. The ion sensor obtained has low solubility in the plasticizer of the redox layer and therefore is highly stable. Since the ion sensor has little toxicity, it can be used in vivo. A preferred plasticizer is benzopohenon-tetracarboxylic under cyclic acid.

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