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    • 1. 发明授权
    • Multi-stage type processing apparatus
    • 多级式处理装置
    • US07166184B2
    • 2007-01-23
    • US10778947
    • 2004-02-16
    • Akihiko NakamuraTaiichiro AokiSeiji OhishiTamotsu Sasaki
    • Akihiko NakamuraTaiichiro AokiSeiji OhishiTamotsu Sasaki
    • G03B27/32H01L21/68
    • G03F7/3021Y10S134/902
    • A multi-stage type processing apparatus which can be positioned in a limited space without having a complicated driving mechanism, includes processing units which are stacked in a multi-stage state in the vertical direction. Each processing unit has a cup surrounding a substrate and a chuck for retaining and rotating a substrate, and the cup can be elevated and lowered with respect to the chuck. A cylinder unit is contracted and thereby all the cups are unitarily lowered, so that the top surface of the chuck is located in a slightly upper position with respect to the top surface of the cup. In this state, a substrate is mounted on the chuck and attracted. Next, the cylinder unit is extended and thereby all the cups are unitarily elevated so as to accommodate the substrate therein. In this state, developing liquid is dropped from a nozzle for developing liquid onto the center of the substrate, and a motor is driven to rotate the chuck (the substrate) via a drive shaft and a timing belt to allow the developing liquid to cover the entire surface of the substrate.
    • 可以定位在有限空间中而不具有复杂驱动机构的多级型处理装置包括在垂直方向上以多级状态堆叠的处理单元。 每个处理单元具有围绕基板的杯和用于保持和旋转基底的卡盘,并且杯可以相对于卡盘升高和降低。 气缸单元收缩,从而所有的杯子一体地降低,使得卡盘的顶表面相对于杯的顶表面位于较高的位置。 在这种状态下,将基板安装在卡盘上并被吸引。 接下来,气缸单元延伸,从而所有的杯子一体地升高,以便容纳衬底。 在这种状态下,显影液从用于显影液的喷嘴滴落到基板的中心,驱动马达驱动以通过驱动轴和同步皮带旋转卡盘(基板),以使显影液覆盖 基片的整个表面。
    • 2. 发明授权
    • Heat treatment apparatus and method
    • 热处理装置及方法
    • US06609909B2
    • 2003-08-26
    • US09981633
    • 2001-10-17
    • Taiichiro AokiAkihiko NakamuraAkinori Nishie
    • Taiichiro AokiAkihiko NakamuraAkinori Nishie
    • F27D500
    • H01L21/67109Y10S414/136
    • A heat treatment apparatus comprises: a chamber; a cooling plate and a heating plate disposed within the chamber vertically spaced from each other; plural lift pins used to support a material to be treated; a supporting member for supporting the plural lift pins; and an elevator member to which the supporting member is attached through a joint so that the supporting member can be selectively made rotatable and can be fixed at any inclined angle, wherein distances of tips of each of the lift pins from the heating or cooling plate are initially adjusted to be uniform through inclination of the supporting member while the tips contact the heating or cooling plate, after which the supporting member is fixed in an adjusted inclined angle and then the material to be treated is lifted up with the plural lift pins to closely approach the heating or cooling plate during heat treatment.
    • 一种热处理设备包括:一个室; 设置在所述室内的冷却板和加热板,其彼此垂直间隔开; 用于支撑要处理的材料的多个提升销; 用于支撑多个提升销的支撑构件; 以及电梯构件,支撑构件通过接头附接到所述电梯构件,使得所述支撑构件能够选择性地制造为可旋转的并且可以以任何倾斜角度被固定,其中每个提升销的顶部距加热或冷却板的距离为 最初通过支撑构件的倾斜调节为均匀,同时尖端接触加热或冷却板,之后将支撑构件以调整的倾斜角度固定,然后将多个提升销钉紧紧地提升待处理材料 在热处理过程中接近加热或冷却板。
    • 3. 发明授权
    • Method for forming a coating film on a plate-like workpiece
    • 在板状工件上形成涂膜的方法
    • US07300889B2
    • 2007-11-27
    • US10914523
    • 2004-08-09
    • Hiroki EndoTaiichiro AokiAkihiko Nakamura
    • Hiroki EndoTaiichiro AokiAkihiko Nakamura
    • H01L
    • H01L21/02337H01L21/02282H01L21/316H01L21/76828
    • A method for forming a coating film, comprises the steps of: applying a raw material of a low dielectric constant onto a surface of a plate-like material; reducing oxygen concentration in the atmosphere surrounding the plate-like material to be less than or equal to 1% before a surface temperature of said plate-like material to be treated rises to 200° C.; thereafter heating said plate-like material to a temperature greater than or equal to 400° C.; and then maintaining the oxygen content in the atmosphere to be less than or equal to 1% until the surface temperature of said plate-like material to be treated lowers to 200° C. The raw material is an organic SOG obtained by hydrolyzing and condensing at least one alkoxysilane compound into an organic solvent under an acid catalyst.
    • 形成涂膜的方法包括以下步骤:将低介电常数的原料施加到板状材料的表面上; 在板状材料的表面温度升高到200℃之前,将板状材料周围的气氛中的氧浓度降低至1%以下。 然后将所述板状材料加热至大于或等于400℃的温度; 然后将大气中的氧含量保持在1%以下,直到所述板状材料的表面温度降低到200℃为止。原料是通过水解和缩合至少一种烷氧基硅烷得到的有机SOG 在酸催化剂下形成有机溶剂。
    • 4. 发明申请
    • Method for forming a coating film on a plate-like workpiece
    • 在板状工件上形成涂膜的方法
    • US20050009363A1
    • 2005-01-13
    • US10914523
    • 2004-08-09
    • Hiroki EndoTaiichiro AokiAkihiko Nakamura
    • Hiroki EndoTaiichiro AokiAkihiko Nakamura
    • H01L21/20H01L21/31H01L21/312H01L21/314H01L21/316H01L21/768C23F3/00B23P9/00H01L21/469
    • H01L21/02337H01L21/02282H01L21/316H01L21/76828
    • A method for forming a coating film, comprises the steps of: applying a raw material of a low dielectric constant onto a surface of a plate-like material to be treated; reducing oxygen concentration in the atmosphere surrounding the plate-like material to be less than or equal to 1% before a surface temperature of said plate-like material to be treated rises to 200° C.; thereafter heating said plate-like material to be treated to a temperature greater than or equal to 400° C.; and then maintaining the oxygen content in the atmosphere to be less than or equal to 1% until the surface temperature of said plate-like material to be treated lowers to 200° C. The raw material is an organic SOG obtained by hydrolyzing and condensing at least one alkoxysilane compound expressed by the following equation (I) into an organic solvent under an acid catalyst, RnSi(OR1)4-n   (I) where R is an alkyl group or an aryl group having a carbon number of 1-4, R1is an alkyl group having a carbon number of 1-4, and n is an integer of 0-2.
    • 一种形成涂膜的方法,包括以下步骤:将低介电常数的原料施加到待处理的板状材料的表面上; 在待处理的板状材料的表面温度升高到200℃之前,将板状材料周围的气氛中的氧浓度降低至1%以下。 然后将待处理的板状材料加热至大于或等于400℃的温度; 然后将气氛中的氧含量保持在1%以下,直到所述待处理的板状材料的表面温度降至200℃为止。原料是通过水解和冷凝得到的有机SOG 由下式(I)表示的至少一种烷氧基硅烷化合物在酸催化剂RnSi(OR 1)4-n(I)表示的有机溶剂中,其中R是烷基或碳数为1的芳基 -4,R 1是碳数为1-4的烷基,n为0-2的整数。
    • 5. 发明授权
    • Coating apparatus, coating method and coating-film forming apparatus
    • 涂布装置,涂布方法和涂膜成膜装置
    • US08449945B2
    • 2013-05-28
    • US13364739
    • 2012-02-02
    • Seiji OhishiAkihiko Nakamura
    • Seiji OhishiAkihiko Nakamura
    • B05D3/12
    • H01L21/6715B05D1/002B05D1/42Y10S134/902
    • A coating method, which uses a coating apparatus including a rotatable tray having a recessed portion for accommodating a substrate and rotatable together with the substrate, a nozzle for supplying a coating liquid, and an applicator for spreading the coating liquid, includes the steps of placing a substrate into the recessed portion of the tray, positioning the nozzle over a non-recessed portion of the upper surface of the tray, supplying a coating liquid from the nozzle, and forming a coating liquid pool only on the non-recessed portion of the upper surface of the tray, moving the applicator in a horizontal direction while maintaining a certain distance with respect to the upper surface of the substrate for spreading the coating liquid of the coating liquid pool over the entire upper surface of the substrate, and releasing the substrate from the recessed portion of the tray.
    • 一种涂布方法,其使用包括可旋转托盘的涂布装置,该托盘具有用于容纳基材的凹部并与基底一起旋转的涂布装置,用于供给涂布液的喷嘴和用于涂布涂布液的涂布器的步骤包括以下步骤: 基板进入托盘的凹部,将喷嘴定位在托盘的上表面的非凹部上,从喷嘴供给涂布液,并且仅在所述托盘的非凹部上形成涂布液池 托盘的上表面,沿着水平方向移动施加器,同时相对于基板的上表面保持一定距离,以将涂液池的涂布液涂覆在基板的整个上表面上,并释放基板 从托盘的凹陷部分。
    • 6. 发明授权
    • Coating apparatus, coating method and coating-film forming appratus
    • 涂布装置,涂布方法和涂膜成膜装置
    • US08132526B2
    • 2012-03-13
    • US12584103
    • 2009-08-31
    • Seiji OhishiAkihiko Nakamura
    • Seiji OhishiAkihiko Nakamura
    • B05C5/02
    • H01L21/6715B05D1/002B05D1/42Y10S134/902
    • A coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position. The nozzle is positioned above a non-recessed portion of the tray and supplies a coating liquid only onto a non-recessed portion of the upper surface of the tray to form a coating liquid pool, and the applicator is relatively movable in a horizontal direction in a state of maintaining a certain distance with respect to the upper surface of the substrate accommodated into the recessed portion and spreads the coating liquid of the coating liquid pool from the non-recessed portion of the upper surface of the tray over the entire upper surface of the substrate.
    • 涂布装置包括托盘,用于供给涂布液的喷嘴和用作涂布液的涂布器的刮板。 托盘具有凹部,基底被放置在该凹部中,并且在凹部中设置旋转卡盘。 在旋转卡盘中,用于吸引基板的卡盘安装在可以升降的旋转轴的上端,并且卡盘的上表面和凹部的底面布置成相同 在旋转轴下降到最低位置的状态下。 喷嘴位于托盘的非凹陷部分的上方,并将涂布液仅提供到托盘上表面的非凹槽部分上以形成涂液池,并且涂布器可在水平方向上相对移动 相对于容纳在凹部中的基板的上表面保持一定距离的状态,并且将涂布液的涂布液从托盘的上表面的非凹部扩展到整个上表面的整个上表面 底物。
    • 7. 发明申请
    • Coating apparatus, coating method and coating-film forming appratus
    • 涂布设备,涂布方法和涂膜成膜设备
    • US20100009084A1
    • 2010-01-14
    • US12584103
    • 2009-08-31
    • Seiji OhishiAkihiko Nakamura
    • Seiji OhishiAkihiko Nakamura
    • B05D1/40B05C11/02
    • H01L21/6715B05D1/002B05D1/42Y10S134/902
    • A coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position. The nozzle is positioned above a non-recessed portion of the tray and supplies a coating liquid only onto a non-recessed portion of the upper surface of the tray to form a coating liquid pool, and the applicator is relatively movable in a horizontal direction in a state of maintaining a certain distance with respect to the upper surface of the substrate accommodated into the recessed portion and spreads the coating liquid of the coating liquid pool from the non-recessed portion of the upper surface of the tray over the entire upper surface of the substrate.
    • 涂布装置包括托盘,用于供给涂布液的喷嘴和用作涂布液的涂布器的刮板。 托盘具有凹部,基底被放置在该凹部中,并且在凹部中设置旋转卡盘。 在旋转卡盘中,用于吸引基板的卡盘安装在可以升降的旋转轴的上端,并且卡盘的上表面和凹部的底面布置成相同 在旋转轴下降到最低位置的状态下。 喷嘴位于托盘的非凹陷部分的上方,并将涂布液仅提供到托盘上表面的非凹槽部分上以形成涂液池,并且涂布器可在水平方向上相对移动 相对于容纳在凹部中的基板的上表面保持一定距离的状态,并且将涂布液的涂布液从托盘的上表面的非凹部扩展到整个上表面的整个上表面 底物。
    • 8. 发明授权
    • Coating apparatus, coating method and coating-film forming apparatus
    • 涂布装置,涂布方法和涂膜成膜装置
    • US07611581B2
    • 2009-11-03
    • US11288991
    • 2005-11-29
    • Seiji OhishiAkihiko Nakamura
    • Seiji OhishiAkihiko Nakamura
    • B05C5/02
    • H01L21/6715B05D1/002B05D1/42Y10S134/902
    • A coating apparatus is provided in which a coating liquid supplied onto a surface of a substrate such as a semiconductor wafer and a glass substrate can be easily leveled so as to have a uniform thickness without any edge bead. The coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position.
    • 提供一种涂布装置,其中供应到诸如半导体晶片和玻璃基板的基板的表面上的涂布液可以容易地平整,以便具有均匀的厚度而没有任何边缘珠。 涂布装置包括托盘,用于供给涂布液的喷嘴和用作涂布液的涂布器的刮板。 托盘具有凹部,基底被放置在该凹部中,并且在凹部中设置旋转卡盘。 在旋转卡盘中,用于吸引基板的卡盘安装在可以升降的旋转轴的上端,并且卡盘的上表面和凹部的底面布置成相同 在旋转轴下降到最低位置的状态下。