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1. 发明授权

US06591992B1 Boat for cleaning ball grid array packages 有权
公开(公告)号：US06591992B1
公开(公告)日：2003-07-15
申请号：US10227382
申请日：2002-08-26
申请人： Ajit M. Dubey , Raj N. Master , Ong Ot , Chan Cs
发明人： Ajit M. Dubey , Raj N. Master , Ong Ot , Chan Cs
IPC分类号： A47F700
CPC分类号： H01L21/67333 , H01L21/67028 , H01L2221/68313
摘要： A boat for cleaning semiconductor packages, including cleaning ball grid array packages in centrifugal cleaners. The boat includes a bottom plate with receptacles for receiving semiconductor packages and a top plate having through holes, where each through hole is smaller than the receptacle with which it corresponds in the bottom plate. An alignment mechanism ensures that the top plate is aligned with the bottom plate in a manner that results in each through hole being positioned directly over a respective one of the receptacles. An attachment mechanism releasably attaches the top plate to the bottom plate in a co-planar relationship that results in the presence of a vertical space between the two plates.

2. 发明授权

US06446818B1 Boat for cleaning ball grid array packages 失效
标题翻译：船清洁球栅阵列包
公开(公告)号：US06446818B1
公开(公告)日：2002-09-10
申请号：US09636515
申请日：2000-08-10
申请人： Ajit M. Dubey , Raj N. Master , Ot Ong , C S Chan
发明人： Ajit M. Dubey , Raj N. Master , Ot Ong , C S Chan
IPC分类号： A47F700
CPC分类号： H01L21/67333 , H01L21/67028 , H01L2221/68313
摘要： A boat for cleaning semiconductor packages, including cleaning ball grid array packages in centrifugal cleaners. The boat includes a bottom plate with receptacles for receiving semiconductor packages and a top plate having through holes, where each through hole is smaller than the receptacle with which it corresponds in the bottom plate. An alignment mechanism ensures that the top plate is aligned with the bottom plate in a manner that results in each through hole being positioned directly over a respective one of the receptacles. An attachment mechanism releasably attaches the top plate to the bottom plate in a co-planar relationship that results in the presence of a vertical space between the two plates.
摘要翻译：用于清洁半导体封装的船，包括清洁球栅阵列包装在离心清洁器中。船包括具有用于接收半导体封装的插座的底板和具有通孔的顶板，其中每个通孔小于在底板中与其对应的插座。对准机构确保顶板与底板对齐，使得每个通孔直接定位在相应的一个容器上。附接机构以平行关系可释放地将顶板附接到底板，导致两个板之间存在垂直空间。

3. 发明授权

US06333210B1 Process of ensuring detect free placement by solder coating on package pads 有权
标题翻译：确保通过焊接涂层在封装焊盘上检测自由放置的过程
公开(公告)号：US06333210B1
公开(公告)日：2001-12-25
申请号：US09577675
申请日：2000-05-25
申请人： Ajit M. Dubey , Raj N. Master
发明人： Ajit M. Dubey , Raj N. Master
IPC分类号： H01L2144
CPC分类号： H01L24/81 , H01L2224/13111 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H05K1/0269 , H05K3/3436 , H05K2201/094 , H05K2201/10992 , H05K2203/041 , Y02P70/613
摘要： A method of maintaining z-height of an integrated circuit component, such as a multi-chip module, a chip or a die, and of visualizing alignment of an integrated circuit package during positioning of an integrated circuit component, is disclosed. The method maintains the z-height of an integrated circuit component during a solder reflow step by applying high-melting solder balls to interconnect pads on the package substrate surface. Such high-melting solder balls, for instance 90 Pb/10 Sn, do not collapse at temperatures sufficient to accomplish reflowing. The high-melting solder balls also make convenient visualization marks for alignment of the package substrate on an integrated circuit component placement tool, such as a die placement tool. A package substrate bearing high-melting solder balls in a pre-determined pattern is easily aligned by an integrated circuit placement tool using machine vision. Use of high-melting solder balls as visualization marks obviates the need for screen-printing of fiducial marks on the package substrate surface.
摘要翻译：公开了一种在集成电路部件的定位期间保持诸如多芯片模块，芯片或芯片的集成电路部件的z高度以及集成电路封装的可视化对准的方法。该方法通过施加高熔点焊球以在封装衬底表面上互连焊盘来在焊料回流步骤期间保持集成电路部件的z高度。这种高熔点焊球，例如90 Pb / 10 Sn，在足以完成回流的温度下不会塌陷。高熔点焊球还使得集成电路部件放置工具（例如管芯放置工具）上的封装基板对准的便利的可视标记。通过使用机器视觉的集成电路放置工具容易地对准以预定图案承载高熔点焊球的封装衬底。使用高熔点焊球作为可视化标记避免了在封装衬底表面上对基准标记进行丝网印刷的需要。

4. 发明授权

US06621043B1 Laser trim process control 失效
标题翻译：激光修整过程控制
公开(公告)号：US06621043B1
公开(公告)日：2003-09-16
申请号：US10033061
申请日：2001-11-09
申请人： Don Lambert , Valerie Vivares , Ajit M. Dubey
发明人： Don Lambert , Valerie Vivares , Ajit M. Dubey
IPC分类号： B23K2600
CPC分类号： B23K26/02 , B23K26/702
摘要： A method of calibrating a laser utilized in a laser element cutting system utilizing a mechanical gauge having pairs of metal pads formed in rows and columns on a substrate material. The height of the metal pads varies in each row with each column having the same height. The depth of the substrate material under the metal pads varies. The mechanical gauge is subjected to a laser cut process and the mechanical gauge is illuminated by a light source. The light shining through positions of metal pads indicates that the metal pad and the underlying substrate material have been cut. The depth of cut is determined from the thickness of the metal layer and the thickness of the substrate material that have been cut.
摘要翻译：一种校准在激光元件切割系统中使用的激光的方法，该激光元件切割系统利用在基片材料上以行和列形成的金属片对。金属垫的高度在每一列上变化，每列具有相同的高度。金属焊盘下方的基板材料的深度变化。机械量规经受激光切割过程，机械表由光源照射。通过金属垫的位置照射的光指示金属垫和下面的基底材料已被切割。切割深度由金属层的厚度和已经切割的基材的厚度确定。

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