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    • 2. 发明申请
    • ILLUMINATION DEVICE WITH REMOTE LUMINESCENT MATERIAL
    • 具有远红外线材料的照明装置
    • US20120007130A1
    • 2012-01-12
    • US13256956
    • 2010-03-17
    • Christoph Gerard August HoelenAdriaan Valster
    • Christoph Gerard August HoelenAdriaan Valster
    • H01L33/50
    • H01L33/504F21K9/64F21V7/05F21V29/505F21Y2115/10H01L33/44H01L33/507H01L33/52H01L33/60H01L33/644H01L2924/0002H01L2924/00
    • The invention provides an illumination device comprising a light source and a transmissive arrangement. The light source is arranged to generate light source light and comprises a light emitting device (LED), arranged to generate LED light and a carrier comprising a first luminescent material. The carrier is in contact with the LED and the first luminescent material is arranged to convert at least part of the LED light into first luminescent material light. The transmissive arrangement of a second luminescent material is arranged remote from the light source and is arranged to convert at least part of the LED light or at least part of the first luminescent material light and/or at least part of the LED light. The invention overcomes current limitations of remote luminescent material systems in spot lighting. In addition, an extremely simple way of realizing light sources with various correlated colour temperatures is allowed, based on just a single type of white (or whitish) light source in combination with various (red-orange) remote luminescent materials.
    • 本发明提供一种包括光源和透射装置的照明装置。 光源被布置成产生光源光,并且包括布置成产生LED光的发光器件(LED)和包括第一发光材料的载体。 载体与LED接触,并且第一发光材料布置成将至少部分LED光转换成第一发光材料光。 第二发光材料的透射布置被布置成远离光源并且被布置成转换至少部分LED光或至少部分第一发光材料光和/或至少部分LED光。 本发明克服了现场照明中远距离发光材料系统的局限性。 另外,基于仅仅一种类型的白色(或发白)光源与各种(红 - 橙色)远程发光材料的组合,允许实现具有各种相关色温的光源的非常简单的方式。
    • 5. 发明授权
    • Optoelectronic semiconductor device with an array of semiconductor diode
lasers and method of manufacturing such a device
    • 具有半导体二极管激光器阵列的光电子半导体器件及其制造方法
    • US5805630A
    • 1998-09-08
    • US273528
    • 1994-07-11
    • Adriaan ValsterCarolus J. Van Der PoelJeroen J. L. Horikx
    • Adriaan ValsterCarolus J. Van Der PoelJeroen J. L. Horikx
    • H01S3/23H01S3/06H01S5/00H01S5/024H01S5/323H01S5/40H01S3/18
    • H01S5/4031H01S5/02461H01S5/32325
    • An array of semiconductor diode lasers (11, 12) is a very suitable radiation source for various applications such as optical read and write systems and laser printers. Such an array includes a semiconductor body (10) with a substrate (1) and a layer structure provided thereon in which at least two lasers (11, 12) are formed which are mutually separated by a groove (20). In the known array, the groove (20) reaches down into the substrate (1), so that the lasers (11, 12) are electrically separated from one another. According to the invention, the array of lasers (11, 12) is provided with a groove (20) with a major portion (d) of its depth (D) which is situated within the substrate (1). As a result of this, the lasers (11, 12) of the array show a surprisingly low crosstalk. Preferably, the portion (d) of the groove (20) situated in the substrate (1) is at least 3 .mu.m deep. The best results are obtained with depths (d) of approximately 10 up to at most 40 .mu.m. In a very favorable embodiment, the device is provided at the upper side with a comparatively thick electrically and thermally conducting layer. In a preferred embodiment, the groove (20) is formed by reactive ion etching so that the groove (20) can be narrow and deep and the lasers (11, 12) will lie close together. A plasma including SiCl.sub.4, Ar and CH.sub.4 forms a particularly suitable etchant for lasers (11, 12) in the InGaP/InAlGaP material system.
    • 一组半导体二极管激光器(11,12)是用于各种应用的非常合适的辐射源,例如光学读取和写入系统和激光打印机。 这种阵列包括具有衬底(1)的半导体本体(10)和设置在其上的层结构,其中形成有由凹槽(20)相互分开的至少两个激光器(11,12)。 在已知的阵列中,槽(20)向下延伸到衬底(1)中,使得激光器(11,12)彼此电分离。 根据本发明,激光器阵列(11,12)设置有其深度(D)的主要部分(d)位于衬底(1)内的凹槽(20)。 作为其结果,阵列的激光器(11,12)显示出惊人的低串扰。 优选地,位于基板(1)中的凹槽(20)的部分(d)至少为3μm深。 获得最好的结果是深度(d)大约10到最多40微米。 在非常有利的实施例中,该装置在上侧设置有较厚的导电和导热层。 在优选实施例中,通过反应离子蚀刻形成凹槽(20),使得凹槽(20)可以窄而深,并且激光器(11,12)将靠近在一起。 包括SiCl 4,Ar和CH 4的等离子体在InGaP / InAlGaP材料系统中形成用于激光器(11,12)的特别合适的蚀刻剂。
    • 6. 发明授权
    • Optoelectronic semiconductor device
    • 光电半导体器件
    • US5468975A
    • 1995-11-21
    • US352283
    • 1994-12-08
    • Adriaan Valster
    • Adriaan Valster
    • H01L33/00H01S5/00H01S5/042H01S5/22H01S5/223H01S5/32H01S5/323
    • H01S5/32325H01S5/22H01S5/223H01S5/3201H01S5/321H01S5/32391
    • An optoelectronic semiconductor device includes a first cladding layer (1) of the first conductivity type provided on a substrate (11), an active layer (2), a second cladding layer (3) of a second conductivity type, an intermediate layer (4), and a third cladding layer (5) also of the second conductivity type, the thickness of the second cladding layer (3) being such that the intermediate layer (4) lies within the optical field profile of the active layer (2), while the intermediate layer (4) includes a semiconductor material with a lower bandgap than the second (3) and third (5) cladding layers. Such devices, often in the form of diode lasers, are used inter alia in optical glass fibre communication and optical disc systems. A disadvantage of such devices is that their starting currents are comparatively high.The semiconductor material of the intermediate layer (4) has a lattice constant which is different from that of the substrate (11 ) and a bandgap which is greater than the energy of the radiation emitted by the active layer (2). As a result, the simplest possible semiconductor materials may be chosen for the intermediate layer (4), which materials have a low absorption for the emitted radiation. The starting current is reduced by this and a comparatively thick intermediate layer (4) can be used, which favors its use as an etching stopper layer. These advantages are particularly realised in devices comprising a mesa (20), such as ridge-type lasers. Ternary semiconductor materials such as InGaAs and InGaP in that case form very suitable materials for the intermediate layer (4).
    • 一种光电子半导体器件包括设置在基板(11)上的第一导电类型的第一包层(1),有源层(2),第二导电类型的第二包层(3),中间层(4) )和还具有第二导电类型的第三覆层(5),第二覆层(3)的厚度使得中间层(4)位于有源层(2)的光场分布内, 而中间层(4)包括具有比第二(3)和第三(5)包覆层更低的带隙的半导体材料。 通常为二极管激光器形式的这种器件尤其用于光学玻璃纤维通信和光盘系统中。 这种装置的缺点是它们的启动电流相对较高。 中间层(4)的半导体材料具有不同于衬底(11)的晶格常数和大于由有源层(2)发射的辐射的能量的带隙。 结果,可以为中间层(4)选择最简单的可能的半导体材料,该材料对于发射的辐射具有低吸收。 起始电流减小,可以使用比较厚的中间层(4),这有利于其用作蚀刻阻挡层。 这些优点在包括诸如脊型激光器的台面(20)的装置中特别实现。 在这种情况下,诸如InGaAs和InGaP的三元半导体材料形成用于中间层(4)的非常合适的材料。
    • 7. 发明授权
    • Semiconductor device having a mesa and method of manufacturing same
    • 具有台面的半导体装置及其制造方法
    • US5289483A
    • 1994-02-22
    • US883758
    • 1992-05-15
    • Johannes A. De PoorterAdriaan Valster
    • Johannes A. De PoorterAdriaan Valster
    • H01S5/00H01L29/06H01L33/00H01S5/022H01S5/042H01S5/223H01S3/19
    • H01L33/0062H01L29/0657H01S5/2232H01S5/2234H01S5/2237
    • A semiconductor device includes a semiconductor structure (D3) of parallel semiconductor layers on a semiconductor substrate (1), in which layers a mesa (12) is formed which includes only a portion (D1) of the semiconductor layer structure (D3). Such devices as are useful in optoelectronic devices in which the mesa (12) forms part of a semiconductor diode laser or a radiation waveguide. During cleaving of such devices, for example for the formation of a mirror surface, damage often arises near the mesa (12), which is undesirable. The mesa (12), which projects from the device, is also easily damaged during further manipulation of the device. The semiconductor layer structure (D3) includes a sunken region (11) within which the semiconductor layer structure (D3) is at least partly recessed in the substrate (1), while the mesa (12) is positioned within the boundaries of the sunken region (11). As a result, the mesa (12) is also recessed at least partly, and thus is at least partly protected. In addition, less damage occurs near the mesa (12) during cleaving. When the mesa (12) is entirely recessed, the device is in addition particularly suitable for upside-down final mounting. In a method of making the device, a recess (11) is provided in the substrate (1) before the semiconductor layer structure (D3) and the mesa (12) therein are provided. This method is very simple and gives a high yield of devices having the required characteristics.
    • 半导体器件包括在半导体衬底(1)上的平行半导体层的半导体结构(D3),其中形成仅包含半导体层结构(D3)的一部分(D1)的台面(12)的层。 这种器件可用于其中台面(12)形成半导体二极管激光器或辐射波导的一部分的光电子器件。 在这种装置的切割过程中,例如为了形成镜面,经常在台面(12)附近产生损伤,这是不期望的。 从设备突出的台面(12)在进一步操纵设备时也容易损坏。 半导体层结构(D3)包括其中半导体层结构(D3)至少部分地凹陷在基板(1)中的凹陷区域(11),而台面(12)位于凹陷区域 (11)。 结果,台面(12)也至少部分地凹入,因此至少部分地被保护。 此外,在裂开过程中在台面(12)附近发生较少的损伤。 当台面(12)完全凹陷时,该装置另外特别适合于颠倒的最终安装。 在制造该器件的方法中,在设置半导体层结构(D3)和台面(12)之前,在衬底(1)中设置凹部(11)。 该方法非常简单,并且具有高产量的具有所需特性的装置。