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    • 1. 发明授权
    • GaN vertical bipolar transistor
    • GaN垂直双极晶体管
    • US08823140B2
    • 2014-09-02
    • US13675916
    • 2012-11-13
    • Avogy, Inc.
    • Hui NieAndrew EdwardsIsik KizilyalliDave Bour
    • H01L29/66
    • H01L21/04H01L29/0615H01L29/2003H01L29/42304H01L29/66318H01L29/732H01L29/7371
    • An embodiment of a semiconductor device includes a III-nitride base structure of a first conductivity type, and a III-nitride emitter structure of a second conductivity type having a first surface and a second surface. The second surface is substantially opposite the first surface. The first surface of the III-nitride emitter structure is coupled to a surface of the III-nitride base structure. The semiconductor also includes a first dielectric layer coupled to the second surface of the III-nitride emitter structure, and a spacer coupled to a sidewall of the III-nitride emitter structure and the surface of the III-nitride base structure. The semiconductor also includes a base contact structure with a III-nitride material coupled to the spacer, the surface of the III-nitride base structure, and the first dielectric layer, such that the first dielectric layer and the spacer are disposed between the base contact structure and the III-nitride emitter structure.
    • 半导体器件的实施例包括第一导电类型的III族氮化物基底结构和具有第一表面和第二表面的第二导电类型的III族氮化物发射极结构。 第二表面基本上与第一表面相对。 III族氮化物发射极结构的第一表面耦合到III族氮化物基底结构的表面。 半导体还包括耦合到III族氮化物发射极结构的第二表面的第一电介质层和耦合到III族氮化物发射极结构的侧壁和III族氮化物基底结构的表面的间隔物。 该半导体还包括具有连接到间隔物,III族氮化物基底结构的表面和第一介电层的III族氮化物材料的基底接触结构,使得第一介电层和间隔物设置在基底触点 结构和III族氮化物发射极结构。
    • 4. 发明授权
    • Lateral GaN JFET with vertical drift region
    • 具有垂直漂移区域的横向GaN JFET
    • US09472684B2
    • 2016-10-18
    • US13675826
    • 2012-11-13
    • AVOGY, INC.
    • Hui NieAndrew EdwardsIsik KizilyalliDave BourThomas R. Prunty
    • H01L29/808H01L29/66H01L29/10H01L29/20
    • H01L29/8083H01L29/1066H01L29/2003H01L29/66909
    • A gallium nitride (GaN)-based junction field-effect transistor (JFET) can include a GaN drain region having a top surface extending in a lateral dimension, a source region, and a GaN channel region of a first conductivity type coupled between the source region and the GaN drain region and operable to conduct electrical current between the source region and the GaN drain region. The JFET can also include a blocking layer disposed between the source region and the GaN drain region such that the GaN channel region is operable to conduct the electrical current substantially along the lateral dimension in a laterally-conductive region of the GaN channel region, and a GaN gate region of a second conductivity type coupled to the GaN channel region such that the laterally-conductive region of the GaN channel region is disposed between at least a portion of the blocking layer and the GaN gate region.
    • 基于氮化镓(GaN)的结场效应晶体管(JFET)可以包括具有在横向尺寸上延伸的顶表面的GaN漏极区域,源极区域和耦合在源极之间的第一导电类型的GaN沟道区域 区域和GaN漏极区域并且可操作以在源极区域和GaN漏极区域之间传导电流。 JFET还可以包括设置在源极区域和GaN漏极区域之间的阻挡层,使得GaN沟道区域可操作地在GaN沟道区域的横向导电区域中沿着横向尺寸传导电流,并且 GaN栅极区域,其耦合到GaN沟道区域,使得GaN沟道区域的横向导电区域设置在阻挡层的至少一部分和GaN栅极区域之间。
    • 5. 发明申请
    • GALLIUM NITRIDE VERTICAL JFET WITH HEXAGONAL CELL STRUCTURE
    • 具有六角形细胞结构的硝酸锌垂直JFET
    • US20140191241A1
    • 2014-07-10
    • US13735897
    • 2013-01-07
    • AVOGY, INC.
    • Andrew P. EdwardsHui NieDonald R. DisneyIsik Kizilyalli
    • H01L27/098
    • H01L27/098H01L29/0692H01L29/2003H01L29/42312H01L29/66909H01L29/8083
    • An array of GaN-based vertical JFETs includes a GaN substrate comprising a drain of one or more of the JFETs and one or more epitaxial layers coupled to the GaN substrate. The array also includes a plurality of hexagonal cells coupled to the one or more epitaxial layers and extending in a direction normal to the GaN substrate. Sidewalls of the plurality of hexagonal cells are substantially aligned with respect to crystal planes of the GaN substrate. The array further includes a plurality of channel regions, each having a portion adjacent a sidewall of the plurality of hexagonal cells, a plurality of gate regions of one or more of the JFETs, each electrically coupled to one or more of the plurality of channel regions, and a plurality of source regions of one or more of the JFETs electrically coupled to one or more of the plurality of channel regions.
    • GaN基垂直JFET的阵列包括包含一个或多个JFET的漏极和耦合到GaN衬底的一个或多个外延层的GaN衬底。 该阵列还包括耦合到一个或多个外延层并沿垂直于GaN衬底的方向延伸的多个六边形单元。 多个六边形单元的侧壁相对于GaN衬底的晶面基本上对齐。 阵列还包括多个通道区域,每个沟道区域具有邻近多个六边形单元的侧壁的部分,一个或多个JFET的多个栅极区域,每个栅极区域电耦合到多个沟道区域中的一个或多个 以及电耦合到多个沟道区中的一个或多个的一个或多个JFET的多个源极区。
    • 6. 发明申请
    • GAN VERTICAL BIPOLAR TRANSISTOR
    • GAN垂直双极晶体管
    • US20140131837A1
    • 2014-05-15
    • US13675916
    • 2012-11-13
    • AVOGY, INC.
    • Hui NieAndrew EdwardsIsik KizilyalliDave Bour
    • H01L29/73H01L21/04
    • H01L21/04H01L29/0615H01L29/2003H01L29/42304H01L29/66318H01L29/732H01L29/7371
    • An embodiment of a semiconductor device includes a III-nitride base structure of a first conductivity type, and a III-nitride emitter structure of a second conductivity type having a first surface and a second surface. The second surface is substantially opposite the first surface. The first surface of the III-nitride emitter structure is coupled to a surface of the III-nitride base structure. The semiconductor also includes a first dielectric layer coupled to the second surface of the III-nitride emitter structure, and a spacer coupled to a sidewall of the III-nitride emitter structure and the surface of the III-nitride base structure. The semiconductor also includes a base contact structure with a III-nitride material coupled to the spacer, the surface of the III-nitride base structure, and the first dielectric layer, such that the first dielectric layer and the spacer are disposed between the base contact structure and the III-nitride emitter structure.
    • 半导体器件的实施例包括第一导电类型的III族氮化物基底结构和具有第一表面和第二表面的第二导电类型的III族氮化物发射极结构。 第二表面基本上与第一表面相对。 III族氮化物发射极结构的第一表面耦合到III族氮化物基底结构的表面。 半导体还包括耦合到III族氮化物发射极结构的第二表面的第一电介质层和耦合到III族氮化物发射极结构的侧壁和III族氮化物基底结构的表面的间隔物。 该半导体还包括具有连接到间隔物,III族氮化物基底结构的表面和第一介电层的III族氮化物材料的基底接触结构,使得第一介电层和间隔物设置在基底触点 结构和III族氮化物发射极结构。
    • 9. 发明申请
    • LATERAL GAN JFET WITH VERTICAL DRIFT REGION
    • 具有垂直移动区域的横向连杆
    • US20140131721A1
    • 2014-05-15
    • US13675826
    • 2012-11-13
    • AVOGY, INC.
    • Hui NieAndrew EdwardsIsik KizilyalliDave BourThomas R. Prunty
    • H01L29/808H01L29/20
    • H01L29/8083H01L29/1066H01L29/2003H01L29/66909
    • A gallium nitride (GaN)-based junction field-effect transistor (JFET) can include a GaN drain region having a top surface extending in a lateral dimension, a source region, and a GaN channel region of a first conductivity type coupled between the source region and the GaN drain region and operable to conduct electrical current between the source region and the GaN drain region. The JFET can also include a blocking layer disposed between the source region and the GaN drain region such that the GaN channel region is operable to conduct the electrical current substantially along the lateral dimension in a laterally-conductive region of the GaN channel region, and a GaN gate region of a second conductivity type coupled to the GaN channel region such that the laterally-conductive region of the GaN channel region is disposed between at least a portion of the blocking layer and the GaN gate region.
    • 基于氮化镓(GaN)的结场效应晶体管(JFET)可以包括具有在横向尺寸上延伸的顶表面的GaN漏极区域,源极区域和耦合在源极之间的第一导电类型的GaN沟道区域 区域和GaN漏极区域并且可操作以在源极区域和GaN漏极区域之间传导电流。 JFET还可以包括设置在源极区域和GaN漏极区域之间的阻挡层,使得GaN沟道区域可操作地在GaN沟道区域的横向导电区域中沿着横向尺寸传导电流,并且 GaN栅极区域,其耦合到GaN沟道区域,使得GaN沟道区域的横向导电区域设置在阻挡层的至少一部分和GaN栅极区域之间。