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    • 1. 发明授权
    • Methods and systems for clamping a substrate
    • US11599028B2
    • 2023-03-07
    • US16812175
    • 2020-03-06
    • ASML Netherlands B.V.
    • Marc Smits
    • G03F7/20
    • Methods and arrangement for clamping substrates to a support using adhesive material area disclosed.
      The method comprises providing a support comprising a first surface defining a plane; applying adhesive material on at least portions of the first surface; and placing the substrate onto the adhesive material, wherein the adhesive material forms a plurality of support locations supporting the substrate. Preferably the adhesive material is cured at least partly during the application of a substantially uniformly distributed force to the substrate in the direction of the support.
      The arrangements comprise a support comprising a first surface, for supporting the substrate via adhesive material, whereby the first surface defines a plane. Preferably it also comprises an arrangement for providing electromagnetic radiation, thermal energy, and/or a chemical substance to the adhesive material, and an arrangement for providing a substantially uniformly distributed force to the substrate in the direction of the support.