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    • 4. 发明申请
    • CAPACITIVE CVD REACTOR AND METHODS FOR PLASMA CVD PROCESS
    • 电解CVD反应器和等离子体CVD过程的方法
    • US20100126667A1
    • 2010-05-27
    • US12498295
    • 2009-07-06
    • Gerald YinJinyuan ChenTuqiang Ni
    • Gerald YinJinyuan ChenTuqiang Ni
    • C23F1/08C23C16/54
    • H01L21/68764C23C16/4405C23C16/5096H01J37/32091H01J2237/2001H01L21/68771
    • A decoupled capacitive CVD reactor is described, which provides improved CVD capabilities, including processing at lower temperatures, performing alternating deposition and etching steps, and performing in situ cleaning of the chamber, without the need for a remote plasma source. Two RF frequencies are coupled to the susceptor, while the anode is grounded. The high frequency RF source is operated so as to control the plasma density, while the low frequency RF source is operated to control species bombardment on the substrate, so as to control the properties of the film being deposited. Additionally, both RF sources may be controlled, together with selection of gasses supplied to the chamber, to operate the chamber either in deposition mode, partial etch mode, etching mode, or cleaning mode.
    • 描述了去耦合的电容CVD反应器,其提供改进的CVD能力,包括在较低温度下处理,执行交替沉积和蚀刻步骤,以及执行腔室的原位清洁,而不需要远程等离子体源。 两个RF频率耦合到基座,而阳极接地。 操作高频RF源以控制等离子体密度,同时操作低频RF源以控制基板上的物质轰击,以便控制被沉积的膜的性质。 此外,可以控制两个RF源以及供应到腔室的气体的选择,以沉积模式,局部蚀刻模式,蚀刻模式或清洁模式来操作腔室。
    • 8. 发明授权
    • Capacitive CVD reactor and methods for plasma CVD process
    • 电容CVD反应器和等离子体CVD工艺的方法
    • US08297225B2
    • 2012-10-30
    • US12498295
    • 2009-07-06
    • Gerald YinJinyuan ChenTuqiang Ni
    • Gerald YinJinyuan ChenTuqiang Ni
    • C23C16/54C23F1/08
    • H01L21/68764C23C16/4405C23C16/5096H01J37/32091H01J2237/2001H01L21/68771
    • A decoupled capacitive CVD reactor is described, which provides improved CVD capabilities, including processing at lower temperatures, performing alternating deposition and etching steps, and performing in situ cleaning of the chamber, without the need for a remote plasma source. Two RF frequencies are coupled to the susceptor, while the anode is grounded. The high frequency RF source is operated so as to control the plasma density, while the low frequency RF source is operated to control species bombardment on the substrate, so as to control the properties of the film being deposited. Additionally, both RF sources may be controlled, together with selection of gasses supplied to the chamber, to operate the chamber either in deposition mode, partial etch mode, etching mode, or cleaning mode.
    • 描述了去耦合的电容CVD反应器,其提供改进的CVD能力,包括在较低温度下处理,执行交替沉积和蚀刻步骤,以及执行腔室的原位清洁,而不需要远程等离子体源。 两个RF频率耦合到基座,而阳极接地。 操作高频RF源以控制等离子体密度,同时操作低频RF源以控制基板上的物质轰击,以便控制被沉积的膜的性质。 此外,可以控制两个RF源以及供应到腔室的气体的选择,以沉积模式,局部蚀刻模式,蚀刻模式或清洁模式来操作腔室。