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1. 发明申请

US20170248848A1 COATER WITH AUTOMATIC CLEANING FUNCTION AND COATER AUTOMATIC CLEANING METHOD 审中-公开
公开(公告)号：US20170248848A1
公开(公告)日：2017-08-31
申请号：US15511547
申请日：2014-09-16
申请人： ACM Research (Shanghai) Inc.
发明人： Hui Wang , Fuping Chen , Wenjun Wang , Hongchao Yang , Voha Nuch , Fufa Chen , Jian Wang , Xiaoyan Zhang , Shu Yang
IPC分类号： G03F7/16
摘要： A coater with automatic cleaning function and a coater automatic cleaning method. The coater (100,200,300,400,500,600,700,800) includes a coater chamber (101,201,301,401,501,601,701,801) capable of being filled up with cleaning solution, a substrate chuck (102,202,302,402,502,602,702,802) holding and positioning a substrate (103,203,303,403,503,603,703,803), and at least one shroud (108,208,308,408,508) capable of moving up for preventing photoresist from splashing out of the coater chamber (101,201,301,401,501,601,701,801), or moving down and immersing into the cleaning solution for cleaning. The coater (100,200,300,400,500,600,700,800) automatic cleaning method includes the following steps: turning off a liquid outlet valve (118,218,318,418A,418B,518,532,618,718,818) of the coater (100,200,300,400,500,600,700,800); filling up a coater chamber (101,201,301,401,501,601,701,801) with cleaning solution; after photoresist in the coater chamber (101,201,301,401,501,601,701,801) being dissolved into the cleaning solution, turning on the liquid outlet valve (118,218,318,418A,418B,518,532,618,718,818) and draining the cleaning solution out of the coater chamber (101,201,301,401,501,601,701,801).

2. 发明授权

US08671961B2 Methods and apparatus for cleaning semiconductor wafers 有权
标题翻译：用于清洁半导体晶片的方法和设备
公开(公告)号：US08671961B2
公开(公告)日：2014-03-18
申请号：US14052555
申请日：2013-10-11
申请人： ACM Research (Shanghai) Inc.
发明人： Voha Nuch , David Wang , Yue Ma , Fufa Chen , Jian Wang , Yunwen Huang , Liangzhi Xie , Chuan He
IPC分类号： B08B3/00
CPC分类号： H01L21/67051
摘要： An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.
摘要翻译：用于清洁和调理诸如晶片的半导体衬底的表面的设备包括可转动卡盘，腔室，用于收集具有一个或多个排出口的清洁溶液的可旋转托盘，用于收集多个清洁溶液的多个受体，用于驱动的第一马达卡盘和第二马达驱动托盘。托盘中的排水出口可以位于排水出口下方的指定接收器的正上方。由托盘收集的清洁溶液可以被引导到指定的受体中。该设备的一个特征是具有坚固且精确控制的清洁溶液循环，具有最小的交叉污染。

3. 发明授权

US11141762B2 System for cleaning semiconductor wafers 有权
公开(公告)号：US11141762B2
公开(公告)日：2021-10-12
申请号：US15814242
申请日：2017-11-15
申请人： ACM Research (Shanghai) Inc.
发明人： Hui Wang , Fufa Chen , Fuping Chen , Jian Wang , Xi Wang , Xiaoyan Zhang , Yinuo Jin , Zhaowei Jia , Liangzhi Xie , Jun Wang , Xuejun Li
IPC分类号： B08B3/12 , B06B3/02 , H01L21/67 , B08B1/00 , B06B1/02 , B08B3/08 , H01L21/02 , H01L21/687 , B06B1/06 , B06B3/00 , G08B21/18
摘要： A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

4. 发明申请

US20200335325A1 METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS 审中-公开
公开(公告)号：US20200335325A1
公开(公告)日：2020-10-22
申请号：US16092193
申请日：2016-04-06
申请人： ACM Research (Shanghai) Inc.
发明人： Jun Wang , Hui Wang , Fufa Chen , Fuping Chen , Jian Wang , Xi Wang , Xiaoyan Zhang , Yinuo Jin , Zhaowei Jia , Liangzhi Xie , Xuejun Li
IPC分类号： H01L21/02 , B08B13/00 , B08B3/12 , H01L21/67 , G08B21/18
摘要： A method for cleaning semiconductor substrate (1010,2010) without damaging patterned structure on the semiconductor substrate (1010,2010) using ultra/mega sonic device (1003,2003) comprises applying liquid into a space between a substrate (1010,2010) and an ultra/mega sonic device (1003,2003); setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive the ultra/mega sonic device (1003,2003); before bubble cavitation in the liquid damaging patterned structure on the substrate (1010,2010), setting the ultra/mega sonic power supply at zero output;after temperature inside bubble cooling down to a set temperature, setting the ultra/mega sonic power supply at frequency f1 and power P1 again; detecting power on time at power P1 and frequency f1 and power off time separately or detecting amplitude of each waveform output by the ultra/mega sonic power supply; comparing the detected power on time with a preset time τ1, or comparing the detected power off time with a preset time τ2, or comparing detected amplitude of each waveform with a preset value, if the detected power on time is longer than the preset time τ1, or the detected power off time is shorter than the preset time τ2, or the detected amplitude of any waveform is larger than the preset value, shut down the ultra/mega sonic power supply and send out an alarm signal.

5. 发明申请

US20180071795A1 METHOD FOR CLEANING SEMICONDUCTOR WAFERS 审中-公开
公开(公告)号：US20180071795A1
公开(公告)日：2018-03-15
申请号：US15814246
申请日：2017-11-15
申请人： ACM Research (Shanghai) Inc.
发明人： Hui Wang , Fufa Chen , Fuping Chen , Jian Wang , Xi Wang , Xiaoyan Zhang , Yinuo Jin , Zhaowei Jia , Liangzhi Xie , Jun Wang , Xuejun Li , Xi Wang
IPC分类号： B08B3/12 , H01L21/67 , H01L21/687 , H01L21/02 , B06B1/02 , B08B3/08
CPC分类号： B08B3/12 , B06B1/0284 , B06B1/0644 , B06B3/00 , B06B3/02 , B08B1/007 , B08B3/08 , G08B21/182 , G08B25/08 , H01L21/02052 , H01L21/67051 , H01L21/68764
摘要： A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

6. 发明授权

US11911807B2 Method and apparatus for cleaning substrates 有权
公开(公告)号：US11911807B2
公开(公告)日：2024-02-27
申请号：US16967963
申请日：2018-02-07
申请人： ACM Research (Shanghai) Inc.
发明人： Hui Wang , Xi Wang , Fuping Chen , Xiaoyan Zhang , Fufa Chen
IPC分类号： B08B3/12 , B08B3/08 , H01L21/02 , H01L21/67
CPC分类号： B08B3/12 , B08B3/08 , H01L21/02057 , H01L21/67051 , H01L21/67098 , B08B2220/00 , B08B2240/00
摘要： The present invention provides a method for cleaning substrates comprising the steps of: placing a substrate on a substrate holder; implementing a bubble less or bubble-free pre-wetting process for the substrate; and implementing an ultra/mega sonic cleaning process for cleaning the substrate.

7. 发明授权

US11638937B2 Methods and apparatus for cleaning substrates 有权
公开(公告)号：US11638937B2
公开(公告)日：2023-05-02
申请号：US17378096
申请日：2021-07-16
申请人： ACM Research (Shanghai) Inc.
发明人： Hui Wang , Xi Wang , Fuping Chen , Fufa Chen , Jian Wang , Xiaoyan Zhang , Yinuo Jin , Zhaowei Jia , Jun Wang , Xuejun Li
IPC分类号： B08B3/12 , B06B1/02 , B06B1/06 , H01L21/02 , H01L21/67
摘要： A method for effectively cleaning vias (20034), trenches (20036) or recessed areas on a substrate (20010) using an ultra/mega sonic device (1003, 3003, 16062, 17072), comprising: applying liquid (1032) into a space between a substrate (20010) and an ultra/mega sonic device (1003, 3003, 16062, 17072); setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside vias (20034), trenches (20036) or recessed areas on the substrate (20010) increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside the vias (20034), trenches (20036) or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate (20010) being cleaned.

8. 发明授权

US11633765B2 System for cleaning semiconductor wafers 有权
公开(公告)号：US11633765B2
公开(公告)日：2023-04-25
申请号：US17470713
申请日：2021-09-09
申请人： ACM Research (Shanghai) Inc.
发明人： Hui Wang , Fufa Chen , Fuping Chen , Jian Wang , Xi Wang , Xiaoyan Zhang , Yinuo Jin , Zhaowei Jia , Liangzhi Xie , Jun Wang , Xuejun Li
IPC分类号： B08B3/12 , B08B1/00 , H01L21/67 , B06B3/02 , B06B1/02 , B08B3/08 , H01L21/02 , H01L21/687 , B06B1/06 , B06B3/00 , G08B21/18
摘要： A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

9. 发明授权

US11257667B2 Methods and apparatus for cleaning semiconductor wafers 有权
公开(公告)号：US11257667B2
公开(公告)日：2022-02-22
申请号：US16092193
申请日：2016-04-06
申请人： ACM Research (Shanghai) Inc.
发明人： Jun Wang , Hui Wang , Fufa Chen , Fuping Chen , Jian Wang , Xi Wang , Xiaoyan Zhang , Yinuo Jin , Zhaowei Jia , Liangzhi Xie , Xuejun Li
IPC分类号： H01L21/02 , B08B3/12 , B08B13/00 , G08B21/18 , H01L21/67
摘要： A method for cleaning a semiconductor substrate without damaging its patterned structure via an ultra/mega sonic device comprises applying liquid into a space between the substrate and the sonic device; setting an ultra/mega sonic device power supply at a frequency f1 and power P1; and at zero output before bubble cavitation occurs; followed by at f1 and P1 again after bubble temperature is lowered; detecting power on time (at P1, f1), power off time or amplitude of each waveform output by the power supply; comparing the detected power on time with a preset time T1, power off time with a preset time τ2, amplitude of each waveform with a preset value, if the detected power on time is longer than τ1, or power off time is shorter than τ2, or amplitude of any waveform is larger than the preset value, shut down the power supply and send out an alarm.

10. 发明授权

US10770335B2 Substrate supporting apparatus 有权
公开(公告)号：US10770335B2
公开(公告)日：2020-09-08
申请号：US16315507
申请日：2016-07-06
申请人： ACM Research (Shanghai) Inc.
发明人： Fufa Chen , Zhiyou Fang , Jun Wu , Hui Wang , Fuping Chen , Wenjun Wang
IPC分类号： H01L21/687 , H01L21/683 , H01L21/67 , H01L21/677
摘要： A substrate supporting apparatus (300) for cleaning a back side of a substrate (107) is provided. The substrate supporting apparatus (300) has a hollow shaft (319) and a rotary spindle (303). The rotary spindle (303) is set in the hollow shaft (319) and a spacing is formed between an outer wall of the rotary spindle (303) and an inner wall of the hollow shaft (319). The outer wall of the rotary spindle (303) defines a blocking wall (322) and a recess (324) to prevent particles in the spacing from entering a gas groove (325) which is formed on the hollow shaft (319) and supplies gas to a front side of the substrate (107), avoiding the particles contaminating the front side of the substrate (107), which improves the quality of semiconductor devices.

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