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1. 发明授权

US09490342B2 Method for fabricating semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US09490342B2
公开(公告)日：2016-11-08
申请号：US13161591
申请日：2011-06-16
申请人： Chien-Ming Lai , Yi-Wen Chen , Zhi-Cheng Lee , Tong-Jyun Huang , Che-Hua Hsu , Kun-Hsien Lin , Tzung-Ying Lee , Chi-Mao Hsu , Hsin-Fu Huang , Chin-Fu Lin
发明人： Chien-Ming Lai , Yi-Wen Chen , Zhi-Cheng Lee , Tong-Jyun Huang , Che-Hua Hsu , Kun-Hsien Lin , Tzung-Ying Lee , Chi-Mao Hsu , Hsin-Fu Huang , Chin-Fu Lin
IPC分类号： H01L21/3205 , H01L29/66 , H01L21/8238 , H01L21/28 , H01L21/3213 , H01L29/423 , H01L29/49 , H01L29/51 , H01L29/78
CPC分类号： H01L29/6659 , H01L21/28088 , H01L21/32134 , H01L21/823842 , H01L29/42376 , H01L29/4966 , H01L29/513 , H01L29/517 , H01L29/518 , H01L29/66545 , H01L29/7833
摘要： A method for fabricating a semiconductor device includes the following steps. Firstly, a dummy gate structure having a dummy gate electrode layer is provided. Then, the dummy gate electrode layer is removed to form an opening in the dummy gate structure, thereby exposing an underlying layer beneath the dummy gate electrode layer. Then, an ammonium hydroxide treatment process is performed to treat the dummy gate structure. Afterwards, a metal material is filled into the opening.
摘要翻译：一种制造半导体器件的方法包括以下步骤。首先，提供具有伪栅极电极层的虚拟栅极结构。然后，去除虚拟栅极电极层，以在虚拟栅极结构中形成开口，从而暴露在伪栅极电极层下面的下面的层。然后，进行氢氧化铵处理处理以处理伪栅极结构。之后，将金属材料填充到开口中。

2. 发明授权

US08579661B2 High speed modular jack 有权
标题翻译：高速模块插孔
公开(公告)号：US08579661B2
公开(公告)日：2013-11-12
申请号：US13160560
申请日：2011-06-15
申请人： Zhi-Cheng Zhang
发明人： Zhi-Cheng Zhang
IPC分类号： H01R13/648
CPC分类号： H01R13/6587 , H01R13/518 , H01R13/6658 , H01R24/64
摘要： A modular jack (100) is adapted to be mounted onto a horizontal mother printed circuit board (PCB). The modular jack comprises a housing (200) defining an upper row of ports and a lower row of ports vertically stacked in columns, a number of vertical PCBs (46, 47) extending along a front-to-rear direction and being aligned laterally, a number of shield modules (500, 54) each having a vertical shield plate (50, 548) and an insulating portion (48 and 49, 55) at least partially encapsulating the vertical shield plate. Each of the vertical PCB electrically connecting with a set of mating contacts extending into one of the upper row of ports and the lower row of ports. The vertical PCBs and the shield modules are stacked side by side in an alternating manner.
摘要翻译：模块化插座（100）适于安装在水平母版印刷电路板（PCB）上。模块化插座包括限定上排端口的壳体（200）和垂直堆叠成列的下排端口，沿着前后方向延伸并且横向排列的多个垂直PCB（46,47）每个具有垂直屏蔽板（50,548）的屏蔽模块（500,54）和至少部分地封装垂直屏蔽板的绝缘部分（48和49,55）的多个屏蔽模块（500,54）。垂直PCB中的每一个电连接到一组配合触点，其延伸到上排端口和下排端口之一。垂直PCB和屏蔽模块以交替的方式并排堆叠。

3. 发明授权

US08282407B1 Card connector with two switch terminals each with a locating portion and a fastening portion 失效
标题翻译：卡连接器具有两个开关端子，每个开关端子具有定位部分和紧固部分
公开(公告)号：US08282407B1
公开(公告)日：2012-10-09
申请号：US13205754
申请日：2011-08-09
申请人： Zhi-Cheng Qu , Bing-Tao Yang , Yin-Lung Wu , Ming-Chiang Chen
发明人： Zhi-Cheng Qu , Bing-Tao Yang , Yin-Lung Wu , Ming-Chiang Chen
IPC分类号： H01R29/00
CPC分类号： G06K7/0069 , H01R12/57 , H01R13/6581
摘要： A card connector for receiving a card includes an insulating housing, a plurality of conductive terminals received in the insulating housing, a first switch terminal, a second switch terminal and a shielding shell covered on the insulating housing. The insulating housing defines a first switch groove, a second switch groove, a first fastening groove and a second fastening groove. The first switch terminal includes a first fastening portion fastened in the first fastening groove, a first locating portion located in the first switch groove, and a first contact portion hung over the insulating housing. The second switch terminal includes a second fastening portion fastened in the second fastening groove, a second locating portion located in the second switch groove, and a second contact portion hung over the insulating housing to electrically contact with the first contact portion under the pressure of the card.
摘要翻译：用于接收卡的卡连接器包括绝缘壳体，容纳在绝缘壳体中的多个导电端子，第一开关端子，第二开关端子和覆盖在绝缘壳体上的屏蔽壳。绝缘壳体限定第一开关槽，第二开关槽，第一紧固槽和第二紧固槽。第一开关端子包括紧固在第一紧固槽中的第一紧固部分，位于第一开关槽中的第一定位部分和悬挂在绝缘壳体上的第一接触部分。第二开关端子包括紧固在第二紧固槽中的第二紧固部分，位于第二开关槽中的第二定位部分和悬挂在绝缘壳体上的第二接触部分，以在第一接触部分的压力下与第一接触部分电接触卡。

4. 发明授权

US08246391B1 Connector terminal 失效
标题翻译：连接器端子
公开(公告)号：US08246391B1
公开(公告)日：2012-08-21
申请号：US13091118
申请日：2011-04-20
申请人： Zhi-Cheng Qu , Bing-Tao Yang , Yin-Lung Wu , Ming-Chiang Chen
发明人： Zhi-Cheng Qu , Bing-Tao Yang , Yin-Lung Wu , Ming-Chiang Chen
IPC分类号： H01R13/40
CPC分类号： H01R13/428
摘要： A connector terminal is assembled in an insulating housing defining a receiving cavity of which front and rear sides protrude face-to-face to form two blocking eaves. The connector terminal has a fastening strip of which a bottom edge protrudes downward to form two elastic arms spaced from each other, and a soldering portion between the two elastic arms. The elastic arms are apart from two opposite side edges of the soldering portion to define two receiving intervals between the soldering portion and the elastic arms. Distal ends of the elastic arms oppositely protrude to form two fastening barbs. The soldering portion and the elastic arms are inserted in the receiving cavity. The fastening barbs slide through the blocking eaves to be hooked under the blocking eaves respectively and the fastening barbs can be avoided scraping the connector by means of cushion effects of the receiving intervals.
摘要翻译：连接器端子组装在绝缘壳体中，该绝缘壳体限定其前侧和后侧面向前突出的接收腔，以形成两个阻挡屋檐。连接器端子具有紧固条，底部边缘向下突出以形成彼此间隔开的两个弹性臂，以及两个弹性臂之间的焊接部分。弹性臂从焊接部分的两个相对侧边缘分开，以限定焊接部分和弹性臂之间的两个接收间隔。弹性臂的远端相对地突出以形成两个紧固倒钩。焊接部分和弹性臂插入接收腔中。紧固倒钩分别滑动通过阻挡的檐口钩在阻挡檐下，并且可以避免紧固倒钩通过接收间隔的缓冲作用刮擦连接器。

5. 发明授权

US08232152B2 Removing method of a hard mask 有权
标题翻译：去除硬掩模的方法
公开(公告)号：US08232152B2
公开(公告)日：2012-07-31
申请号：US12883233
申请日：2010-09-16
申请人： Che-Hua Hsu , Shao-Hua Hsu , Zhi-Cheng Lee , Cheng-Guo Chen , Shin-Chi Chen , Hung-Ling Shih , Hung-Yi Wu , Heng-Ching Huang
发明人： Che-Hua Hsu , Shao-Hua Hsu , Zhi-Cheng Lee , Cheng-Guo Chen , Shin-Chi Chen , Hung-Ling Shih , Hung-Yi Wu , Heng-Ching Huang
IPC分类号： H01L21/336
CPC分类号： H01L29/66545 , H01L21/823456 , H01L21/823468 , H01L29/6656
摘要： A removing method of a hard mask includes the following steps. A substrate is provided. At least two MOSFETs are formed on the substrate. An isolating structure is formed in the substrate and located between the at least two MOSFETs. Each of the MOSEFTs includes a gate insulating layer, a gate, a spacer and a hard mask on the gate. A protecting structure is formed on the isolating structure and the hard mask is exposed from the protecting structure. The exposed hard mask is removed to expose the gate.
摘要翻译：硬掩模的去除方法包括以下步骤。提供基板。在衬底上形成至少两个MOSFET。在衬底中形成隔离结构，并且位于至少两个MOSFET之间。 MOSEFT中的每一个在栅极上包括栅极绝缘层，栅极，间隔物和硬掩模。在隔离结构上形成保护结构，从保护结构露出硬掩模。暴露的硬掩模被移除以露出门。

6. 发明授权

US08210510B2 Clamping device for portable electronic device 失效
标题翻译：便携式电子设备夹紧装置
公开(公告)号：US08210510B2
公开(公告)日：2012-07-03
申请号：US12685826
申请日：2010-01-12
申请人： Lei Li , Ping Chen , Zhi Cheng , Jian-Gui Wu , Hong-Yan Li , Lin-Sen Dong , Yong-Zhi Tao , Chang-Fa Sun
发明人： Lei Li , Ping Chen , Zhi Cheng , Jian-Gui Wu , Hong-Yan Li , Lin-Sen Dong , Yong-Zhi Tao , Chang-Fa Sun
IPC分类号： B25B5/00 , B25B1/20 , B25B27/14 , B23Q3/00 , A44B99/00
CPC分类号： B25B1/103 , B25B1/2484 , B25B5/10 , Y10T24/44017 , Y10T29/53961
摘要： A clamping device for clamping a portable electronic device is provided. The clamping device includes a mounting board and a clamping mechanism. The clamping mechanism includes two adjusting members, two sliding blocks, and a sliding rail. The adjusting members can adjust the positions of the sliding blocks on the sliding rail. The sliding rail is selectively attached to the mounting board, either horizontally or vertically.
摘要翻译：提供一种用于夹持便携式电子设备的夹紧装置。夹紧装置包括安装板和夹紧机构。夹紧机构包括两个调节构件，两个滑块和滑轨。调节构件可以调节滑轨上的滑动块的位置。滑轨选择性地连接到安装板，水平或垂直。

7. 发明申请

US20110306241A1 HIGH SPEED MODULAR JACK 有权
标题翻译：高速模块插座
公开(公告)号：US20110306241A1
公开(公告)日：2011-12-15
申请号：US13160560
申请日：2011-06-15
申请人： ZHI-CHENG ZHANG
发明人： ZHI-CHENG ZHANG
IPC分类号： H01R13/648
CPC分类号： H01R13/6587 , H01R13/518 , H01R13/6658 , H01R24/64
摘要： A modular jack (100) is adapted to be mounted onto a horizontal mother printed circuit board (PCB). The modular jack comprises a housing (200) defining an upper row of ports and a lower row of ports vertically stacked in columns, a number of vertical PCBs (46, 47) extending along a front-to-rear direction and being aligned laterally, a number of shield modules (500, 54) each having a vertical shield plate (50, 548) and an insulating portion (48 and 49, 55) at least partially encapsulating the vertical shield plate. Each of the vertical PCB electrically connecting with a set of mating contacts extending into one of the upper row of ports and the lower row of ports. The vertical PCBs and the shield modules are stacked side by side in an alternating manner.
摘要翻译：模块化插座（100）适于安装在水平母版印刷电路板（PCB）上。模块化插座包括限定上排端口的壳体（200）和垂直堆叠成列的下排端口，沿着前后方向延伸并且横向排列的多个垂直PCB（46,47）多个屏蔽模块（500,54），每个屏蔽模块具有垂直屏蔽板（50,548）和至少部分地封装垂直屏蔽板的绝缘部分（48和49,55）。垂直PCB中的每一个电连接到一组配合触点，其延伸到上排端口和下排端口之一。垂直PCB和屏蔽模块以交替的方式并排堆叠。

8. 外观设计

USD644186S1 Connector contact 有权
标题翻译：连接器接点
公开(公告)号：USD644186S1
公开(公告)日：2011-08-30
申请号：US29382072
申请日：2010-12-28
申请人： Zhi-Cheng Qu , Bing-Tao Yang , Yin-Lung Wu , Ming-Chiang Chen
设计人： Zhi-Cheng Qu , Bing-Tao Yang , Yin-Lung Wu , Ming-Chiang Chen

9. 发明授权

US07976648B1 Heat treatment for cold worked nitinol to impart a shape setting capability without eventually developing stress-induced martensite 有权
标题翻译：用于冷加工镍钛诺的热处理以赋予形状设定能力，而不会最终产生应力诱发的马氏体
公开(公告)号：US07976648B1
公开(公告)日：2011-07-12
申请号：US09705422
申请日：2000-11-02
申请人： John Francis Boylan , Zhi Cheng Lin
发明人： John Francis Boylan , Zhi Cheng Lin
IPC分类号： C22F1/00
CPC分类号： C22F1/10 , A61F2/013 , A61F2002/018 , A61F2210/0023 , A61F2230/0006 , A61F2230/0067 , A61L31/022 , A61L2400/16 , A61M2025/09141 , C22C19/03 , C22F1/006
摘要： Cold worked nickel-titanium alloys that have linear pseudoelastic behavior without a phase transformation or onset of stress-induced martensite as applied to a medical device having a strut formed body deployed from a sheath. In one application, an embolic protection device that employs a linear pseudoelastic nitinol self-expanding strut assembly with a small profile delivery system for use with interventional procedures. The expandable strut assembly is covered with a filter element and both are compressed into a restraining sheath for delivery to a deployment site downstream and distal to an interventional procedure. Once at the desired site, the restraining sheath is retracted to deploy the embolic protection device, which captures flowing emboli generated during the interventional procedure. Linear pseudoelastic nitinol is used in the medical device as distinct from non-linear pseudoelastic (i.e., superelastic) nitinol.
摘要翻译：冷加工的镍钛合金具有线性假弹性特性，而不会发生应力诱发马氏体的相转变或开始应用于具有从套管展开的支柱成形体的医疗装置。在一个应用中，一种栓塞保护装置，其采用线性假弹性镍钛诺自扩张支架组件，其具有用于介入程序的小型轮廓输送系统。可膨胀支柱组件被过滤元件覆盖，并且两者被压缩成约束护套，用于递送到介入过程下游和远端的部署部位。一旦在期望的位置，约束护套被缩回以部署栓塞保护装置，其捕获在介入手术期间产生的流动栓塞。在医疗装置中使用线性假弹性镍钛诺不同于非线性假弹性（即超弹性）镍钛诺。

10. 发明授权

US07973330B2 Substrate-free light emitting diode 有权
标题翻译：无基板发光二极管
公开(公告)号：US07973330B2
公开(公告)日：2011-07-05
申请号：US12510255
申请日：2009-07-27
申请人： Chien-Cheng Yang , Zhi-Cheng Hsiao , Gen-Wen Hsieh
发明人： Chien-Cheng Yang , Zhi-Cheng Hsiao , Gen-Wen Hsieh
IPC分类号： H01L33/00
CPC分类号： H01L33/0079
摘要： A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.
摘要翻译：提供了包括外延层，导电支撑层和第一接触焊盘的无基板的发光二极管（LED）。外延层包括第一掺杂半导体层，发光层和第二掺杂半导体层。发光层设置在第一掺杂半导体层上，第一掺杂半导体层的一部分露出。第二类掺杂半导体层和导电支撑层依次设置在第二掺杂半导体层上。第一接触焊盘设置在暴露的第一型掺杂半导体层上并与其电连接。用作电极的第一接触焊盘和导电支撑层设置在外延层的同一侧，以避免电极的遮光效应，以提高LED的前发光效率。

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