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1. 发明授权

US08604430B2 Method and an apparatus of an inspection system using an electron beam 有权
标题翻译：使用电子束的检查系统的方法和装置
公开(公告)号：US08604430B2
公开(公告)日：2013-12-10
申请号：US13366874
申请日：2012-02-06
申请人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号： H01J37/28
CPC分类号： H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要： The inspection apparatus disclosed generates an electron beam, an acceleration electrode accelerates the electron beam, a convergence lens converges the electron beam, an electron beam deflector scans the beam over a sample, an objective lens converges the electron beam on the sample, a detector located between the sample and the objective lens detects charged particles emitted from the sample, a power supply applies a retarding voltage to the sample for decelerating the electron beam to the sample, an electrode is disposed between the objective lens and the sample, and a voltage is generated between the sample and the electrode by said electrode, the voltage being determined depending on the sample. The apparatus solves problems encountered in conventional inspection systems.
摘要翻译：所公开的检查装置产生电子束，加速电极加速电子束，会聚透镜会聚电子束，电子束偏转器扫描样品上的光束，物镜会将电子束会聚在样品上，检测器位于在样品和物镜之间检测从样品发射的带电粒子，电源向样品施加延迟电压以将电子束减速到样品，电极设置在物镜和样品之间，电压为通过所述电极在样品和电极之间产生，电压根据样品确定。该装置解决了常规检测系统遇到的问题。

2. 发明授权

US07417444B2 Method and apparatus for inspecting integrated circuit pattern 失效
标题翻译：检查集成电路图案的方法和装置
公开(公告)号：US07417444B2
公开(公告)日：2008-08-26
申请号：US11269617
申请日：2005-11-09
申请人： Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
发明人： Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
IPC分类号： G01R31/305 , H01J37/28
CPC分类号： G01R31/305 , G01R31/307 , H01J37/28 , H01J2237/2817
摘要： A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.
摘要翻译：一种电路图案检查方法及其装置，其中待检查样品的待检查部分的整个部分被制成处于预定的充电状态，被检查的部分用图像形成高分辨率照射，在扫描电子束时，在从电子束照射的时刻起经过规定的时间后，在照射电子束的部分检测到二次带电粒子，根据这样检测的次级通过使用如此形成的图像来检查带电粒子信号，并检查待检查的部分。

3. 发明授权

US07026830B2 Method and apparatus for inspecting integrated circuit pattern 失效
标题翻译：检查集成电路图案的方法和装置
公开(公告)号：US07026830B2
公开(公告)日：2006-04-11
申请号：US10379555
申请日：2003-03-06
申请人： Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
发明人： Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
IPC分类号： G01R31/305 , G01R31/28
CPC分类号： G01R31/305 , G01R31/307 , H01J37/28 , H01J2237/2817
摘要： To make possible the in-line inspection of a pattern of an insulating material.A patterned wafer 40 formed with a pattern by a resist film is placed on a specimen table 21 of a patterned wafer inspection apparatus 1 in opposed relation to a SEM 3. An electron beam 10 of a large current is emitted from an electron gun 11 and the pattern of the patterned wafer is scanned only once at a high scanning rate. The secondary electrons generated by this scanning from the patterned wafer are detected by a secondary electron detector 16 thereby to acquire an electron beam image. Using this electron beam image, the comparative inspection is conducted on the patterned wafer through an arithmetic operation unit 32 and a defect determining unit 33. Since an electron beam image of high contrast can be obtained by scanning an electron beam only once, a patterned wafer inspection method using a SEM can be implemented in the IC fabrication method.
摘要翻译：使绝缘材料的图案能够在线检查。通过抗蚀剂膜形成图案的图案化晶片40与SEM 3相对地放置在图案化晶片检查装置1的样本台21上。从电子枪11发射大电流的电子束10，以高扫描速度扫描图案化晶片的图案一次。通过二次电子检测器16检测来自图案化晶片的该扫描产生的二次电子，从而获得电子束图像。使用该电子束图像，通过算术运算单元32和缺陷判定单元33对图案化晶片进行比较检查。由于可以通过仅扫描电子束一次来获得高对比度的电子束图像，因此图案化晶片使用SEM的检查方法可以在IC制造方法中实现。

4. 发明授权

US07012252B2 Method and an apparatus of an inspection system using an electron beam 失效
公开(公告)号：US07012252B2
公开(公告)日：2006-03-14
申请号：US11108877
申请日：2005-04-19
申请人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人： Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号： H01J37/28
CPC分类号： H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要： Problems encountered in the conventional inspection method and the conventional apparatus adopting the method are solved by the present invention using an electron beam by providing a novel inspection method and an inspection apparatus adopting the novel method which are capable of increasing the speed to scan a specimen such as a semiconductor wafer.The inspection novel method provided by the present invention comprises the steps of: generating an electron beam; converging the generated electron beam on a specimen by using an objective lens; scanning the specimen by using the converged electron beam; continuously moving the specimen during scanning; detecting charged particles emanating from the specimen at a location between the specimen and the objective lens and converting the detected charged particles into an electrical signal; storing picture information conveyed by the electrical signal; comparing a picture with another by using the stored picture information; and detecting a defect of the specimen.

5. 发明申请

US20060043982A1 Method and apparatus for inspecting integrated circuit pattern 失效
标题翻译：检查集成电路图案的方法和装置
公开(公告)号：US20060043982A1
公开(公告)日：2006-03-02
申请号：US11269617
申请日：2005-11-09
申请人： Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
发明人： Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
IPC分类号： G01R31/305
CPC分类号： G01R31/305 , G01R31/307 , H01J37/28 , H01J2237/2817
摘要： A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.
摘要翻译：一种电路图案检查方法及其装置，其中待检查样品的待检查部分的整个部分被制成处于预定的充电状态，被检查的部分用图像形成高分辨率照射，在扫描电子束时，在从电子束照射的时刻起经过规定的时间后，在照射电子束的部分检测到二次带电粒子，根据这样检测的次级通过使用如此形成的图像来检查带电粒子信号，并检查待检查的部分。

6. 发明授权

US06559663B2 Method and apparatus for inspecting integrated circuit pattern 有权
标题翻译：检查集成电路图案的方法和装置
公开(公告)号：US06559663B2
公开(公告)日：2003-05-06
申请号：US09983703
申请日：2001-10-25
申请人： Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
发明人： Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
IPC分类号： G01R31305
CPC分类号： G01R31/305 , G01R31/307 , H01J37/28 , H01J2237/2817
摘要： A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with: the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.
摘要翻译：一种电路图案检查方法及其装置，其中待检查样品的待检查部分的整个部分被制成处于预定的充电状态，被检查的部分用图像形成高分辨率照射，在扫描电子束的同时，在从照射电子束的时刻起经过规定时间后，照射电子束的部位检测到二次带电粒子，根据这样检测出形成图像通过使用如此形成的图像来检查次级带电粒子信号和待检查的部分。

7. 发明授权

US06394797B1 Substrate temperature control system and method for controlling temperature of substrate 失效
标题翻译：基板温度控制系统及控制基板温度的方法
公开(公告)号：US06394797B1
公开(公告)日：2002-05-28
申请号：US09526460
申请日：2000-03-16
申请人： Masakazu Sugaya , Fumio Murai , Yutaka Kaneko , Masafumi Kanetomo , Shigeki Hirasawa , Tomoji Watanabe , Tatuharu Yamamoto , Katsuhiro Kuroda
发明人： Masakazu Sugaya , Fumio Murai , Yutaka Kaneko , Masafumi Kanetomo , Shigeki Hirasawa , Tomoji Watanabe , Tatuharu Yamamoto , Katsuhiro Kuroda
IPC分类号： F27D500
CPC分类号： H01L21/67103 , H01L21/67248
摘要： To provide a substrate temperature control system capable of unifying the temperature of the substrate and capable of shortening the temperature elevation time (temperature lowering time), the substrate temperature control system is equipped with a temperature control plate (heating or cooling plate) having a plurality of projections on its surface and acting to set the temperature of the substrate. A chuck mechanism is provided to fix the substrate in contact with a plurality of the projections by chucking the substrate toward the temperature control plate.
摘要翻译：为了提供能够统一基板的温度并且能够缩短升温时间（降温时间）的基板温度控制系统，基板温度控制系统配备有具有多个温度控制板（加热或冷却板）的表面上的突起并用于设定基板的温度。提供卡盘机构，通过将基板夹持到温度控制板来固定基板与多个突起接触。

8. 发明授权

US06329826B1 Method and apparatus for inspecting integrated circuit pattern 有权
标题翻译：检查集成电路图案的方法和装置
公开(公告)号：US06329826B1
公开(公告)日：2001-12-11
申请号：US09525341
申请日：2000-03-14
申请人： Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
发明人： Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
IPC分类号： G01R31305
CPC分类号： G01R31/305 , G01R31/307 , H01J37/28 , H01J2237/2817
摘要： A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.
摘要翻译：一种电路图案检查方法及其装置，其中待检查样品的待检查部分的整个部分被制成处于预定的充电状态，被检查的部分用图像形成高分辨率照射，在扫描电子束时，在从电子束照射的时刻起经过规定的时间后，在照射电子束的部分检测到二次带电粒子，根据这样检测的次级通过使用如此形成的图像来检查带电粒子信号，并检查待检查的部分。

9. 发明授权

US6133997A System for spotting moving objects based on a plurality of artificial satellites 失效
标题翻译：用于基于多个人造卫星发现移动物体的系统
公开(公告)号：US6133997A
公开(公告)日：2000-10-17
申请号：US272616
申请日：1999-03-19
申请人： Koji Yamawaki , Yasuhiro Takami , Yoko Nishio , Yutaka Kaneko , Takahiro Kinoshita
发明人： Koji Yamawaki , Yasuhiro Takami , Yoko Nishio , Yutaka Kaneko , Takahiro Kinoshita
IPC分类号： G01C11/06 , B64G1/10 , G01C3/06 , G01C15/00 , G01B11/26 , C01C9/00 , C01C21/00 , C01C21/02
CPC分类号： B64G1/1085 , B64G1/1021 , B64G2001/1057
摘要： A system for spotting moving objects based on a plurality of artificial satellites including: a step of taking images at the same point in time by using imaging devices respectively mounted on at least two units of artificial satellites located separately from one another of which the positions can be defined at every moment in time; a step of discriminating a large number of stars at infinity and a small number of moving objects located near the earth through a synthetic processing by superimposing upon one another at least two images of spots obtained from the image taking at the respective satellites; and a step of specifying the positions of the discriminated moving objects from data of images forming positions of the moving objects on the basis of the large number of stars at infinity.
摘要翻译：一种用于基于多个人造卫星来检测移动物体的系统，包括：通过使用分别安装在至少两个单元的人造卫星上的成像装置在相同的时间点拍摄图像的步骤，所述人造卫星彼此分开位置，及时定义; 通过合成处理，通过将从在各个卫星拍摄的图像获得的斑点的至少两个图像叠加在一起，将无限远的大量星星和少数位于地球附近的移动物体相互叠加; 以及基于无限远的大量恒星来指定辨别出的移动物体的位置的数据，从形成移动物体的位置的图像的数据。

10. 发明授权

US5782274A Elliptical cleaning box for filling apparatus 失效
标题翻译：灌装设备椭圆清洗盒
公开(公告)号：US5782274A
公开(公告)日：1998-07-21
申请号：US816056
申请日：1997-03-11
申请人： Yutaka Kaneko , Bengt Andersson
发明人： Yutaka Kaneko , Bengt Andersson
IPC分类号： B65B3/00 , B65B39/00 , B67C3/00 , B65B3/04
CPC分类号： B65B39/00 , B65B2210/08
摘要： A cleaning box for a liquid food product filling apparatus includes a mounting member from which the plurality of filling tubes depend, and a hollow, shroud-like elliptical cylindrical body extending from the mounting member. The cleaning box is configured to, in part, shroud the filling tubes. The elliptical cylindrical body has a longitudinal axis, and is mounted to the mounting member so as to define an elliptical juncture therebetween. The elliptical cylindrical body terminates at about a free end of the filling tubes so as to define an opening. The opening is formed at an angle relative to the longitudinal axis so as to define a circular end profile. The opening is further formed such that the filling tubes are visually perceptible from a plane perpendicular to the longitudinal axis.
摘要翻译：用于液体食品填充设备的清洁盒包括多个填充管所依赖的安装构件和从安装构件延伸的中空的护罩状椭圆柱体。清洁盒被构造成部分地覆盖灌装管。椭圆柱体具有纵向轴线，并且安装到安装构件以便在它们之间限定椭圆形接合部。椭圆形圆柱体终止于填充管的大约自由端，以限定开口。开口以相对于纵向轴线成一定角度形成，以便限定圆形端部轮廓。开口进一步形成为使得填充管从垂直于纵向轴线的平面视觉上可感知。

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