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1. 发明申请

US20140021605A1 Package on Package Devices and Methods of Packaging Semiconductor Dies 有权
标题翻译：封装器件封装和封装半导体芯片的方法
公开(公告)号：US20140021605A1
公开(公告)日：2014-01-23
申请号：US13552375
申请日：2012-07-18
申请人： Chen-Hua Yu , Yung Ching Chen , Chien-Hsun Lee , Jiun Yi Wu , Mirng-Ji Lii , Ming-Da Cheng
发明人： Chen-Hua Yu , Yung Ching Chen , Chien-Hsun Lee , Jiun Yi Wu , Mirng-Ji Lii , Ming-Da Cheng
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L25/0657 , H01L21/4853 , H01L21/68778 , H01L23/3142 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/17 , H01L24/73 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13164 , H01L2224/13169 , H01L2224/16058 , H01L2224/16148 , H01L2224/16238 , H01L2224/26175 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81191 , H01L2224/92125 , H01L2225/0651 , H01L2225/06513 , H01L2225/0652 , H01L2225/06548 , H01L2225/06565 , H01L2225/06572 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/20645 , H01L2224/16225 , H01L2924/00012 , H01L2924/014
摘要： Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a stick region, a first ball region coupled to a first end of the stick region, and a second ball region coupled to a second end of the stick region. The metal stud bumps include a portion that is partially embedded in a solder joint.
摘要翻译：封装封装（PoP）器件和封装半导体管芯的方法被公开。 PoP器件包括第一封装管芯和耦合到第一封装管芯的第二封装管芯。在第一封装模具和第二封装模具之间设置金属凸块凸块。金属柱凸块包括一个棒状区域，一个耦合到该棒状区域的第一端的第一球形区域和一个耦合到该棒状区域的第二端的第二球形区域。金属柱凸块包括部分嵌入焊点中的部分。

2. 发明申请

US20140004660A1 System and Method for Forming Uniform Rigid Interconnect Structures 有权
标题翻译：形成均匀刚性互连结构的系统和方法
公开(公告)号：US20140004660A1
公开(公告)日：2014-01-02
申请号：US13539188
申请日：2012-06-29
申请人： Ming-Chung Sung , Yung Ching Chen , Chien-Hsiun Lee , Chen-Hua Yu , Mirng-Ji Lii
发明人： Ming-Chung Sung , Yung Ching Chen , Chien-Hsiun Lee , Chen-Hua Yu , Mirng-Ji Lii
IPC分类号： H01L21/50
CPC分类号： H01L21/4825 , H01L21/4853 , H01L23/49811 , H01L24/11 , H01L24/742 , H01L24/78 , H01L2224/1134 , H01L2224/45144 , H01L2224/742 , H01L2224/78 , H01L2224/78301 , H01L2924/12042 , H01L2924/00014 , H01L2924/00
摘要： Disclosed herein is a system and method for mounting semiconductor packages by forming one or more interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a target package. Mounting the interconnect may comprise ultrasonically welding the interconnects to the mounting pads, and the interconnect may be mounted via a mounting node on the end of the interconnect, wherein the mounting node may be formed by an electric flame off process. The interconnects may be trimmed to one or more substantially uniform heights, optionally using a laser or contact-type trimming system, and the tails of the interconnects may be supported during trimming. A top package may be bonded on the trimmed ends of the interconnects. During mounting, a support plate may be used to support the package, and a mask maybe used during interconnect mounting.
摘要翻译：本文公开了一种用于通过形成一个或多个互连件，可选地用引线键合器安装半导体封装以及将互连件安装到目标封装上的安装焊盘来安装半导体封装件的系统和方法。安装互连可以包括将互连件超声波焊接到安装焊盘，并且互连可以经由互连端部上的安装节点来安装，其中安装节点可以由电火焰熄灭工艺形成。互连可以被修剪到一个或多个基本均匀的高度，可选地使用激光或接触式修剪系统，并且在修剪期间可以支撑互连的尾部。顶部封装可以结合在互连件的修剪端上。在安装期间，可以使用支撑板来支撑封装，并且在互连安装期间可以使用掩模。

3. 发明申请

US20080197461A1 Apparatus for wire bonding and integrated circuit chip package 审中-公开
标题翻译：导线接合装置和集成电路芯片封装
公开(公告)号：US20080197461A1
公开(公告)日：2008-08-21
申请号：US11706193
申请日：2007-02-15
申请人： Chen-Hua Yu , Hui-Lin Chang , Yung-Cheng Lu , Mirng-Ji Lii , Yung-Ching Chen
发明人： Chen-Hua Yu , Hui-Lin Chang , Yung-Cheng Lu , Mirng-Ji Lii , Yung-Ching Chen
IPC分类号： H01L21/60 , B23K37/00 , H01L23/495
CPC分类号： H01L23/4952 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/05554 , H01L2224/45012 , H01L2224/45013 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/4516 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49175 , H01L2224/78268 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/20751 , H01L2924/00 , H01L2924/01006 , H01L2224/85399 , H01L2224/05599
摘要： An apparatus for wire bonding and a capillary tool thereof are provided. An exemplary embodiment of a capillary tool capable of a wire bonding comprises a body having a first internal channel of a first diameter for accommodating a flow of a conductive wire. A compressible head is connected to the body, having a second internal channel of a second diameter for accommodating the flow of the conductive wire, wherein the first diameter is fixed and the second diameter is variable, the second diameter is not more than the first diameter and a diameter the conductive wire flowed through the compressible head is adjustable. An integrated circuit (IC) package is also provided.
摘要翻译：提供一种用于引线接合的装置及其毛细管工具。能够引线接合的毛细管工具的示例性实施例包括具有用于容纳导线流动的第一直径的第一内部通道的主体。可压缩头连接到主体，具有用于容纳导线流动的第二直径的第二内部通道，其中第一直径是固定的，第二直径是可变的，第二直径不大于第一直径并且流过可压缩头的导线的直径是可调节的。还提供集成电路（IC）封装。

4. 发明授权

US08927877B2 Looped interconnect structure 有权
标题翻译：环形互连结构
公开(公告)号：US08927877B2
公开(公告)日：2015-01-06
申请号：US13570089
申请日：2012-08-08
申请人： Hsin-An Shen , Yung Ching Chen , Ming-Chung Sung , Chih-Hang Tung , Chien-Hsun Lee , Da-Yuan Shih
发明人： Hsin-An Shen , Yung Ching Chen , Ming-Chung Sung , Chih-Hang Tung , Chien-Hsun Lee , Da-Yuan Shih
IPC分类号： H05K1/11 , H05K3/30
CPC分类号： H05K3/4015 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/78301 , H01L2924/15311 , H01L2924/19107 , H05K3/3436 , H05K2201/10287 , H05K2203/049 , Y10T29/49147 , Y10T29/49204 , H01L2924/00014 , H01L2924/00
摘要： Disclosed herein is a system and method for mounting packages by forming one or more wire loop interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a first substrate. A first and second stud ball may each have at least one flat surface be disposed on a single mounting pad, and a wire having a bend region and forming a loop may be disposed between the stud balls. The stud balls may be formed from a deformed mouthing node formed on a wire. The loop may be mounted on a mounting pad on a first substrate and a second substrate may be mounted on the loop via a conductive material such as solder.
摘要翻译：本文公开了一种用于通过形成一个或多个线环互连件（可选地，使用引线键合器）并将互连件安装到第一基板上的安装焊盘来安装封装件的系统和方法。第一和第二螺柱球可以各自具有设置在单个安装垫上的至少一个平坦表面，并且具有弯曲区域并形成环的线可以设置在螺柱球之间。螺柱球可以由形成在线上的变形的口部节点形成。环可以安装在第一基板上的安装焊盘上，并且第二基板可以经由诸如焊料的导电材料安装在环上。

5. 发明授权

US08890274B2 Interconnect structure for CIS flip-chip bonding and methods for forming the same 有权
标题翻译：用于CIS倒装芯片接合的互连结构及其形成方法
公开(公告)号：US08890274B2
公开(公告)日：2014-11-18
申请号：US13546847
申请日：2012-07-11
申请人： Chen-Hua Yu , Yung Ching Chen , Chien-Hsun Lee , Mirng-Ji Lii
发明人： Chen-Hua Yu , Yung Ching Chen , Chien-Hsun Lee , Mirng-Ji Lii
IPC分类号： H01L23/48
CPC分类号： H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14632 , H01L27/14636 , H01L27/1464 , H01L27/14645 , H01L27/14683 , H01L31/02002 , H01L2924/0002 , H01L2924/01322 , H01L2924/12042 , H01L2924/15787 , H01L2924/00 , H01L2924/00012
摘要： A device includes a metal pad at a surface of an image sensor chip, wherein the image sensor chip includes an image sensor. A stud bump is disposed over, and electrically connected to, the metal pad. The stud bump includes a bump region, and a tail region connected to the bump region. The tail region includes a metal wire portion substantially perpendicular to a top surface of the metal pad. The tail region is short enough to support itself against gravity.
摘要翻译：一种设备包括在图像传感器芯片的表面处的金属焊盘，其中图像传感器芯片包括图像传感器。螺柱凸块设置在金属垫的上方并电连接到金属垫。凸起凸块包括凸起区域和连接到凸起区域的尾部区域。尾部区域包括基本上垂直于金属垫的顶表面的金属线部分。尾部区域足够短，能够抵抗重力。

6. 发明申请

US20140042621A1 Package on Package Devices and Methods of Forming Same 有权
标题翻译：封装器件及其形成方法
公开(公告)号：US20140042621A1
公开(公告)日：2014-02-13
申请号：US13570065
申请日：2012-08-08
申请人： Chen-Hua Yu , Mirng-Ji Lii , Chien-Hsun Lee , Yung Ching Chen , Jiun Yi Wu
发明人： Chen-Hua Yu , Mirng-Ji Lii , Chien-Hsun Lee , Yung Ching Chen , Jiun Yi Wu
IPC分类号： H01L23/498 , H01L21/28 , H01L21/50
CPC分类号： H01L24/05 , H01L21/4853 , H01L23/49811 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/16238 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/45169 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/78301 , H01L2224/85045 , H01L2224/85375 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2224/16225 , H01L2924/00 , H01L2924/0665 , H01L2924/00012 , H01L2924/2075 , H01L2924/20751
摘要： An embodiment is a package-on-package (PoP) device comprising a first package on a first substrate and a second package over the first package. A plurality of wire sticks disposed between the first package and the second package and the plurality of wire sticks couple the first package to the second package. Each of the plurality of wire sticks comprise a conductive wire of a first height affixed to a bond pad on the first substrate and each of the plurality of wire sticks is embedded in a solder joint.
摘要翻译：一个实施例是一种封装封装（PoP）器件，其包括在第一衬底上的第一封装和在第一封装上的第二封装。设置在第一封装和第二封装之间的多个线棒，并且多个线棒将第一封装耦合到第二封装。多个线棒中的每一个包括固定到第一基板上的接合焊盘的第一高度的导线，并且多个线棒中的每一个嵌入焊接接头中。

7. 发明申请

US20130277841A1 Rigid Interconnect Structures in Package-on-Package Assemblies 有权
标题翻译：封装在封装组件中的刚性互连结构
公开(公告)号：US20130277841A1
公开(公告)日：2013-10-24
申请号：US13452589
申请日：2012-04-20
申请人： Mirng-Ji Lii , Chen-Hua Yu , Chien-Hsiun Lee , Yung Ching Chen , Jiun Yi Wu
发明人： Mirng-Ji Lii , Chen-Hua Yu , Chien-Hsiun Lee , Yung Ching Chen , Jiun Yi Wu
IPC分类号： H01L25/07 , H01L21/60
CPC分类号： H01L23/49838 , H01L23/49811 , H01L23/5283 , H01L23/5386 , H01L24/13 , H01L24/16 , H01L24/20 , H01L24/24 , H01L25/105 , H01L2224/16238 , H01L2224/48091 , H01L2224/48227 , H01L2225/1023 , H01L2225/1058 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： System and method are disclosed for creating a rigid interconnect between two substrate mounted packages to create a package-on-package assembly. A solid interconnect may have a predetermined length configured to provide a predetermined package separation, may be cylindrical, conical or stepped, may be formed by extrusion, casting, drawing or milling and may have an anti-oxidation coating. The interconnect may be attached to mounting pads on the top and bottom packages via an electrically conductive adhesive, including, but not limited to solder and solder paste. A solder preservative or other anti-oxidation coating may be applied to the mounting pad. A package-on-package assembly with solid interconnects may have a top package configured to accept at least one electronic device, with the solid interconnects mounted between the top package and a bottom package to rigidly hold the package about parallel to each other.
摘要翻译：公开了用于在两个基板安装的封装之间创建刚性互连以产生封装封装组件的系统和方法。固体互连可以具有预定长度，其被配置为提供预定的包装分离，可以是圆柱形，圆锥形或阶梯形，可以通过挤出，浇铸，拉拔或研磨形成，并且可以具有抗氧化涂层。互连可以经由导电粘合剂附接到顶部和底部封装上的安装焊盘，包括但不限于焊料和焊膏。可以将焊料防腐剂或其它抗氧化涂层施加到安装垫。具有固体互连的封装封装组件可以具有被配置为接纳至少一个电子器件的顶部封装，其中固体互连件安装在顶部封装和底部封装之间，以使封装彼此平行地刚性地保持。

8. 发明授权

US09171790B2 Package on package devices and methods of packaging semiconductor dies 有权
标题翻译：封装器件封装以及封装半导体管芯的方法
公开(公告)号：US09171790B2
公开(公告)日：2015-10-27
申请号：US13552375
申请日：2012-07-18
申请人： Chen-Hua Yu , Yung Ching Chen , Chien-Hsun Lee , Jiun Yi Wu , Mirng-Ji Lii , Ming-Da Cheng
发明人： Chen-Hua Yu , Yung Ching Chen , Chien-Hsun Lee , Jiun Yi Wu , Mirng-Ji Lii , Ming-Da Cheng
IPC分类号： H01L25/065 , H01L23/498 , H01L21/48 , H01L25/10 , H01L25/00
CPC分类号： H01L25/0657 , H01L21/4853 , H01L21/68778 , H01L23/3142 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/17 , H01L24/73 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13164 , H01L2224/13169 , H01L2224/16058 , H01L2224/16148 , H01L2224/16238 , H01L2224/26175 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81191 , H01L2224/92125 , H01L2225/0651 , H01L2225/06513 , H01L2225/0652 , H01L2225/06548 , H01L2225/06565 , H01L2225/06572 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/20645 , H01L2224/16225 , H01L2924/00012 , H01L2924/014
摘要： Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a stick region, a first ball region coupled to a first end of the stick region, and a second ball region coupled to a second end of the stick region. The metal stud bumps include a portion that is partially embedded in a solder joint.
摘要翻译：封装封装（PoP）器件和封装半导体管芯的方法被公开。 PoP器件包括第一封装管芯和耦合到第一封装管芯的第二封装管芯。在第一封装模具和第二封装模具之间设置金属凸块凸块。金属柱凸块包括一个棒状区域，一个耦合到该棒状区域的第一端的第一球形区域和一个耦合到该棒状区域的第二端的第二球形区域。金属柱凸块包括部分嵌入焊点中的部分。

9. 发明申请

US20130241058A1 Wire Bonding Structures for Integrated Circuits 审中-公开
标题翻译：集成电路引线接合结构
公开(公告)号：US20130241058A1
公开(公告)日：2013-09-19
申请号：US13422306
申请日：2012-03-16
申请人： Chen-Hua Yu , Mirng-Ji Lii , Chien-Hsiun Lee , Yung Ching Chen
发明人： Chen-Hua Yu , Mirng-Ji Lii , Chien-Hsiun Lee , Yung Ching Chen
IPC分类号： H01L23/48
CPC分类号： H01L24/48 , H01L24/05 , H01L24/45 , H01L2224/02166 , H01L2224/04042 , H01L2224/05093 , H01L2224/05144 , H01L2224/05558 , H01L2224/05655 , H01L2224/29144 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48463 , H01L2224/48482 , H01L2224/48499 , H01L2224/48655 , H01L2224/48755 , H01L2224/48855 , H01L2924/00013 , H01L2924/01047 , H01L2924/00 , H01L2224/13099 , H01L2224/05099 , H01L2224/05599 , H01L2924/00014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/01079
摘要： A device includes a substrate, and a bond pad over the substrate. A protection layer is disposed over the bond pad. The protection layer and the bond pad include different materials. A bond ball is disposed onto the protection layer. A bond wire is joined to the bond ball.
摘要翻译：一种器件包括衬底和衬底上的接合焊盘。保护层设置在接合焊盘的上方。保护层和接合垫包括不同的材料。粘合球设置在保护层上。接合线与接合球接合。

10. 发明授权

US07337759B1 Engine 有权
标题翻译：发动机
公开(公告)号：US07337759B1
公开(公告)日：2008-03-04
申请号：US11543111
申请日：2006-10-05
申请人： Yung-ching Chen , Chih-chieh Chen
发明人： Yung-ching Chen , Chih-chieh Chen
IPC分类号： F02B75/32
CPC分类号： F01B7/20 , F01B9/06 , F02B75/30 , F02B2075/025 , F02B2275/22
摘要： The invention involves an engine that the cylinder block contains a coupled piston formed by a main piston, an external piston. The external piston is sleeved outside of the main piston and uses the rods on the two sides to connect to the heart-shape groove on the two sides of the crankshaft inside the crankcase at the bottom of the cylinder block. It moves with the main piston in an upward stroke and in a downward stroke. It forms a direct fuel injection device in the cylinder without carburetor. It does not need to add lubricants in the fuels. Besides, the engine has increased compression ratio.
摘要翻译：本发明涉及一种发动机，该气缸体包含由主活塞，外部活塞形成的联接活塞。外部活塞套在主活塞的外侧，并使用两侧的杆连接到气缸体底部曲轴箱内曲轴两侧的心形槽。它随着主活塞向上冲程和向下冲程而移动。它在没有化油器的气缸中形成直接燃料喷射装置。它不需要在燃料中添加润滑剂。此外，发动机具有增加的压缩比。

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