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    • 1. 发明申请
    • HIGH FREQUENCY OSCILLATOR CIRCUIT
    • 高频振荡器电路
    • US20150303871A1
    • 2015-10-22
    • US13569815
    • 2012-08-08
    • Keith A. JenkinsYu-ming Lin
    • Keith A. JenkinsYu-ming Lin
    • H03B5/12H01L29/16H01L29/786
    • H03B5/1228H01L29/1606H01L29/78684H03B5/1203H03B7/06H03B2200/0084
    • An oscillator circuit includes a field effect transistor and a resonant circuit having a first terminal connected to the field effect transistor. The resonant circuit includes an inductance and a capacitance and has a second terminal for connecting to a radiator. The field effect transistor includes a gate electrode coupled to a source of gate voltage, a source electrode, a drain electrode and a graphene channel disposed between the source electrode and the drain electrode and electrically connected thereto. The graphene channel is disposed relative to the gate electrode for being biased by the gate electrode into a negative differential resistance region of operation. The oscillator circuit is capable of generating a continuous wave THz frequency signal, and is further capable of being enabled and disabled by the bias applied to the gate electrode.
    • 振荡器电路包括场效应晶体管和具有连接到场效应晶体管的第一端子的谐振电路。 谐振电路包括电感和电容,并且具有用于连接到散热器的第二端子。 场效应晶体管包括耦合到栅极电压源的栅电极,源电极,漏电极和设置在源电极和漏电极之间并与其电连接的石墨烯通道。 石墨烯通道相对于栅电极设置,以便被栅电极偏压成负的差分电阻区域。 振荡器电路能够产生连续波THz频率信号,并且还能够通过施加到栅电极的偏置使能和禁止。
    • 6. 发明授权
    • Fabrication of graphene nanoelectronic devices on SOI structures
    • 在SOI结构上制造石墨烯纳米电子器件
    • US08673703B2
    • 2014-03-18
    • US12620320
    • 2009-11-17
    • Yu-Ming LinJeng-Bang Yau
    • Yu-Ming LinJeng-Bang Yau
    • H01L21/84
    • H01L29/1606H01L29/66742H01L29/7781H01L29/78687
    • A semiconductor-on-insulator structure and a method of forming the silicon-on-insulator structure including an integrated graphene layer are disclosed. In an embodiment, the method comprises processing a silicon material to form a buried oxide layer within the silicon material, a silicon substrate below the buried oxide, and a silicon-on-insulator layer on the buried oxide. A graphene layer is transferred onto the silicon-on-insulator layer. Source and drain regions are formed in the silicon-on-insulator layer, and a gate is formed above the graphene. In one embodiment, the processing includes growing a respective oxide layer on each of first and second silicon sections, and joining these silicon sections together via the oxide layers to form the silicon material. The processing, in an embodiment, further includes removing a portion of the first silicon section, leaving a residual silicon layer on the bonded oxide, and the graphene layer is positioned on this residual silicon layer.
    • 公开了一种绝缘体上半导体结构和一种形成包括一体化石墨烯层的绝缘体上硅结构的方法。 在一个实施例中,该方法包括处理硅材料以在硅材料内形成掩埋氧化物层,在掩埋氧化物之下形成硅衬底,以及在掩埋氧化物上形成绝缘体上硅层。 将石墨烯层转移到绝缘体上硅层上。 源极和漏极区域形成在绝缘体上硅层中,并且在石墨烯上方形成栅极。 在一个实施例中,该处理包括在第一和第二硅部分中的每一个上生长相应的氧化物层,并且经由氧化物层将这些硅部分连接在一起以形成硅材料。 在一个实施例中,所述处理还包括去除所述第一硅部分的一部分,在所述键合的氧化物上留下残留的硅层,并且所述石墨烯层位于所述剩余硅层上。