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1. 发明授权

US09165968B2 3D-stacked backside illuminated image sensor and method of making the same 有权
标题翻译： 3D叠层背面照明图像传感器及其制作方法
公开(公告)号：US09165968B2
公开(公告)日：2015-10-20
申请号：US13616850
申请日：2012-09-14
申请人： Calvin Yi-Ping Chao , Kuo-Yu Chou , Fu-Lung Hsueh
发明人： Calvin Yi-Ping Chao , Kuo-Yu Chou , Fu-Lung Hsueh
IPC分类号： H01L27/146 , H04N5/374
CPC分类号： H01L27/14634 , H01L27/14636 , H01L27/1464 , H01L27/14641 , H04N5/374
摘要： A stacked image sensor and method for making the same are provided. The stacked image sensor includes an upper chip with a pixel array thereon. The second chip includes a plurality of column circuits and row circuits associated with the columns and rows of the pixel array and disposed in respective column circuit and row circuit regions that are arranged in multiple groups. Inter-chip bonding pads are formed on each of the chips. The inter-chip bonding pads on the second chip are arranged linearly and are contained within the column circuit regions and row circuit regions in one embodiment. In other embodiments, the inter-chip bonding pads are staggered with respect to each other. In some embodiments, the rows and columns of the pixel array include multiple signal lines and the corresponding column circuit regions and row circuit regions also include multiple inter-chip bonding pads.
摘要翻译：提供一种堆叠式图像传感器及其制造方法。堆叠图像传感器包括其上具有像素阵列的上部芯片。第二芯片包括与像素阵列的列和行相关联的多个列电路和行电路，并且被布置在多个组中的各个列电路和行电路区域中。在每个芯片上形成芯片间接合焊盘。在一个实施例中，第二芯片上的芯片间接合焊盘被线性布置并且被包含在列电路区域和行电路区域内。在其他实施例中，芯片间接合焊盘相对于彼此交错。在一些实施例中，像素阵列的行和列包括多个信号线，并且相应的列电路区域和行电路区域还包括多个芯片间接合焊盘。

2. 发明授权

US09047048B2 Rotating mechanism for electronic device 有权
标题翻译：电子设备旋转机构
公开(公告)号：US09047048B2
公开(公告)日：2015-06-02
申请号：US13441846
申请日：2012-04-07
申请人： Hai-Qian Ge , Che-Yu Chou , Qun Huang , Tai-Shan Zhu
发明人： Hai-Qian Ge , Che-Yu Chou , Qun Huang , Tai-Shan Zhu
IPC分类号： H05K7/00 , G06F1/16 , H04M1/02
CPC分类号： G06F1/1616 , G06F1/1681 , H04M1/0212
摘要： An electronic device comprises a first portion, a second portion, and a rotating mechanism. The first portion covers on the second portion. The rotating mechanism is disposed in the second portion and is used for rotatably connecting the first portion and the second portion. The first portion is rotatable relative to the second portion from a first position to a second position by rotating the first portion relative to the rotating mechanism in a first plane. In the first position, the first position covers on the second portion. In the second position, a part of the second portion is exposed, and the angle between the first portion and the second portion is adjustable by rotating the first portion in a second plane perpendicular to the first plane.
摘要翻译：电子设备包括第一部分，第二部分和旋转机构。第一部分覆盖在第二部分上。旋转机构设置在第二部分中，并用于可旋转地连接第一部分和第二部分。通过在第一平面中旋转第一部分相对于旋转机构，第一部分可以相对于第二部分从第一位置转动到第二位置。在第一位置，第一位置覆盖第二部分。在第二位置，第二部分的一部分被暴露，并且通过在与第一平面垂直的第二平面中旋转第一部分来调节第一部分和第二部分之间的角度。

3. 发明授权

US09038974B2 Connecting structure 有权
标题翻译：连接结构
公开(公告)号：US09038974B2
公开(公告)日：2015-05-26
申请号：US13585893
申请日：2012-08-15
申请人： Che-Yu Chou , Qun Huang , Tai-Shan Zhu , Tao Jiang , Wen-Chih Lan , Jun-Liang Zhang , Ji-Bing Guo , Hua-Yong Wang , Zhou Chen , Hai-Qian Ge , Wei-Wei Yu , Zhi-Jun Shi
发明人： Che-Yu Chou , Qun Huang , Tai-Shan Zhu , Tao Jiang , Wen-Chih Lan , Jun-Liang Zhang , Ji-Bing Guo , Hua-Yong Wang , Zhou Chen , Hai-Qian Ge , Wei-Wei Yu , Zhi-Jun Shi
IPC分类号： A47B96/00 , G06F1/16 , G06F3/02 , G06F3/0354 , H04M1/02
CPC分类号： G06F1/1656 , G06F3/0202 , G06F3/03543 , H04M1/0254
摘要： A connecting structure received in a main device for connecting an auxiliary apparatus. The connecting structure includes a retracting part formed on a bottom board of the main device and close to a sidewall of the main device and a clamping part. The clamping part is pivotablly mounted on the bottom board and pivotally connected to the retracting part. The retracting part drives the clamping part to extend out of the main device via an opening defined on the sidewall for connecting the auxiliary apparatus when the auxiliary apparatus needs to be mounted on the main device. The retracting part retracts the clamping part into the main device when the auxiliary apparatus is unmounted from the main device.
摘要翻译：一种连接结构，被容纳在用于连接辅助设备的主设备中。连接结构包括形成在主装置的底板上并且靠近主装置的侧壁和夹紧部分的缩回部分。夹紧部分可枢转地安装在底板上并枢转地连接到缩回部分。当辅助装置需要安装在主装置上时，缩回部件通过限定在侧壁上的开口驱动夹紧部件延伸出主装置，用于连接辅助装置。当辅助设备从主设备卸下时，缩回部件将夹紧部件缩回到主设备中。

4. 发明授权

US08956910B2 Method for fabricating photoanode for dye-sensitized solar cell 有权
标题翻译：染料敏化太阳能电池制作光电阳极的方法
公开(公告)号：US08956910B2
公开(公告)日：2015-02-17
申请号：US13484288
申请日：2012-05-31
申请人： Yu-Chou Chao , Yun-Yun Chu
发明人： Yu-Chou Chao , Yun-Yun Chu
IPC分类号： H01L51/48 , H01G9/20
CPC分类号： H01G9/2031 , Y02E10/542 , Y02P70/521
摘要： A method for fabricating a photoanode for a dye-sensitized solar cell (DSSC) is provided. The method includes the following steps. A particle colloid is electrospun to form a first electrospun thin film layer on a substrate. The particle colloid includes titanium dioxide nanopartictes, a polymer material, a dispersing agent and a solvent. The first electrospun thin film layer is then sintered to form a main titanium dioxide layer. A photoanode manufactured by the method mentioned above is also provided.
摘要翻译：提供了一种用于制造染料敏化太阳能电池（DSSC）的光电阳极的方法。该方法包括以下步骤。静电纺丝粒子胶体，以在衬底上形成第一电纺薄膜层。颗粒胶体包括二氧化钛纳米颗粒，聚合物材料，分散剂和溶剂。然后将第一电纺薄膜层烧结以形成主要的二氧化钛层。还提供了通过上述方法制造的光电阳极。

5. 发明授权

US08907920B2 Complex sensing electrode structure applied to a touch panel 有权
标题翻译：复合感应电极结构应用于触摸屏
公开(公告)号：US08907920B2
公开(公告)日：2014-12-09
申请号：US13584040
申请日：2012-08-13
申请人： Yu-Chou Yeh
发明人： Yu-Chou Yeh
IPC分类号： G06F3/044 , G06F3/041
CPC分类号： G06F3/044 , G06F3/041 , G06F2203/04103
摘要： A complex sensing electrode structure applied to a touch panel includes a first conductive unit and a second conductive unit. The first conductive unit includes a plurality of first stripped conductive layers disposed on the transparent substrate and separated from each other by a predetermined distance. The second conductive unit includes a plurality of second stripped conductive layers disposed on the transparent substrate to respectively cover the first stripped conductive layers, and the conductive material used by the first stripped conductive layer and the conductive material used by the second stripped conductive layer are different. Hence, the manufacturing cost and the conductibility of the complex sensing electrode structure can be decreased effectively.
摘要翻译：应用于触摸面板的复杂感测电极结构包括第一导电单元和第二导电单元。第一导电单元包括设置在透明基板上并且彼此分开预定距离的多个第一剥离导电层。第二导电单元包括设置在透明基板上以分别覆盖第一剥离的导电层的多个第二剥离导电层，并且由第一剥离的导电层使用的导电材料和由第二剥离的导电层使用的导电材料是不同的。因此，可以有效地降低复杂感测电极结构的制造成本和导电性。

6. 发明授权

US08797735B2 Electrical device having hinged structure 有权
标题翻译：具有铰链结构的电气装置
公开(公告)号：US08797735B2
公开(公告)日：2014-08-05
申请号：US13304317
申请日：2011-11-24
申请人： Hai-Qian Ge , Yue-Ping Liu , Che-Yu Chou , Qun Huang , Tai-Shan Zhu
发明人： Hai-Qian Ge , Yue-Ping Liu , Che-Yu Chou , Qun Huang , Tai-Shan Zhu
IPC分类号： G06F1/16 , G06F3/02 , H04M1/00 , E05D3/06 , E05D3/10
CPC分类号： G06F1/1616 , G06F1/1666 , G06F1/1681 , H04M1/0212 , H04M1/0216 , H04M1/0247
摘要： An exemplary electrical device includes a first main body; a second main body; and a rotatable mechanism pivotally connected the first main body and the second main body. The rotatable mechanism includes a first rotation unit and a second rotation unit. The first rotation unit is capable of making the first main body rotate around a second rotation axis in a plane perpendicular to the second rotation axis. The second rotation unit is capable of making the first main body rotate relative to the second main body around a first rotation axis.
摘要翻译：示例性电气设备包括第一主体; 第二主体; 以及可枢转地连接第一主体和第二主体的可旋转机构。可旋转机构包括第一旋转单元和第二旋转单元。第一旋转单元能够使第一主体围绕与第二旋转轴线垂直的平面中的第二旋转轴线旋转。第二旋转单元能够使第一主体相对于第二主体围绕第一旋转轴线旋转。

7. 发明申请

US20140198186A1 3D IMAGE GENERATING DEVICE 审中-公开
标题翻译： 3D图像生成装置
公开(公告)号：US20140198186A1
公开(公告)日：2014-07-17
申请号：US13739247
申请日：2013-01-11
申请人： Yu-Chou Yeh , Ting-Ching Lin , Kun-Ming Chang
发明人： Yu-Chou Yeh , Ting-Ching Lin , Kun-Ming Chang
IPC分类号： H04N13/02
CPC分类号： G03B35/14 , G03B35/24 , H04N13/305
摘要： A 3D image generating device is provided and includes: a lenticular plate storage chamber for storing a plurality of lenticular plates; a picture-taking device for taking a picture of an object to generate an object image; an image processing unit for capturing and processing the object image of the object to generate a front-view object image and combining the front-view object image with a rear-view image to generate a synthetic 3D image; a lenticular plate conveying unit for moving the lenticular plates inside the lenticular plate storage chamber to a printing device; a memory unit for storing at least one rear-view image; the printing device for printing the synthetic 3D image on a flat surface of the lenticular plate; and a controlling unit for controlling operation of the picture-taking device, the image processing unit, the memory unit, the printing device, and the lenticular plate conveying unit.
摘要翻译：提供一种3D图像产生装置，包括：用于存储多个透镜板的透镜板存储室; 用于拍摄对象的图片以生成对象图像的拍摄装置; 图像处理单元，用于捕获和处理对象的对象图像以产生前视对象图像，并将前视对象图像与后视图像组合以生成合成3D图像; 用于将双凸透镜板储存室内的透镜板移动到打印装置的透镜板传送单元; 用于存储至少一个后视图像的存储单元; 用于将合成3D图像印刷在透镜板的平坦表面上的打印装置; 以及用于控制摄像装置，图像处理单元，存储单元，打印装置和透镜片传送单元的操作的控制单元。

8. 发明授权

US08734002B2 Frame of backlight module 有权
标题翻译：背光模组框架
公开(公告)号：US08734002B2
公开(公告)日：2014-05-27
申请号：US13316467
申请日：2011-12-10
申请人： Yun-Yu Chou
发明人： Yun-Yu Chou
IPC分类号： F21V7/10
CPC分类号： G09F13/04 , G02F1/133608 , G02F2001/133325
摘要： A frame of a backlight module includes a first side bar, a second side bar, a third side bar and a fourth side bar. The first side bar, the second side bar, the third side bar and the fourth side bar are connected end to end. The frame includes two contacting portions. One of the contacting portions is positioned at a corner of the first side bar and the second side bar, and the other one of the contacting portions is positioned at another corner of the first side bar and the fourth side bar.
摘要翻译：背光模块的框架包括第一侧杆，第二侧杆，第三侧杆和第四侧杆。第一侧杆，第二侧杆，第三侧杆和第四侧杆端对端连接。框架包括两个接触部分。接触部分之一位于第一侧杆和第二侧杆的拐角处，另一个接触部分位于第一侧杆和第四侧杆的另一角处。

9. 发明授权

US08709854B2 Backside structure and methods for BSI image sensors 有权
标题翻译： BSI图像传感器的背面结构和方法
公开(公告)号：US08709854B2
公开(公告)日：2014-04-29
申请号：US13620016
申请日：2012-09-14
申请人： Chun-Chieh Chuang , Dun-Nian Yaung , Jen-Cheng Liu , Wen-De Wang , Keng-Yu Chou , Shuang-Ji Tsai , Min-Feng Kao
发明人： Chun-Chieh Chuang , Dun-Nian Yaung , Jen-Cheng Liu , Wen-De Wang , Keng-Yu Chou , Shuang-Ji Tsai , Min-Feng Kao
IPC分类号： H01L21/00
CPC分类号： H01L27/14685 , G02B1/11 , H01L27/1462 , H01L27/14623 , H01L27/14636 , H01L27/1464 , H01L27/14645 , H01L31/02161 , H01L31/1868 , Y02E10/50 , Y02P70/521
摘要： BSI image sensors and methods. In an embodiment, a substrate is provided having a sensor array and a periphery region and having a front side and a back side surface; a bottom anti-reflective coating (BARC) is formed over the back side to a first thickness, over the sensor array region and the periphery region; forming a first dielectric layer over the BARC; a metal shield is formed; selectively removing the metal shield from over the sensor array region; selectively removing the first dielectric layer from over the sensor array region, wherein a portion of the first thickness of the BARC is also removed and a remainder of the first thickness of the BARC remains during the process of selectively removing the first dielectric layer; forming a second dielectric layer over the remainder of the BARC and over the metal shield; and forming a passivation layer over the second dielectric layer.
摘要翻译： BSI图像传感器和方法。在一个实施例中，提供具有传感器阵列和周边区域并具有前侧和后侧表面的基板; 底部抗反射涂层（BARC）在传感器阵列区域和外围区域的上方形成在第一厚度的背侧上; 在BARC上形成第一介电层; 形成金属屏蔽; 从所述传感器阵列区域上方选择性地去除所述金属屏蔽件; 从所述传感器阵列区域上方选择性地去除所述第一介电层，其中所述BARC的第一厚度的一部分也被去除，并且在选择性地去除所述第一介电层的过程中所述BARC的第一厚度的剩余部分保留; 在BARC的其余部分和金属屏蔽层之上形成第二电介质层; 以及在所述第二介电层上形成钝化层。

10. 发明申请

US20140077057A1 3D-STACKED BACKSIDE ILLUMINATED IMAGE SENSOR AND METHOD OF MAKING THE SAME 有权
标题翻译： 3D堆叠式背光照明图像传感器及其制作方法
公开(公告)号：US20140077057A1
公开(公告)日：2014-03-20
申请号：US13616850
申请日：2012-09-14
申请人： Calvin Yi-Ping CHAO , Kuo-Yu CHOU , Fu-Lung HSUEH
发明人： Calvin Yi-Ping CHAO , Kuo-Yu CHOU , Fu-Lung HSUEH
IPC分类号： H01L27/146 , H01L31/18
CPC分类号： H01L27/14634 , H01L27/14636 , H01L27/1464 , H01L27/14641 , H04N5/374
摘要： A stacked image sensor and method for making the same are provided. The stacked image sensor includes an upper chip with a pixel array thereon. The second chip includes a plurality of column circuits and row circuits associated with the columns and rows of the pixel array and disposed in respective column circuit and row circuit regions that are arranged in multiple groups. Inter-chip bonding pads are formed on each of the chips. The inter-chip bonding pads on the second chip are arranged linearly and are contained within the column circuit regions and row circuit regions in one embodiment. In other embodiments, the inter-chip bonding pads are staggered with respect to each other. In some embodiments, the rows and columns of the pixel array include multiple signal lines and the corresponding column circuit regions and row circuit regions also include multiple inter-chip bonding pads.
摘要翻译：提供一种堆叠式图像传感器及其制造方法。堆叠图像传感器包括其上具有像素阵列的上部芯片。第二芯片包括与像素阵列的列和行相关联的多个列电路和行电路，并且被布置在多个组中的各个列电路和行电路区域中。在每个芯片上形成芯片间接合焊盘。在一个实施例中，第二芯片上的芯片间接合焊盘被线性布置并且被包含在列电路区域和行电路区域内。在其他实施例中，芯片间接合焊盘相对于彼此交错。在一些实施例中，像素阵列的行和列包括多个信号线，并且相应的列电路区域和行电路区域还包括多个芯片间接合焊盘。

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