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1. 发明授权

US07759270B2 Titanium oxide sol and process for producing polyalkylene terephthalate therewith 失效
标题翻译：氧化钛溶胶及其制备聚对苯二甲酸亚烷基酯的方法
公开(公告)号：US07759270B2
公开(公告)日：2010-07-20
申请号：US11920253
申请日：2006-05-11
申请人： Jinichiro Kato , Yoshiki Takeda , Takafumi Konishi
发明人： Jinichiro Kato , Yoshiki Takeda , Takafumi Konishi
IPC分类号： B01J21/00
CPC分类号： C08G63/85 , C08G63/183
摘要： An environmentally friendly polymerization catalyst for polyalkylene terephthalate which does not use a heavy metal such as antimony, and a method for producing polyalkylene terephthalate using the catalyst. The catalyst for polymerizing a polyalkylene terephthalate is a titanium oxide sol containing an organic solvent as a dispersion medium, the sol has a light transmittance of not less than 50%, the light transmittance being measured by adjusting a concentration of the titanium oxide in the sol to 0.7 g/L and setting an optical path length to 1 cm in a wavelength range of 400 to 800 nm, and the amount of hydroxyl groups per 1 g of titanium oxide is not less than 1.8 mmol.
摘要翻译：用于不使用锑等重金属的聚对苯二甲酸亚烷基酯的环保聚合催化剂，以及使用该催化剂制造聚对苯二甲酸亚烷基酯的方法。用于聚合聚对苯二甲酸亚烷基酯的催化剂是含有有机溶剂作为分散介质的氧化钛溶胶，所述溶胶的透光率不小于50％，所述透光率通过调节溶胶中的氧化钛的浓度来测量至0.7g / L，并且在400至800nm的波长范围内将光路长度设置为1cm，并且每1g氧化钛的羟基量不小于1.8mmol。

2. 发明申请

US20090069529A1 Titanium oxide sol and process for producing polyalkylene terephthalate therewith 失效
标题翻译：氧化钛溶胶及其制备聚对苯二甲酸亚烷基酯的方法
公开(公告)号：US20090069529A1
公开(公告)日：2009-03-12
申请号：US11920253
申请日：2006-05-11
申请人： Jinichiro Kato , Yoshiki Takeda , Takafumi Konishi
发明人： Jinichiro Kato , Yoshiki Takeda , Takafumi Konishi
IPC分类号： C08G63/16 , B01J21/06 , B01J23/06 , B01J21/08
CPC分类号： C08G63/85 , C08G63/183
摘要： An object of the present invention is to provide an environmentally friendly polymerization catalyst of polyalkylene terephthalate which does not use a heavy metal such as antimony. Another object of the present invention is to provide the method of producing polyalkylene terephthalate using the catalyst.The inventive titanium oxide sol for a catalyst for polymerizing a polyalkylene terephthalate is a titanium oxide sol containing an organic solvent as a dispersion medium, wherein the titanium oxide in the sol has a concentration of 0.7 g/L, the sol has a light transmittance of not less than 50%, the light transmittance being measured by setting an optical path length to 1 cm in a wavelength range of 400 to 800 nm, and the amount of hydroxyl groups per 1 g of titanium oxide is not less than 1.8 mmol.
摘要翻译：本发明的目的是提供一种不使用锑等重金属的聚对苯二甲酸亚烷基酯的环境友好的聚合催化剂。本发明的另一个目的是提供使用该催化剂生产聚对苯二甲酸亚烷基酯的方法。本发明的用于聚合聚对苯二甲酸亚烷基酯的催化剂的氧化钛溶胶是含有有机溶剂作为分散介质的氧化钛溶胶，其中溶胶中的氧化钛的浓度为0.7g / L，溶胶的透光率为不小于50％时，透光率通过将光路长度设定为1〜400cm的波长范围而测定，每1g氧化钛的羟基量不低于1.8mmol。

3. 发明授权

US06596807B2 Process for producing vinyl alcohol polymer compositions 失效
公开(公告)号：US06596807B2
公开(公告)日：2003-07-22
申请号：US09916502
申请日：2001-07-30
申请人： Tatsuya Oshita , Goki Uehara , Nobuhisa Senda , Yoshiki Takeda , Yukiatsu Komiya , Syuichi Kanao , Shigeki Takada , Naoki Kawakami , Kanenori Ito
发明人： Tatsuya Oshita , Goki Uehara , Nobuhisa Senda , Yoshiki Takeda , Yukiatsu Komiya , Syuichi Kanao , Shigeki Takada , Naoki Kawakami , Kanenori Ito
IPC分类号： C08L2904
CPC分类号： C08J7/042 , C08F8/42 , C08F2800/10 , C08J2323/06 , C08J2429/04 , C08J2483/04 , Y10T428/31725 , Y10T428/3175 , Y10T428/31855 , Y10T428/31913 , C08F216/06 , C08F8/12 , C08F218/08
摘要： A vinyl alcohol polymer composition (II) is produced by a process of providing a reaction liquid comprising a solution containing a vinyl carboxylate polymer and, a first metal alkoxide (I) having at least one functional group and/or an oligomer (I) having at least one functional group obtained from said metal alkoxide (I); a step of simultaneously effecting (a) saponification of said vinyl carboxylate polymer and (b) reaction in which at least part of the functional groups of said metal alkoxide (I) and/or said oligomer (I) participates, thereby obtaining a vinyl alcohol polymer composition (I); and a step of preparing a solution (A) containing said vinyl alcohol polymer composition (I), followed by adding to the solution (A) a second metal alkoxide (II) and/or an oligomer (II) obtained from the metal alkoxide (II) or another solution (B) containing the metal alkoxide (II) and/or the oligomer (II) derived from the metal alkoxide (II), to prepare an intermediate product solution (C), and then removing the solvent from said solution (C). The vinyl alcohol polymer composition obtained by the above process has excellent gas-barrier properties, in particular excellent gas-barrier properties under high-humidity conditions. The vinyl alcohol polymer composition is suitably usable as a coating agent having good storage stability and little uneven applicability, and as gas-barrier material, in particular laminate having excellent gas-barrier properties under high-humidity conditions.

4. 发明申请

US20060223223A1 Method of production of circuit board utilizing electroplating 有权
标题翻译：电镀电路板生产方法
公开(公告)号：US20060223223A1
公开(公告)日：2006-10-05
申请号：US11396203
申请日：2006-03-30
申请人： Hideyasu Okazawa , Yoshiki Takeda
发明人： Hideyasu Okazawa , Yoshiki Takeda
IPC分类号： C25D5/18
CPC分类号： H05K3/243 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H05K3/108 , H05K3/427 , H05K2203/0542 , H05K2203/0723 , H05K2203/1394 , Y10T29/49165 , H01L2924/00014
摘要： A method of production of a circuit board utilizing electroplating which prevents signal reflection and noise due to unnecessary parts in the circuit patterns when electroplating to form circuit patterns on the board to thereby improve the electrical properties and realize higher density layout of the circuit patterns, including the steps of forming a first electroless plating layer and an overlying first plating resist on a metal foil-clad insulating board, feeding power to the first electroless plating layer to form a first electroplating layer over the first electroless plating layer in resist openings; removing the first plating resist; removing the exposed first electroless plating layer and metal foil to expose the insulating board; forming a second electroless plating layer over the exposed parts of the board and the circuit patterns; forming a second plating resist over that; removing the second electroless plating layer at the resist openings; feeding power to the second electroless plating layer under the second plating resist to form a second electroplating layer over the circuit patterns in the resist openings; removing the second plating resist; and removing the exposed second electroless plating layer.
摘要翻译：一种利用电镀制造电路板的方法，当电镀形成电路图案时，防止由电路图形中的不必要部分引起的信号反射和噪声，从而改善电性能并实现电路图案的更高密度布局，包括在金属箔包覆绝缘板上形成第一无电镀层和上覆第一电镀抗蚀剂的步骤，向第一无电镀层供电，在抗蚀剂开口中的第一化学镀层上形成第一电镀层; 去除第一电镀抗蚀剂; 去除暴露的第一化学镀层和金属箔以露出绝缘板; 在所述板的暴露部分和所述电路图案上形成第二无电镀层; 形成第二电镀抗蚀剂; 在抗蚀剂开口处去除第二无电镀层; 向第二电镀抗蚀剂下面的第二化学镀层供电，以在抗蚀剂开口中的电路图形上形成第二电镀层; 去除第二电镀抗蚀剂; 以及去除暴露的第二无电镀层。

5. 发明授权

US5905634A Semiconductor package having a heat slug 失效
标题翻译：具有散热片的半导体封装
公开(公告)号：US5905634A
公开(公告)日：1999-05-18
申请号：US929812
申请日：1997-09-15
申请人： Yoshiki Takeda , Takemi Machida , Fumio Kuraishi
发明人： Yoshiki Takeda , Takemi Machida , Fumio Kuraishi
IPC分类号： H01L21/50 , H01L23/13 , H01L23/31 , H01L23/36 , H01L23/488 , H01L23/498 , H05K7/20
CPC分类号： H01L23/49822 , H01L21/50 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/488 , H01L2224/49109 , H01L24/49 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/19041
摘要： A semiconductor package uses no thermosetting adhesive for mounting a heat slug thereon, which adhesive requires a strict control during the storage and the production thereof. A semiconductor package comprises a circuit board having respective surfaces and an opening; a conductive layer formed on one of the surfaces of the circuit board so that the conductive layers are retracted from a peripheral edge of the opening by a certain distance; a heat slug attached to the one surface of the circuit board by means of solder so that the opening is closed at the one surface and opened at the other surface to form a cavity within which a semiconductor element mounting area is defined; and the heat slug is provided with a groove along a periphery of the semiconductor element mounting area and adjacent the peripheral edge of the opening.
摘要翻译：半导体封装不使用热固性粘合剂来在其上安装散热块，该粘合剂在储存和生产期间需要严格的控制。半导体封装包括具有相应表面和开口的电路板; 形成在所述电路板的一个表面上的导电层，使得所述导电层从所述开口的周边边缘缩回一定距离; 散热片通过焊料附接到电路板的一个表面，使得开口在一个表面处封闭并在另一个表面处开口以形成其中限定了半导体元件安装区域的空腔; 并且散热块沿着半导体元件安装区域的周边设置有与开口的周缘相邻的凹槽。

6. 发明授权

US5237202A Lead frame and semiconductor device using same 失效
标题翻译：引线框和半导体器件使用相同
公开(公告)号：US5237202A
公开(公告)日：1993-08-17
申请号：US803724
申请日：1991-12-09
申请人： Mitsuharu Shimizu , Yoshiki Takeda , Hirofumi Fujii
发明人： Mitsuharu Shimizu , Yoshiki Takeda , Hirofumi Fujii
IPC分类号： H01L23/31 , H01L23/495 , H01L23/50
CPC分类号： H01L24/49 , H01L23/3142 , H01L23/49503 , H01L23/49537 , H01L23/49558 , H01L23/50 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2224/49175 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/181
摘要： A multi-layer lead frame is provided with a lead frame body made of a metal strip and having a plurality of inner leads including respective tips which define an opening. A power supply metal plane is adhered to the inner leads and a ground metal plane is adhered to the power supply metal plane by insulative adhesive layers. These metal planes are provided with first wire bonding areas and through holes in the vicinity thereof. A semiconductor device comprises such a multi-layer lead frame, a semiconductor chip mounted on a stage thereof, bonding-wires electrically connecting the chip to the areas, and a resin integrally molding the multi-layer lead frame, the chip, and the bonding-wires in such a manner that the through holes are filled with the resin.
摘要翻译：多层引线框架设置有由金属条制成的引线框架体，并且具有多个内引线，所述多个内引线包括限定开口的相应的尖端。电源金属平面粘附在内引线上，接地金属平面通过绝缘粘合剂层粘附在电源金属平面上。这些金属平面在其附近设置有第一引线接合区域和通孔。半导体器件包括这种多层引线框架，安装在其台上的半导体芯片，将芯片电连接到区域的接合线，以及将多层引线框架，芯片和接合以使得通孔填充有树脂的方式。

7. 发明授权

US07226807B2 Method of production of circuit board utilizing electroplating 有权
标题翻译：电镀电路板生产方法
公开(公告)号：US07226807B2
公开(公告)日：2007-06-05
申请号：US11396203
申请日：2006-03-30
申请人： Hideyasu Okazawa , Yoshiki Takeda
发明人： Hideyasu Okazawa , Yoshiki Takeda
IPC分类号： H01L21/00 , H01L23/495
CPC分类号： H05K3/243 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H05K3/108 , H05K3/427 , H05K2203/0542 , H05K2203/0723 , H05K2203/1394 , Y10T29/49165 , H01L2924/00014
摘要： A method of production of a circuit board utilizing electroplating which prevents signal reflection and noise due to unnecessary parts in the circuit patterns when electroplating to form circuit patterns on the board to thereby improve the electrical properties and realize higher density layout of the circuit patterns, including the steps of forming a first electroless plating layer and an overlying first plating resist on a metal foil-clad insulating board, feeding power to the first electroless plating layer to form a first electroplating layer over the first electroless plating layer in resist openings; removing the first plating resist; removing the exposed first electroless plating layer and metal foil to expose the insulating board; forming a second electroless plating layer over the exposed parts of the board and the circuit patterns; forming a second plating resist over that; removing the second electroless plating layer at the resist openings; feeding power to the second electroless plating layer under the second plating resist to form a second electroplating layer over the circuit patterns in the resist openings; removing the second plating resist; and removing the exposed second electroless plating layer.
摘要翻译：一种利用电镀制造电路板的方法，当电镀形成电路图案时，防止由电路图形中的不必要部分引起的信号反射和噪声，从而改善电性能并实现电路图案的更高密度布局，包括在金属箔包覆绝缘板上形成第一无电镀层和上覆第一电镀抗蚀剂的步骤，向第一无电镀层供电，在抗蚀剂开口中的第一化学镀层上形成第一电镀层; 去除第一电镀抗蚀剂; 去除暴露的第一化学镀层和金属箔以露出绝缘板; 在所述板的暴露部分和所述电路图案上形成第二无电镀层; 在其上形成第二电镀抗蚀剂; 在抗蚀剂开口处去除第二无电镀层; 向第二电镀抗蚀剂下面的第二化学镀层供电，以在抗蚀剂开口中的电路图形上形成第二电镀层; 去除第二电镀抗蚀剂; 以及去除暴露的第二无电镀层。

8. 发明授权

US5410180A Metal plane support for multi-layer lead frames and a process for manufacturing such frames 失效
标题翻译：用于多层引线框架的金属平面支撑和用于制造这种框架的工艺
公开(公告)号：US5410180A
公开(公告)日：1995-04-25
申请号：US95516
申请日：1993-07-26
申请人： Hirofumi Fujii , Yoshiki Takeda , Mitsuharu Shimizu
发明人： Hirofumi Fujii , Yoshiki Takeda , Mitsuharu Shimizu
IPC分类号： H01L23/50 , H01L21/48 , H01L23/495 , H01L23/48 , H01L29/44 , H01L29/52 , H01L29/60
CPC分类号： H01L23/49534 , H01L21/4821 , H01L23/49527 , H01L2924/0002
摘要： A metal plane support structure of a semiconductor device multi-layer lead frame having one or more metal planes, of different types, arranged in stacked and aligned relationship with and adhered to a corresponding lead frame. Metal planes of a common type are defined in a corresponding metal strip, at longitudinally spaced positions, the metal strip having a pair of side rails along the longitudinal edges thereof, integral support bars extending transversely of the side rails and interconnecting the metal planes to the side rails and section bars extending between and integrally interconnecting the side rails, each section bar disposed between two adjacent metal planes. Separating portions are formed in aligned relationship in the support bars and section bars. The lead frames are defined, further, at longitudinally spaced positions corresponding to the spacing of the metal planes, in a further metal strip having a smaller transverse dimension than that of each metal plane strip. In the assembled relationship of each metal plane with a corresponding lead frame, the side rails are diposed outwardly, in a transverse direction, from the side edges of the lead frame metal strip and are readily removed, along with the support bars and section bars, at the respective separating portions.
摘要翻译：具有一个或多个不同类型的金属平面的半导体器件多层引线框架的金属平面支撑结构，其布置成与对应的引线框堆叠并对准关系并被粘附到相应的引线框架上。通常类型的金属平面被限定在相应的金属条中，在纵向间隔开的位置处，金属带沿着其纵向边缘具有一对侧轨，整体支撑杆横向于侧轨延伸并将金属平面互连到侧轨和截面杆在两个相邻的金属平面之间延伸并且将侧轨整体互连，每个截面杆设置在两个相邻的金属平面之间。在支撑杆和截面杆中以对齐的关系形成分离部分。进一步地，引线框架在对应于金属平面的间隔的纵向间隔的位置处限定在具有比每个金属平面条的横向尺寸更小的横向尺寸的另一金属条中。在每个金属平面与对应的引线框架的组合关系中，侧轨从横向方向从引线框架金属带的侧边缘向外侧倾斜并且容易地与支撑杆和截面杆一起移除，在相应的分离部分。

9. 发明授权

US5291060A Lead frame and semiconductor device using same 失效
标题翻译：引线框和半导体器件使用相同
公开(公告)号：US5291060A
公开(公告)日：1994-03-01
申请号：US984841
申请日：1992-12-03
申请人： Mitsuharu Shimizu , Yoshiki Takeda , Hirofumi Fujii
发明人： Mitsuharu Shimizu , Yoshiki Takeda , Hirofumi Fujii
IPC分类号： H01L23/31 , H01L23/495 , H01L23/50 , H01L23/48
CPC分类号： H01L23/49537 , H01L23/3142 , H01L23/49503 , H01L23/49558 , H01L23/50 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/181
摘要： A multi-layer lead frame is provided with a lead frame body made of a metal strip and having a plurality of inner leads including respective tips which define an opening. A power supply metal plane is adhered to the inner leads and a ground metal plane is adhered to the power supply metal plane by insulative adhesive layers. These metal planes are provided with first wire bonding areas and through holes in the vicinity thereof. A semiconductor device comprises such a multi-layer lead frame, a semiconductor chip mounted on a stage thereof, bonding-wires electrically connecting the chip to the areas, and a resin integrally molding the multi-layer lead frame, the chip, and the bonding-wires in such a manner that the through holes are filled with the resin.
摘要翻译：多层引线框架设置有由金属条制成的引线框架体，并且具有多个内引线，所述多个内引线包括限定开口的各个尖端。电源金属平面粘附在内引线上，接地金属平面通过绝缘粘合剂层粘附在电源金属平面上。这些金属平面在其附近设置有第一引线接合区域和通孔。半导体器件包括这种多层引线框架，安装在其台上的半导体芯片，将芯片电连接到区域的接合线，以及将多层引线框架，芯片和接合以使得通孔填充有树脂的方式。

10. 发明授权

US4597311A Final speed-reduction gearing assembly in transmission unit 失效
标题翻译：传动装置中的最终减速传动装置
公开(公告)号：US4597311A
公开(公告)日：1986-07-01
申请号：US477398
申请日：1983-03-21
申请人： Yoshiki Takeda
发明人： Yoshiki Takeda
IPC分类号： B60K17/04 , B60K17/16 , F16H37/08 , F16H48/06 , F16H48/08 , F16H48/38 , F16H1/38
CPC分类号： F16H57/022 , B60K17/16 , F16H48/06 , F16H48/08 , F16H57/037 , F16H2048/382 , F16H2048/405 , F16H2057/02043 , F16H2057/02047 , F16H48/40
摘要： A final speed-reduction gearing assembly is mounted within a trans-axle casing which carries an output drive pinion shaft thereon, the gearing assembly comprising a ring gear in mesh with a drive pinion integral with the drive pinion shaft, and a differential gear unit integrally connected at the outer case thereof with the ring gear, the outer case of the unit being rotatably supported at the opposite ends thereof by first and second axially spaced bearings which are respectively mounted on first and second carrier portions of the trans-axle casing. A retainer member is arranged to fasten the first bearing to the first carrier portion of the casing and to be radially detachable for adjustment of a preload axially acting on the bearings, and an annular shim plate is disposed between the first bearing and the first carrier portion in such a way as to be removable radially for adjustment of the preload.
摘要翻译：一个最终的减速传动装置安装在一个跨轴壳体内，该轴承壳体内装有一个输出驱动小齿轮轴，该齿轮组件包括一个与驱动小齿轮一体的驱动小齿轮啮合的齿圈，以及一个整体的差速齿轮单元在外壳上与环形齿轮连接，该单元的外壳在其相对端被可旋转地支撑，第一和第二轴向隔开的轴承分别安装在跨轴壳体的第一和第二承载部分上。保持器构件被布置成将第一轴承紧固到壳体的第一承载部分并且可径向地拆卸以用于调节轴向作用在轴承上的预载荷，并且环形垫板设置在第一轴承和第一承载部分之间以径向方式可移动以调节预载荷。

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