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1. 发明申请

US20120225150A1 MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：半导体封装模具
公开(公告)号：US20120225150A1
公开(公告)日：2012-09-06
申请号：US13411025
申请日：2012-03-02
申请人： Dong-Chul HAN , Sang-Geun KIM , Jeong-Hoon KIM , Eun-Young JUNG , Yo-Se EUM , Ho-Soo JANG
发明人： Dong-Chul HAN , Sang-Geun KIM , Jeong-Hoon KIM , Eun-Young JUNG , Yo-Se EUM , Ho-Soo JANG
IPC分类号： B29C45/02
CPC分类号： B29C45/02 , B29C45/14655 , B29C45/32 , H01L21/67126 , H01L23/3107 , H01L2924/0002 , H01L2924/00
摘要： A molding apparatus for semiconductor package includes: a lower mold supporting a first semiconductor chip; a middle mold positioned over the lower mold and supporting a second semiconductor chip, and having a first cavity for molding the first semiconductor chip on a lower surface facing the lower mold; an upper mold positioned over the middle mold and having a second cavity for molding the second semiconductor chip on a lower surface facing the middle mold; a first supply port penetrating the lower mold and connected to the first cavity; a second supply port penetrating the lower and middle molds and connected to the second cavity; and a pressure unit positioned under the lower mold and including first and second transfer rams provided respectively in the first and second supply ports to pressure molding compound therein to supply the molding compound into the first and second cavities.
摘要翻译：一种用于半导体封装的成型装置，包括：支撑第一半导体芯片的下模; 中间模具，其位于所述下模具上方并支撑第二半导体芯片，并且具有用于在面向所述下模具的下表面上模制所述第一半导体芯片的第一腔体; 上模具定位在中间模具上方，并具有用于在面向中间模具的下表面上模制第二半导体芯片的第二腔体; 第一供应口穿透下模并连接到第一腔; 第二供应口穿透下模和中模并连接到第二腔; 以及压力单元，其位于所述下模具下方，并且包括分别设置在所述第一和第二供应端口中的第一和第二转印柱，以将所述模塑料供应到所述第一和第二空腔中。

2. 发明申请

US20120194214A1 EQUIPMENT AND METHOD TO CLASSIFY SEMICONDUCTOR PACKAGES 审中-公开
标题翻译：用于分类半导体封装的设备和方法
公开(公告)号：US20120194214A1
公开(公告)日：2012-08-02
申请号：US13362458
申请日：2012-01-31
申请人： Yo-se EUM , Dong-Chul Han , Yong-Ki Kim , Sang-Geun Kim , Ju-Li Kang
发明人： Yo-se EUM , Dong-Chul Han , Yong-Ki Kim , Sang-Geun Kim , Ju-Li Kang
IPC分类号： G01R31/26
CPC分类号： G01R31/2894
摘要： An equipment and method to classify semiconductor packages diced on a substrate into defective and non-defective semiconductor packages includes a loading preparation table to receive a plurality of semiconductor packages to be inspected, a first inspection unit to inspect and classify the semiconductor packages received at the loading preparation table into normal semiconductor packages and defective semiconductor packages, a temporary loading table to temporarily receive at least a portion of the normal semiconductor packages, a first loading picker to transfer the defective semiconductor packages from the loading preparation table to a defective package loading tray and to transfer the normal semiconductor packages from the temporary loading table to the loading preparation table, and a second loading picker to transfer the normal semiconductor packages from the loading preparation table to a normal package loading tray.
摘要翻译：将在衬底上切割成有缺陷和无缺陷的半导体封装的半导体封装分类的设备和方法包括：用于接收待检查的多个半导体封装的装载准备工作台;第一检查单元，用于检查和分类在将准备工作台装载到正常的半导体封装和有缺陷的半导体封装中，临时装载台临时接收正常的半导体封装的至少一部分;第一装载拾取器，用于将有缺陷的半导体封装从装载准备工作台转移到有缺陷的封装装载盘并将正常的半导体封装从临时装载台传送到装载准备台;以及第二装载拾取器，用于将正常的半导体封装从装载准备台传送到正常的封装装载盘。

3. 发明授权

US08132305B2 Equipment and method for cutting package 失效
标题翻译：切割包装的设备和方法
公开(公告)号：US08132305B2
公开(公告)日：2012-03-13
申请号：US11848152
申请日：2007-08-30
申请人： Tai-Kew Choi , Yong-Kyun Sun , Hee-Sang Yang , Yo-Se Eum , Ho-Soo Jang
发明人： Tai-Kew Choi , Yong-Kyun Sun , Hee-Sang Yang , Yo-Se Eum , Ho-Soo Jang
IPC分类号： B23P23/00 , B23C1/08 , B23C5/10 , B23C5/12
CPC分类号： B23B39/161 , Y10T29/5196 , Y10T407/1948 , Y10T407/196 , Y10T408/03 , Y10T408/3844 , Y10T409/304144 , Y10T409/305264 , Y10T409/30532 , Y10T409/307168 , Y10T409/308064 , Y10T409/308288 , Y10T409/30868
摘要： A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.
摘要翻译：包装切割装置包括安装在锯切机器人处的至少两个锭子，并使用切割刀将包括多个包装的框架切割成包装; 装载框架的框架装载夹具，使得框架被切割; 以及安装在正交机器人处的框架和单元拾取器，用于将框架装载和卸载框架装载夹具，其中检查安装在主轴处的切割钻头的状态。

4. 发明申请

US20080056832A1 EQUIPMENT AND METHOD FOR CUTTING PACKAGE 失效
标题翻译：用于切割包装的设备和方法
公开(公告)号：US20080056832A1
公开(公告)日：2008-03-06
申请号：US11848152
申请日：2007-08-30
申请人： Tai-Kew CHOI , Yong-Kyun SUN , Hee-Sang YANG , Yo-Se EUM , Ho-Soo JANG
发明人： Tai-Kew CHOI , Yong-Kyun SUN , Hee-Sang YANG , Yo-Se EUM , Ho-Soo JANG
IPC分类号： B23B39/16 , B23B35/00
CPC分类号： B23B39/161 , Y10T29/5196 , Y10T407/1948 , Y10T407/196 , Y10T408/03 , Y10T408/3844 , Y10T409/304144 , Y10T409/305264 , Y10T409/30532 , Y10T409/307168 , Y10T409/308064 , Y10T409/308288 , Y10T409/30868
摘要： A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.
摘要翻译：包装切割装置包括安装在锯切机器人处的至少两个锭子，并使用切割刀将包括多个包装的框架切割成包装; 装载框架的框架装载夹具，使得框架被切割; 以及安装在正交机器人处的框架和单元拾取器，用于将框架装载和卸载框架装载夹具，其中检查安装在主轴处的切割钻头的状态。

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