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1. 发明授权

US08132305B2 Equipment and method for cutting package 失效
标题翻译：切割包装的设备和方法
公开(公告)号：US08132305B2
公开(公告)日：2012-03-13
申请号：US11848152
申请日：2007-08-30
申请人： Tai-Kew Choi , Yong-Kyun Sun , Hee-Sang Yang , Yo-Se Eum , Ho-Soo Jang
发明人： Tai-Kew Choi , Yong-Kyun Sun , Hee-Sang Yang , Yo-Se Eum , Ho-Soo Jang
IPC分类号： B23P23/00 , B23C1/08 , B23C5/10 , B23C5/12
CPC分类号： B23B39/161 , Y10T29/5196 , Y10T407/1948 , Y10T407/196 , Y10T408/03 , Y10T408/3844 , Y10T409/304144 , Y10T409/305264 , Y10T409/30532 , Y10T409/307168 , Y10T409/308064 , Y10T409/308288 , Y10T409/30868
摘要： A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.
摘要翻译：包装切割装置包括安装在锯切机器人处的至少两个锭子，并使用切割刀将包括多个包装的框架切割成包装; 装载框架的框架装载夹具，使得框架被切割; 以及安装在正交机器人处的框架和单元拾取器，用于将框架装载和卸载框架装载夹具，其中检查安装在主轴处的切割钻头的状态。

2. 发明申请

US20060056955A1 Sawing and sorting system 审中-公开
标题翻译：锯切和分拣系统
公开(公告)号：US20060056955A1
公开(公告)日：2006-03-16
申请号：US11220784
申请日：2005-09-06
申请人： Yong-Kuk Kim , Hyun-Ho Kim , Ho-Seong Kim , Yong-Kyun Sun , Tai-Kew Choi
发明人： Yong-Kuk Kim , Hyun-Ho Kim , Ho-Seong Kim , Yong-Kyun Sun , Tai-Kew Choi
IPC分类号： B65H1/00
CPC分类号： B28D5/0082 , B28D5/029
摘要： A sawing and sorting system combines a sawing apparatus and a sorting apparatus. The sawing and sorting system comprises a loader. The loader comprises a magazine receiving a plurality of strips. A mounting unit mounts the strip thereon. A plurality of transfer and sawing robots each comprises a picker unit. The picker unit comprises a rotatable chuck table. The transfer and sawing robot transfers the picker unit horizontally and vertically. The rotatable chuck table holds the strip. The picker unit rotates the rotatable chuck table. A plurality of sawing spindle units each comprises a rotary blade. The sawing spindle unit moves the blade horizontally to divide the strip into unit packages. A cleaning unit cleans the unit package. A test means inspects the unit package according to a test criteria. A sorting table mounts the unit package for sorting. An unloader provides trays. A sorting transfer robot sorts the unit packages into the trays.
摘要翻译：锯切和分拣系统结合了锯切设备和分拣设备。锯切和分拣系统包括一个装载机。装载机包括容纳多个条带的盒。安装单元将条带安装在其上。多个传送和锯切机器人均包括拾取单元。拾取单元包括可旋转卡盘台。传送和锯切机器人水平和垂直地传送拾取器单元。可转动的卡盘支承带。拾取器单元旋转可旋转卡盘台。多个锯切主轴单元各自包括旋转叶片。锯切主轴单元水平移动刀片，将刀片分割成单元包装。清洁单元清洁单元包装。测试装置根据测试标准检查单元包装。分拣表安装单元包装进行排序。卸载机提供托盘。排序传送机器人将单元包装分类到托盘中。

3. 发明申请

US20060048381A1 Die attaching apparatus, and system and method for cleaning the same 失效
标题翻译：模具附着装置及其清洗系统及方法
公开(公告)号：US20060048381A1
公开(公告)日：2006-03-09
申请号：US11155181
申请日：2005-06-16
申请人： Jung-Hwan Woo , Ho-Jae Byon , Jae-Bong Shin , Yong-Kyun Sun , Hyun-Ho Kim , Choo-Ho Kim , Youn-Sung Ko
发明人： Jung-Hwan Woo , Ho-Jae Byon , Jae-Bong Shin , Yong-Kyun Sun , Hyun-Ho Kim , Choo-Ho Kim , Youn-Sung Ko
IPC分类号： H05K3/30
CPC分类号： H01L21/67144 , H01L21/67092 , Y10T29/4913 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187 , Y10T29/53239
摘要： Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.
摘要翻译：提供了一种模具附接装置，清洁系统和方法，其具有能够在短时间内容易地替换适用于各种包装的新的部件。防止模压构件和加热板的表面被污染。模压构件可拆卸地附接到可以直接对模具施加压力的附接单元的下端。其上安装有用于研磨加热板的研磨装置的加热板研磨机与模压构件隔开预定距离。加热板清洁剂附着在加热板研磨机的侧壁上并去除残留在加热板上的残留物。

4. 发明申请

US20070138466A1 Apparatus for testing a semiconductor module 审中-公开
标题翻译：用于测试半导体模块的装置
公开(公告)号：US20070138466A1
公开(公告)日：2007-06-21
申请号：US11604822
申请日：2006-11-28
申请人： Dong-Soo Lee , Seon-O Kim , Yong-Kyun Sun , Hyo-Gyu Kim
发明人： Dong-Soo Lee , Seon-O Kim , Yong-Kyun Sun , Hyo-Gyu Kim
IPC分类号： H01L23/58
CPC分类号： H01L21/67766 , G01R31/2893 , H01L21/673 , H01L21/67769
摘要： An apparatus for testing a semiconductor module may include a test shelf, test modules and a transfer robot. The test shelf may include multilayered test cells in which a plurality of test cells may be arranged in each of a plurality of layers. The test modules may be each provided in the test cells. The transfer robot may insert the semiconductor module into the test module. The transfer robot may separate the semiconductor module from the test module.
摘要翻译：用于测试半导体模块的装置可以包括测试架，测试模块和传送机器人。测试架可以包括其中多个测试单元可以布置在多个层中的每一层中的多层测试单元。测试模块可以分别设置在测试单元中。传送机器人可将半导体模块插入测试模块。传送机器人可以将半导体模块与测试模块分离。

5. 发明授权

US07650687B2 Die attaching apparatus 失效
标题翻译：模具附着装置
公开(公告)号：US07650687B2
公开(公告)日：2010-01-26
申请号：US11155181
申请日：2005-06-16
申请人： Jung-Hwan Woo , Ho-Jae Byon , Jae-Bong Shin , Yong-Kyun Sun , Hyun-Ho Kim , Choo-Ho Kim , Youn-Sung Ko
发明人： Jung-Hwan Woo , Ho-Jae Byon , Jae-Bong Shin , Yong-Kyun Sun , Hyun-Ho Kim , Choo-Ho Kim , Youn-Sung Ko
IPC分类号： B23P19/00 , B21F1/00
CPC分类号： H01L21/67144 , H01L21/67092 , Y10T29/4913 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187 , Y10T29/53239
摘要： Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.
摘要翻译：提供了一种模具附接装置，清洁系统和方法，其具有能够在短时间内容易地替换适用于各种包装的新的部件。防止模压构件和加热板的表面被污染。模压构件可拆卸地附接到可以直接对模具施加压力的附接单元的下端。其上安装有用于研磨加热板的研磨装置的加热板研磨机与模压构件隔开预定距离。加热板清洁剂附着在加热板研磨机的侧壁上并去除残留在加热板上的残留物。

6. 发明申请

US20060266792A1 Multi-chip die bonder and method 审中-公开
标题翻译：多芯片贴片机及方法
公开(公告)号：US20060266792A1
公开(公告)日：2006-11-30
申请号：US11255912
申请日：2005-10-24
申请人： Youn-Sung Ko , Choo-Ho Kim , Hyun-Ho Kim , Yong-Kyun Sun , Byung-Joon Lee , Il-Sup Choi , Jung-Hwan Woo
发明人： Youn-Sung Ko , Choo-Ho Kim , Hyun-Ho Kim , Yong-Kyun Sun , Byung-Joon Lee , Il-Sup Choi , Jung-Hwan Woo
IPC分类号： B23K1/00 , B23K5/00
CPC分类号： H01L21/67144 , B23K37/047 , B23K2101/42 , H01L24/75 , H01L24/83 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2224/2919 , H01L2224/32145 , H01L2224/8385 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/00
摘要： A multi-chip die bonder may include a first substrate conveyor conveying a substrate in a first direction and a second substrate conveyor conveying a substrate in a second direction. A plurality of dies may be stacked onto the substrate while the substrate is circulating the first substrate conveyor and the second substrate conveyor. A first heater may be provided in a die bonding unit and a second heater may be provided in the first substrate conveyor. An adhesive curing process may be performed together with a die attaching process.
摘要翻译：多芯片贴片机可以包括沿第一方向传送衬底的第一衬底输送器和沿第二方向传送衬底的第二衬底输送器。当衬底循环第一衬底输送机和第二衬底输送机时，多个管芯可以堆叠在衬底上。可以在芯片接合单元中设置第一加热器，并且可以在第一基板输送器中设置第二加热器。粘合剂固化方法可以与模具附着工艺一起进行。

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