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1. 发明授权

US06416587B1 Apparatus and method for cleaning wafer 失效
标题翻译：清洗晶片的装置及方法
公开(公告)号：US06416587B1
公开(公告)日：2002-07-09
申请号：US09536157
申请日：2000-03-28
申请人： Wen-Jang Lu , Yi-Ta Tsou , Hui-Xiu Tang
发明人： Wen-Jang Lu , Yi-Ta Tsou , Hui-Xiu Tang
IPC分类号： B08B302
CPC分类号： B08B3/102 , B08B3/048 , Y10S134/902 , Y10S438/906
摘要： A wafer cleaning apparatus includes a rinsing container in which wafers to be cleaned are positioned and four sets of nozzles arranged in the rinsing container to be symmetric with respect to each other. The nozzles generate water jets toward the wafers for performing a wafer cleaning process. In a first phase of the wafer cleaning process, the first nozzle set and the fourth nozzle set are turned on to generate water jets in diagonally opposite directions with respect to the wafers for a given period. In a second phase, the second nozzle set and the third nozzle set are turned on to generate water jets in diagonally opposite directions with respect to the wafers for a given period. In a third phase, the third nozzle set and the fourth nozzle set are turned on to cause an up-rising water flow from a bottom of the container to a top open side thereof for expelling contaminants dissolved or suspended in the water out of the container.
摘要翻译：晶片清洗装置包括：清洗容器，其中待清洗的晶片被定位，并且四组喷嘴布置在冲洗容器中以相对于彼此对称。喷嘴向晶片产生水射流以进行晶片清洁处理。在晶片清洗过程的第一阶段，第一喷嘴组和第四喷嘴组被打开，以在给定时间段内相对于晶片沿对角相反的方向产生水射流。在第二阶段中，打开第二喷嘴组和第三喷嘴组，以在给定时间段内相对于晶片产生对角相反方向的水射流。在第三阶段中，第三喷嘴组和第四喷嘴组被打开以引起从容器的底部向上开放的水的上升流动，以将从水中流出或悬浮的污染物排出容器。

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