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1. 发明授权

US07482800B2 Wired circuit board and connecting structure thereof 有权
标题翻译：有线电路板及其连接结构
公开(公告)号：US07482800B2
公开(公告)日：2009-01-27
申请号：US11295520
申请日：2005-12-07
申请人： Yasunari Ooyabu , Yasuhito Ohwaki
发明人： Yasunari Ooyabu , Yasuhito Ohwaki
IPC分类号： G01R31/28 , H05K1/00 , H05K1/18 , H05K7/00 , H05K1/03 , H01R12/00
CPC分类号： H05K3/363 , H05K1/056 , H05K3/3442 , H05K3/366 , H05K2201/0394 , H05K2201/09181 , H05K2203/167
摘要： A wired circuit board that can allow precise connection between wired circuit boards with respect to a direction orthogonal to each other with a simple structure, while allowing reduction in size of the wired circuit boards, and a connecting structure of the wired circuit board comprising two wired circuit boards connected to each other with respect to a direction orthogonal to each other. Relay terminals 9 of the circuit suspension board 1 are arranged along one widthwise edge of the circuit suspension board 1, and terminal cutouts 10 cut in a generally semicircular arc shape from one edge thereof toward an widthwise inside thereof are formed in the relay terminals 9. In addition, insulating base layer cutouts 12 are formed in the first insulating base layer 3 to correspond to the terminal cutouts 10. The circuit suspension board 1 and a flexible wired circuit board for relay 21 are electrically connected to each other by fitting bumps 29 formed on suspension terminals 26 of the flexible wired circuit board for relay 21 in the terminal cutouts 10.
摘要翻译：一种布线电路板，其可以允许布线电路板相对于彼此正交的方向以简单的结构精确连接，同时允许布线电路板的尺寸减小，并且布线电路板的连接结构包括两个有线电路板相对于彼此正交的方向彼此连接。电路悬挂板1的继电器端子9沿着电路悬挂板1的一个宽度方向的边缘布置，并且在中继端子9中形成从其一个边缘向其宽度方向内侧切割成大致半圆弧形的端子切口10。此外，在第一绝缘基底层3中形成绝缘基底层切口12以对应于端子切口10.电路悬挂板1和用于继电器21的柔性布线电路板通过形成的凸块29彼此电连接在终端切口10中用于继电器21的柔性布线电路板的悬挂端子26上。

2. 发明授权

US07351914B2 Flexible printed circuit board for catheter, catheter using same, and production method of catheter 失效
标题翻译：用于导管的柔性印刷电路板，使用其的导管以及导管的制造方法
公开(公告)号：US07351914B2
公开(公告)日：2008-04-01
申请号：US11405587
申请日：2006-04-18
申请人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
发明人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
IPC分类号： H05K1/00
CPC分类号： A61B5/03 , A61B5/01 , A61B5/6852 , A61B2562/222 , A61M25/00 , A61M25/0105 , H05K1/028 , H05K3/0061 , H05K2201/055
摘要： The present invention provides a flexible printed circuit board having a band-like meandering pattern as a whole, which includes multiple linear parts configured about parallel to each other and a folding margin connected to one end in a longitudinal direction of two adjacent linear parts of the multiple linear parts, and which can turn into a single linear product having a total length of not less than 300 mm when the folding margin is double-folded at about a center thereof, and, at the folding margin, either of the two linear parts connected to the folding margin is folded back in a direction opposite by 180 degrees. As a result, a flexible printed circuit board for a catheter, which is sufficiently elongate for use as a signal line of a catheter, can be produced using a general-purpose production apparatus.
摘要翻译：本发明提供了一种柔性印刷电路板，其具有整体上的带状曲折图案，该柔性印刷电路板包括彼此平行配置的多个直线部分，以及连接到两个相邻直线部分的纵向方向上的一端的折叠边缘多个线性部分，并且当折叠边缘在其中心附近被折叠时，可以变成具有不小于300mm的总长度的单个线性产品，并且在折叠边缘处，两个直线部分连接到折叠边缘的方向与180度相反的方向折回。结果，可以使用通用生产设备来制造用于导管的用于导管的信号线的足够细长的用于导管的柔性印刷电路板。

3. 发明授权

US07067912B2 Wired circuit board 失效
标题翻译：有线电路板
公开(公告)号：US07067912B2
公开(公告)日：2006-06-27
申请号：US10860493
申请日：2004-06-04
申请人： Yoshihiko Takeuchi , Yasuhito Ohwaki , Yuichi Takayoshi
发明人： Yoshihiko Takeuchi , Yasuhito Ohwaki , Yuichi Takayoshi
IPC分类号： H01L23/48 , H01L23/02 , H01L23/04 , H05K1/03
CPC分类号： H01L23/49833 , H01L23/49827 , H01L2924/0002 , H01L2924/3011 , H05K1/0237 , H05K1/056 , H05K1/141 , H05K1/147 , H05K3/108 , H05K3/363 , H05K2201/0367 , H05K2201/0715 , H05K2201/093 , H05K2201/0969 , H01L2924/00
摘要： A wired circuit board can control characteristic impedance at connection points between wires of a suspension board with circuit and terminal portions of the wired circuit board connected thereto with a simple structure, to improve signal transmission efficiency even for fine pitch wiring or for high frequency signals. The wired circuit board includes a relay flexible wiring circuit board formed by a first wired circuit board including a first metal substrate, a first insulating base layer, a first conductor layer and a first insulating cover layer which is substantially identical in layer structure with the suspension board with circuit and a second wired circuit board connected with the first wired circuit board for connecting with a control circuit board. Since the suspension board with circuit and the first wired circuit board are rendered substantially identical in layer structure, both characteristic impedances at these connection points can be matched.
摘要翻译：布线电路板可以通过简单的结构来控制悬挂板的导线之间的连接点处的特性阻抗，其电路和与其连接的布线电路板的端子部分，以便即使对于细间距布线或高频信号来提高信号传输效率。布线电路板包括由第一布线电路板形成的中继柔性布线电路板，第一布线电路板包括第一金属基板，第一绝缘基底层，第一导体层和第一绝缘覆盖层，其与悬浮液的层结构基本相同与第一布线电路板连接的第二布线电路板用于与控制电路板连接。由于具有电路的悬架板和第一布线电路板的层结构基本相同，所以这些连接点的两个特性阻抗都可以匹配。

4. 发明申请

US20050161775A1 Wiring circuit board and production method thereof 有权
标题翻译：接线电路板及其制作方法
公开(公告)号：US20050161775A1
公开(公告)日：2005-07-28
申请号：US11020350
申请日：2004-12-22
申请人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
发明人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
IPC分类号： G11B5/60 , G11B5/31 , G11B5/39 , G11B21/21 , G11B33/12 , H01L23/58 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/28 , H05K3/46
CPC分类号： G11B33/122 , G11B5/3103 , G11B5/3967 , H05K3/0023 , H05K3/0082 , H05K3/28 , H05K2201/0154 , H05K2201/0191
摘要： In the vicinity of the exposed part 1A of the multiply formed plural wiring conductors 1, of the thicknesses of the insulating cover layer 2 made of a polyimide layer, the thickness (T1) of a part located at about the middle point between the adjacent wiring conductors 1 is made smaller than the thickness (T2) of a part located on wiring conductor 1. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layer 2 and that of a part located on wiring conductor is made to fall within the range of 1-5 μm. As a result, the insulating cover layer does not peel off easily.
摘要翻译：在由聚酰亚胺层制成的绝缘覆盖层2的厚度的多重形成的多个布线导体1的露出部分1A的附近，位于中间点之间的部分的厚度（T 1）使相邻布线导体1小于位于布线导体1上的部分的厚度（T 2）。优选地，将位于绝缘覆盖层2的相邻布线导体和位于布线导体的部分的相邻布线导体之间的中点附近的部分的厚度差设为在1-5μm的范围内。结果，绝缘覆盖层不容易剥离。

5. 发明授权

US06717059B2 Circuit board and connection structure of terminal portion of the same 失效
标题翻译：电路板及其端子部分的连接结构
公开(公告)号：US06717059B2
公开(公告)日：2004-04-06
申请号：US09974048
申请日：2001-10-11
申请人： Toshio Shintani , Yasuhito Ohwaki
发明人： Toshio Shintani , Yasuhito Ohwaki
IPC分类号： H05K109
CPC分类号： H05K3/244 , G11B5/484 , G11B5/4846 , H01R4/02 , H01R13/03 , H05K3/3463
摘要： A nickel plating layer having a thickness within a range of 1.0 to 4.0 &mgr;m is formed in a terminal portion of a circuit board as an underlying plating layer. After a soldering bump is formed on the underlying plating layer, the soldering bump is connected to an external terminal formed in an external circuit.
摘要翻译：在作为下面的镀层的电路板的端子部分中形成厚度在1.0至4.0μm范围内的镀镍层。在下面的镀层上形成焊接凸块之后，焊接凸块连接到形成在外部电路中的外部端子。

6. 发明授权

US08134080B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US08134080B2
公开(公告)日：2012-03-13
申请号：US11477935
申请日：2006-06-30
申请人： Jun Ishii , Yasuhito Ohwaki , Yasuhito Funada
发明人： Jun Ishii , Yasuhito Ohwaki , Yasuhito Funada
IPC分类号： H05K1/09
CPC分类号： H05K3/38 , H05K1/056 , H05K3/06 , H05K3/205 , H05K3/44 , H05K2201/0379 , H05K2201/0969 , H05K2201/09781 , H05K2201/2072 , H05K2203/0323
摘要： A wired circuit board that can provide an enhanced adhesion of a metal supporting board at a marginal portion of an opening formed in the metal supporting board with a simple structure to prevent stripping of the metal supporting board. In a suspension board with circuit, in order to reduce a transmission loss of a conductive pattern, a metal foil embedded in an insulating base layer is formed in a pattern comprising a first metal foil portion and a second metal foil portion surrounding the first metal foil portion spaced apart therefrom, and an opening is formed in the metal supporting board so that a marginal portion of the opening is located in a space between the first metal foil portion and the second metal foil portion.
摘要翻译：一种布线电路板，其能够以简单的结构提供在金属支撑板上形成的开口的边缘部分处的金属支撑板的增强的附着，以防止金属支撑板的剥离。在具有电路的悬挂板中，为了减少导电图案的传输损耗，嵌入绝缘基底层中的金属箔以包括第一金属箔部分和围绕第一金属箔的第二金属箔部分的图案形成部分间隔开，并且在金属支撑板上形成开口，使得开口的边缘部分位于第一金属箔部分和第二金属箔部分之间的空间中。

7. 发明授权

US07632236B2 Catheter and production method thereof 失效
标题翻译：导管及其制造方法
公开(公告)号：US07632236B2
公开(公告)日：2009-12-15
申请号：US11300517
申请日：2005-12-15
申请人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
发明人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
IPC分类号： A61B5/00 , A61B5/02
CPC分类号： A61M25/0043 , A61B5/0215 , A61M25/0015 , A61M25/007 , H05K1/056 , H05K1/189
摘要： The present invention provides a catheter 100 having a structure wherein an electronic component 2 is mounted on the anterior end or an intermediate part of a tube 1, a signal line electrically connecting to the electronic component 2 extends from the vicinity of the electronic component 2 through the aforementioned tube 1 to the posterior end of the aforementioned tube 1, which is characterized in that the signal line consists of a wiring pattern 4 of the flexible printed circuit board 10 inserted in the tube 1. Consequently, an electronic component-loaded catheter can control increase in the size of the tube caused by multiple signal lines to be connected to the electronic component.
摘要翻译：本发明提供一种具有其中电子部件2安装在管1的前端或中间部分的结构的导管100，电连接到电子部件2的信号线从电子部件2的附近延伸到电子部件2的附近，上述管1到上述管1的后端，其特征在于，信号线由插入管1中的柔性印刷电路板10的布线图案4构成。因此，电子部件负载导管可以控制由连接到电子部件的多个信号线引起的管的尺寸的增加。

8. 发明授权

US07571540B2 Production method of suspension board with circuit 有权
标题翻译：带电路的悬挂板的生产方法
公开(公告)号：US07571540B2
公开(公告)日：2009-08-11
申请号：US11505995
申请日：2006-08-18
申请人： Hidenori Aonuma , Yasuhito Ohwaki
发明人： Hidenori Aonuma , Yasuhito Ohwaki
IPC分类号： H05K3/02 , H05K3/10
CPC分类号： H05K3/44 , H05K1/056 , H05K3/108 , H05K3/243 , H05K2201/0305 , H05K2201/09554 , H05K2201/0969 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a signal wiring pattern is formed on the insulating base layer. Then, an insulating cover layer to cover the conductive pattern is formed on the insulating base layer in such a manner that a first cover opening portion and a second cover opening portion are formed in the insulating cover layer. Then, an electrolytic plating layer is formed on a surface of the ground terminal exposed from the first cover opening portion and on a surface of the ground connecting portion exposed from the second cover opening portion, feeding electric power from the ground wire. Thereafter, a metal filling layer is formed in the base opening portion to electrically connect the ground connecting portion and the metal supporting board.
摘要翻译：一种制造具有电路的悬挂板的方法，其中在金属支撑板上形成绝缘基底层之后，在绝缘基底层上形成包括接地布线图案和信号布线图案的导电图案。然后，在绝缘基底层上形成覆盖导电图案的绝缘覆盖层，使得在绝缘覆盖层中形成第一盖开口部和第二盖开口部。然后，在从第一盖开口部露出的接地端子的表面和从第二盖开口部露出的接地连接部的表面上形成电解镀层，从地线供电。此后，在基座开口部分形成金属填充层，以电连接接地连接部分和金属支撑板。

9. 发明授权

US07272889B2 Production method of suspension board with circuit 有权
标题翻译：带电路的悬挂板的生产方法
公开(公告)号：US07272889B2
公开(公告)日：2007-09-25
申请号：US11156607
申请日：2005-06-21
申请人： Hidenori Aonuma , Yasuhito Ohwaki
发明人： Hidenori Aonuma , Yasuhito Ohwaki
IPC分类号： H01K3/10
CPC分类号： H05K3/44 , H05K1/056 , H05K3/06 , H05K3/108 , H05K3/243 , H05K2201/09554 , H05K2201/0969 , H05K2203/0323 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165
摘要： A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer 4 having a base opening portion 3 is formed on a metal board 2 at a ground terminal 13 forming position, and a thin metal film 5 is formed on the metal board 2 exposed in the base opening portion 3 and on the insulating base layer 4. Then, a conductive pattern 7 is formed on the thin metal film 5. Then, an insulating cover layer 9 covering the conductive pattern 7 and having a cover opening portion 8 which correspond in position to the base opening portion 3 is formed on the insulating base layer 4. Then, a metal board opening portion 11 from which the base opening portion 3 and the insulating base layer 4 around it are exposed is formed in the metal board 2. Then, an electrolytic plating layer 12 is formed on each side of the conductive pattern 7 exposed in the cover opening portion 8, feeding electric power from the conductive pattern 7, and a metal filling layer 14 is formed in the metal board opening portion 11, to allow the electrolytic plating layer 12 and the metal board 2 to be conductive with each other.
摘要翻译：一种具有电路的悬挂板的制造方法，其能够提供减少的工时数量和复杂的用于形成接地端子的工艺，以提供生产成本降低。在接地端子13的形成位置的金属板2上形成具有基部开口部3的绝缘基底层4，在露出于基部开口部3的绝缘金属板2上形成金属薄膜5，基层4。然后，在金属薄膜5上形成导电图案7。然后，在基底绝缘层4上形成覆盖导电图案7并且具有与基部开口部3相对应的盖开口部8的绝缘覆盖层9。然后，在金属板2上形成金属基板开口部11，基部开口部3及其周围的绝缘基底层4露出。然后，在暴露于盖开口部8的导电图案7的两侧形成电解镀层12，从导电图案7供给电力，在金属板开口部11形成有金属填充层14，以使电解镀层12和金属板2彼此导电。

10. 发明申请

US20070074899A1 Production method of suspension board with circuit 有权
标题翻译：带电路的悬挂板的生产方法
公开(公告)号：US20070074899A1
公开(公告)日：2007-04-05
申请号：US11505995
申请日：2006-08-18
申请人： Hidenori Aonuma , Yasuhito Ohwaki
发明人： Hidenori Aonuma , Yasuhito Ohwaki
IPC分类号： H05K1/16
CPC分类号： H05K3/44 , H05K1/056 , H05K3/108 , H05K3/243 , H05K2201/0305 , H05K2201/09554 , H05K2201/0969 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A production method of a suspension board with circuit that can form the ground terminal for connection with the ground, while reducing the number of man-hour and complicated processes, and reduce production cost. After an insulating base layer is formed on a metal supporting board in such a manner that the base opening portion is formed in the metal supporting board, a conductive pattern comprising a ground wiring pattern and a signal wiring pattern is formed on the insulating base layer. Then, an insulating cover layer to cover the conductive pattern is formed on the insulating base layer in such a manner that a first cover opening portion and a second cover opening portion are formed in the insulating cover layer. Then, an electrolytic plating layer is formed on a surface of the ground terminal exposed from the first cover opening portion and on a surface of the ground connecting portion exposed from the second cover opening portion, feeding electric power from the ground wire. Thereafter, a metal filling layer is formed in the base opening portion so as to conduct the ground connecting portion and the metal supporting board.
摘要翻译：具有电路的悬挂板的制造方法，其可以形成用于与地面连接的接地端子，同时减少工时数量和复杂的工艺，并降低生产成本。在基板开口部分形成在金属支撑板上的金属支撑板上形成绝缘基底层之后，在绝缘基底层上形成包括接地布线图形和信号布线图形的导电图案。然后，在绝缘基底层上形成覆盖导电图案的绝缘覆盖层，使得在绝缘覆盖层中形成第一盖开口部和第二盖开口部。然后，在从第一盖开口部露出的接地端子的表面和从第二盖开口部露出的接地连接部的表面上形成电解镀层，从地线供电。此后，在基部开口部分形成金属填充层，以便导通接地连接部分和金属支撑板。

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