专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050161775A1 Wiring circuit board and production method thereof 有权
标题翻译：接线电路板及其制作方法
公开(公告)号：US20050161775A1
公开(公告)日：2005-07-28
申请号：US11020350
申请日：2004-12-22
申请人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
发明人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
IPC分类号： G11B5/60 , G11B5/31 , G11B5/39 , G11B21/21 , G11B33/12 , H01L23/58 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/28 , H05K3/46
CPC分类号： G11B33/122 , G11B5/3103 , G11B5/3967 , H05K3/0023 , H05K3/0082 , H05K3/28 , H05K2201/0154 , H05K2201/0191
摘要： In the vicinity of the exposed part 1A of the multiply formed plural wiring conductors 1, of the thicknesses of the insulating cover layer 2 made of a polyimide layer, the thickness (T1) of a part located at about the middle point between the adjacent wiring conductors 1 is made smaller than the thickness (T2) of a part located on wiring conductor 1. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layer 2 and that of a part located on wiring conductor is made to fall within the range of 1-5 μm. As a result, the insulating cover layer does not peel off easily.
摘要翻译：在由聚酰亚胺层制成的绝缘覆盖层2的厚度的多重形成的多个布线导体1的露出部分1A的附近，位于中间点之间的部分的厚度（T 1）使相邻布线导体1小于位于布线导体1上的部分的厚度（T 2）。优选地，将位于绝缘覆盖层2的相邻布线导体和位于布线导体的部分的相邻布线导体之间的中点附近的部分的厚度差设为在1-5μm的范围内。结果，绝缘覆盖层不容易剥离。

2. 发明授权

US07084493B2 Wiring circuit board and production method thereof 有权
标题翻译：接线电路板及其制作方法
公开(公告)号：US07084493B2
公开(公告)日：2006-08-01
申请号：US11020350
申请日：2004-12-22
申请人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
发明人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
IPC分类号： H01L23/14 , H01L51/40
CPC分类号： G11B33/122 , G11B5/3103 , G11B5/3967 , H05K3/0023 , H05K3/0082 , H05K3/28 , H05K2201/0154 , H05K2201/0191
摘要： In the vicinity of the exposed part 1A of the multiply formed plural wiring conductors 1, of the thicknesses of the insulating cover layer 2 made of a polyimide layer, the thickness (T1) of a part located at about the middle point between the adjacent wiring conductors 1 is made smaller than the thickness (T2) of a part located on wiring conductor 1. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layer 2 and that of a part located on wiring conductor is made to fall within the range of 1–5 μm. As a result, the insulating cover layer does not peel off easily.
摘要翻译：在由聚酰亚胺层制成的绝缘覆盖层2的厚度的多重形成的多个布线导体1的露出部分1A的附近，位于中间点之间的部分的厚度（T 1）使相邻布线导体1小于位于布线导体1上的部分的厚度（T 2）。优选地，将位于绝缘覆盖层2的相邻布线导体和位于布线导体的部分的相邻布线导体之间的中点附近的部分的厚度差设为在1-5μm的范围内。结果，绝缘覆盖层不容易剥离。

3. 发明申请

US20060027393A1 Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet 有权
标题翻译：部分完成布线电路板组装片及使用该片的布线电路板的生产方法
公开(公告)号：US20060027393A1
公开(公告)日：2006-02-09
申请号：US11195965
申请日：2005-08-03
申请人： Hidenori Aonuma , Tetsuya Ohsawa , Yasuhito Ohwaki
发明人： Hidenori Aonuma , Tetsuya Ohsawa , Yasuhito Ohwaki
IPC分类号： H05K1/00 , C25D5/02
CPC分类号： H05K3/242 , H05K1/056 , H05K3/0052 , H05K3/28 , H05K2201/0969
摘要： The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet. The assembly sheet 100 of the present invention has a metal sheet 1, multiple wiring circuit board forming area 1A in compartments on the metal sheet and area 1B for forming a lead wire for electroplating, which is in compartment on the metal sheet 1. Each area 1A has a partially completed wiring circuit board 10. The partially completed wiring circuit board 10 is equipped with a base insulating layer 2, a wiring pattern 3 and a cover insulating layer 4. In the area 1B, a first insulating layer 12, a lead wire 13 for electroplating and a second insulating layer 14 are laminated in this order. Of the metal sheet 1, an opening 16 is formed in the part under the lead wire 13.
摘要翻译：本发明提供了一种部分完成的布线电路板组装片，即使在用于使金属片的电镀用引线绝缘的绝缘层中产生针孔时，也能够防止电镀金属在金属片的表面上的沉积。本发明的组装片100具有金属片1，金属片上的隔室中的多个布线电路板形成区域1A和金属片1上的隔室中形成用于电镀的导线的区域1B。每个区域1A具有部分完成的布线电路板10。部分完成的布线电路板10配备有基底绝缘层2，布线图案3和覆盖绝缘层4。在区域1B中，依次层叠第一绝缘层12，电镀用引线13和第二绝缘层14。在金属片1中，在引线13下面的部分中形成开口16。

4. 发明申请

US20050167281A1 Production method of suspension board with circuit 审中-公开
标题翻译：带电路的悬挂板的生产方法
公开(公告)号：US20050167281A1
公开(公告)日：2005-08-04
申请号：US11044077
申请日：2005-01-28
申请人： Tetsuya Ohsawa , Yasuhito Ohwaki
发明人： Tetsuya Ohsawa , Yasuhito Ohwaki
IPC分类号： C23C18/42 , C23C14/32 , C23F1/28 , H04R31/00 , H05K1/03 , H05K1/05 , H05K3/00 , H05K3/02 , H05K3/06 , H05K3/14 , H05K3/18 , H05K3/28 , H05K3/38 , H05K3/44
CPC分类号： H05K3/44 , G11B5/484 , G11B5/486 , H05K1/056 , H05K3/06 , H05K3/28 , H05K3/388 , H05K2201/0969 , H05K2203/0323
摘要： A production method of a suspension board with circuit that can reduce variations in diameter of the location holes or like holes formed in the suspension board and can produce a trim contour of the suspension board. In the process of forming a seed film 12, zirconium is previously deposited on a surface of the suspension board 2 by sputtering a conductive material forming the seed film 12 using an electrode formed of zirconium. Or, in the process of forming a metal coating 14, palladium is previously deposited on the surface of the suspension board 2 by electroless-plating the thin metal film forming the metal coating 14 using a catalyst including palladium. Thereafter, the suspension board 2 formed of stainless is trimmed by the chemical etching. This can allow an end face 17 of the suspension board 2 to be chemically etched evenly.
摘要翻译：一种具有电路的悬挂板的制造方法，其可以减小形成在悬挂板中的定位孔或类似孔的直径的变化，并且可以产生悬挂板的修整轮廓。在形成种子膜12的过程中，通过使用由锆形成的电极溅射形成种子膜12的导电材料，预先将锆预先沉积在悬挂板2的表面上。或者，在形成金属涂层14的过程中，通过使用包含钯的催化剂对形成金属涂层14的金属薄膜进行无电镀，预先将钯沉积在悬挂板2的表面上。此后，通过化学蚀刻来修整由不锈钢制成的悬挂板2。这可以使悬挂板2的端面17被均匀化学蚀刻。

5. 发明授权

US07351914B2 Flexible printed circuit board for catheter, catheter using same, and production method of catheter 失效
标题翻译：用于导管的柔性印刷电路板，使用其的导管以及导管的制造方法
公开(公告)号：US07351914B2
公开(公告)日：2008-04-01
申请号：US11405587
申请日：2006-04-18
申请人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
发明人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
IPC分类号： H05K1/00
CPC分类号： A61B5/03 , A61B5/01 , A61B5/6852 , A61B2562/222 , A61M25/00 , A61M25/0105 , H05K1/028 , H05K3/0061 , H05K2201/055
摘要： The present invention provides a flexible printed circuit board having a band-like meandering pattern as a whole, which includes multiple linear parts configured about parallel to each other and a folding margin connected to one end in a longitudinal direction of two adjacent linear parts of the multiple linear parts, and which can turn into a single linear product having a total length of not less than 300 mm when the folding margin is double-folded at about a center thereof, and, at the folding margin, either of the two linear parts connected to the folding margin is folded back in a direction opposite by 180 degrees. As a result, a flexible printed circuit board for a catheter, which is sufficiently elongate for use as a signal line of a catheter, can be produced using a general-purpose production apparatus.
摘要翻译：本发明提供了一种柔性印刷电路板，其具有整体上的带状曲折图案，该柔性印刷电路板包括彼此平行配置的多个直线部分，以及连接到两个相邻直线部分的纵向方向上的一端的折叠边缘多个线性部分，并且当折叠边缘在其中心附近被折叠时，可以变成具有不小于300mm的总长度的单个线性产品，并且在折叠边缘处，两个直线部分连接到折叠边缘的方向与180度相反的方向折回。结果，可以使用通用生产设备来制造用于导管的用于导管的信号线的足够细长的用于导管的柔性印刷电路板。

6. 发明授权

US07632236B2 Catheter and production method thereof 失效
标题翻译：导管及其制造方法
公开(公告)号：US07632236B2
公开(公告)日：2009-12-15
申请号：US11300517
申请日：2005-12-15
申请人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
发明人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
IPC分类号： A61B5/00 , A61B5/02
CPC分类号： A61M25/0043 , A61B5/0215 , A61M25/0015 , A61M25/007 , H05K1/056 , H05K1/189
摘要： The present invention provides a catheter 100 having a structure wherein an electronic component 2 is mounted on the anterior end or an intermediate part of a tube 1, a signal line electrically connecting to the electronic component 2 extends from the vicinity of the electronic component 2 through the aforementioned tube 1 to the posterior end of the aforementioned tube 1, which is characterized in that the signal line consists of a wiring pattern 4 of the flexible printed circuit board 10 inserted in the tube 1. Consequently, an electronic component-loaded catheter can control increase in the size of the tube caused by multiple signal lines to be connected to the electronic component.
摘要翻译：本发明提供一种具有其中电子部件2安装在管1的前端或中间部分的结构的导管100，电连接到电子部件2的信号线从电子部件2的附近延伸到电子部件2的附近，上述管1到上述管1的后端，其特征在于，信号线由插入管1中的柔性印刷电路板10的布线图案4构成。因此，电子部件负载导管可以控制由连接到电子部件的多个信号线引起的管的尺寸的增加。

7. 发明授权

US07329817B2 Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet 有权
标题翻译：部分完成布线电路板组装片及使用该片的布线电路板的生产方法
公开(公告)号：US07329817B2
公开(公告)日：2008-02-12
申请号：US11195965
申请日：2005-08-03
申请人： Hidenori Aonuma , Tetsuya Ohsawa , Yasuhito Ohwaki
发明人： Hidenori Aonuma , Tetsuya Ohsawa , Yasuhito Ohwaki
IPC分类号： H01R12/04
CPC分类号： H05K3/242 , H05K1/056 , H05K3/0052 , H05K3/28 , H05K2201/0969
摘要： The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet.The assembly sheet 100 of the present invention has a metal sheet 1, multiple wiring circuit board forming area 1A in compartments on the metal sheet and area 1B for forming a lead wire for electroplating, which is in compartment on the metal sheet 1. Each area 1A has a partially completed wiring circuit board 10. The partially completed wiring circuit board 10 is equipped with a base insulating layer 2, a wiring pattern 3 and a cover insulating layer 4. In the area 1B, a first insulating layer 12, a lead wire 13 for electroplating and a second insulating layer 14 are laminated in this order. Of the metal sheet 1, an opening 16 is formed in the part under the lead wire 13.
摘要翻译：本发明提供了一种部分完成的布线电路板组装片，即使在用于使金属片的电镀用引线绝缘的绝缘层中产生针孔时，也能够防止电镀金属在金属片的表面上的沉积。本发明的组装片100具有金属片1，金属片上的隔室中的多个布线电路板形成区域1A和金属片1上的隔室中形成用于电镀的导线的区域1B。每个区域1A具有部分完成的布线电路板10。部分完成的布线电路板10配备有基底绝缘层2，布线图案3和覆盖绝缘层4。在区域1B中，依次层叠第一绝缘层12，电镀用引线13和第二绝缘层14。在金属片1中，在引线13下面的部分中形成开口16。

8. 发明申请

US20060244177A1 Flexible printed circuit board for catheter, catheter using same, and production method of catheter 失效
标题翻译：用于导管的柔性印刷电路板，使用其的导管以及导管的制造方法
公开(公告)号：US20060244177A1
公开(公告)日：2006-11-02
申请号：US11405587
申请日：2006-04-18
申请人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
发明人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
IPC分类号： B29C65/00
CPC分类号： A61B5/03 , A61B5/01 , A61B5/6852 , A61B2562/222 , A61M25/00 , A61M25/0105 , H05K1/028 , H05K3/0061 , H05K2201/055
摘要： The present invention provides a flexible printed circuit board 100 having a band-like meander pattern as a whole, which includes multiple linear parts 1 configured in about parallel to each other and a folding margin connected to one end in the longitudinal direction of two adjacent linear parts of the multiple linear parts, and which can turn into a single linear product having a total length of not less than 300 mm when the folding margin 2 is double-folded at the about center thereof, and, at the folding margin 2, either of the two linear parts 1 connected to the folding margin 2 is folded back in the direction opposite by 180 degrees. As a result, a flexible printed circuit board for a catheter, which is sufficiently elongate for use as a signal line of a catheter, can be produced using a general-purpose production apparatus, which improves the degree of freedom of movement in a tube.
摘要翻译：本发明提供了一种柔性印刷电路板100，它具有整体上的带状曲折图案，该柔性印刷电路板100包括彼此大致平行配置的多个直线部分1和连接在两个相邻线性的纵向方向上的一端的折叠边缘多个直线部分的部分，并且当折叠边缘2在其大约中心处被双折叠时，可以变成具有不小于300mm的总长度的单个线性产品，并且在折叠边缘2处，连接到折叠边缘2的两个直线部分1在与180度相反的方向上折回。结果，可以使用用于导管的信号线的足够长的用于导管的柔性印刷电路板，其使用通用的生产设备来提高管中的移动自由度。

9. 发明申请

US20060129061A1 Catheter and production method thereof 失效
标题翻译：导管及其制造方法
公开(公告)号：US20060129061A1
公开(公告)日：2006-06-15
申请号：US11300517
申请日：2005-12-15
申请人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
发明人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
IPC分类号： A61B5/00
CPC分类号： A61M25/0043 , A61B5/0215 , A61M25/0015 , A61M25/007 , H05K1/056 , H05K1/189
摘要： The present invention provides a catheter 100 having a structure wherein an electronic component 2 is mounted on the anterior end or an intermediate part of a tube 1, a signal line electrically connecting to the electronic component 2 extends from the vicinity of the electronic component 2 through the aforementioned tube 1 to the posterior end of the aforementioned tube 1, which is characterized in that the signal line consists of a wiring pattern 4 of the flexible printed circuit board 10 inserted in the tube 1. Consequently, an electronic component-loaded catheter can control increase in the size of the tube caused by multiple signal lines to be connected to the electronic component.
摘要翻译：本发明提供一种具有其中电子部件2安装在管1的前端或中间部分的结构的导管100，电连接到电子部件2的信号线从电子部件2的附近延伸到电子部件2的附近，上述管1到上述管1的后端，其特征在于，信号线由插入管1中的柔性印刷电路板10的布线图案4组成。因此，电子部件负载的导管能够控制由连接到电子部件的多条信号线引起的管的尺寸的增加。

10. 发明授权

US07471519B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US07471519B2
公开(公告)日：2008-12-30
申请号：US11187865
申请日：2005-07-25
申请人： Yasunari Ooyabu , Yasuhito Funada , Hitoki Kanagawa , Tetsuya Ohsawa
发明人： Yasunari Ooyabu , Yasuhito Funada , Hitoki Kanagawa , Tetsuya Ohsawa
IPC分类号： H05K1/00
CPC分类号： H05K1/181 , H05K1/056 , H05K3/28 , H05K2201/09972 , Y02P70/611
摘要： A wired circuit board that can prevent inconsistency in characteristic impedance to allow effective transmission of electrical signals from a magnetic head to a control board portion. A wired circuit board is constructed so that a suspension board portion for supporting the magnetic head and a control board portion for controlling the magnetic head are formed to be continuous and integral with each other. To be more specific, a first conductor layer connected to the magnetic head in the suspension board portion and a second conductor layer connected to a preamplifier IC in the control board portion are formed from the same material and formed on a common insulating base layer simultaneously. Further, a common insulating cover layer to cover the first conductor layer and the second conductor layer is formed on the common insulating base layer.
摘要翻译：一种可以防止特性阻抗不一致的有线电路板，以允许有效地将电信号从磁头传输到控制板部分。布线电路板被构造成使得用于支撑磁头的悬架板部分和用于控制磁头的控制板部分彼此连续并且一体地形成。更具体地说，连接到悬架板部分中的磁头的第一导体层和连接到控制板部分中的前置放大器IC的第二导体层由相同的材料形成并同时形成在公共绝缘基底层上。此外，在公共绝缘基底层上形成覆盖第一导体层和第二导体层的公共绝缘覆盖层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式