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    • 1. 发明授权
    • Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same
    • 将微机电系统装置与电路芯片集成的装置及其制造方法
    • US09227841B2
    • 2016-01-05
    • US14274118
    • 2014-05-09
    • Chao Ta HuangShih Ting LinYu Wen Hsu
    • Chao Ta HuangShih Ting LinYu Wen Hsu
    • H01L41/08B81C1/00B81B7/00H01L41/113H01L41/09
    • B81C1/00134B81B7/0064B81C1/0023B81C2203/00B81C2203/0792H01L41/0933H01L41/1134H01L2224/11
    • One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.
    • 一个实施例公开了一种将微机电系统装置与包括电路芯片,微机电系统装置,密封环和盖的电路芯片集成的装置。 电路芯片包括基板和多个金属接合区域。 基板具有具有电路面积的有源表面,并且金属接合区域设置在有源表面上并电连接到电路。 微机电系统装置包括多个基座和至少一个感测元件。 基底连接至至少一个金属接合区域。 至少一个感测元件弹性地连接到基座。 所述密封环围绕所述基部,并且与所述金属接合区域中的至少一个连接。 盖与电路芯片的有效表面相对,并连接到密封环,以具有密封感测元件和电路芯片的有效表面的密封室。
    • 3. 发明申请
    • APPARATUS INTEGRATING MICROELECTROMECHANICAL SYSTEM DEVICE WITH CIRCUIT CHIP AND METHODS FOR FABRICATING THE SAME
    • 具有电路芯片的装置集成微电子系统装置及其制造方法
    • US20140248731A1
    • 2014-09-04
    • US14274118
    • 2014-05-09
    • Chao Ta HUANGShih Ting LINYu Wen HSU
    • Chao Ta HUANGShih Ting LINYu Wen HSU
    • B81C1/00
    • B81C1/00134B81B7/0064B81C1/0023B81C2203/00B81C2203/0792H01L41/0933H01L41/1134H01L2224/11
    • One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.
    • 一个实施例公开了一种将微机电系统装置与包括电路芯片,微机电系统装置,密封环和盖的电路芯片集成的装置。 电路芯片包括基板和多个金属接合区域。 基板具有具有电路面积的有源表面,并且金属接合区域设置在有源表面上并电连接到电路。 微机电系统装置包括多个基座和至少一个感测元件。 基底连接至至少一个金属接合区域。 至少一个感测元件弹性地连接到基座。 所述密封环围绕所述基部,并且与所述金属接合区域中的至少一个连接。 盖与电路芯片的有效表面相对,并连接到密封环,以具有密封感测元件和电路芯片的有效表面的密封室。
    • 6. 发明申请
    • APPARATUS INTEGRATING MICROELECTROMECHANICAL SYSTEM DEVICE WITH CIRCUIT CHIP AND METHODS FOR FABRICATING THE SAME
    • 具有电路芯片的装置集成微电子系统装置及其制造方法
    • US20120001276A1
    • 2012-01-05
    • US13173119
    • 2011-06-30
    • Chao Ta HUANGShih Ting LinYu Wen Hsu
    • Chao Ta HUANGShih Ting LinYu Wen Hsu
    • H01L29/84H01L21/02
    • B81C1/00134B81B7/0064B81C1/0023B81C2203/00B81C2203/0792H01L41/0933H01L41/1134H01L2224/11
    • One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which comprises a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.
    • 一个实施例公开了一种将微机电系统装置与包括电路芯片,微机电系统装置,密封环和盖子的电路芯片集成的装置。 电路芯片包括基板和多个金属接合区域。 基板具有具有电路面积的有源表面,并且金属接合区域设置在有源表面上并电连接到电路。 微机电系统装置包括多个基座和至少一个感测元件。 基底连接至至少一个金属接合区域。 至少一个感测元件弹性地连接到基座。 所述密封环围绕所述基部,并且与所述金属接合区域中的至少一个连接。 盖与电路芯片的有效表面相对,并连接到密封环,以具有密封感测元件和电路芯片的有效表面的密封室。