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1. 发明授权

US09227841B2 Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same 有权
标题翻译：将微机电系统装置与电路芯片集成的装置及其制造方法
公开(公告)号：US09227841B2
公开(公告)日：2016-01-05
申请号：US14274118
申请日：2014-05-09
申请人： Chao Ta Huang , Shih Ting Lin , Yu Wen Hsu
发明人： Chao Ta Huang , Shih Ting Lin , Yu Wen Hsu
IPC分类号： H01L41/08 , B81C1/00 , B81B7/00 , H01L41/113 , H01L41/09
CPC分类号： B81C1/00134 , B81B7/0064 , B81C1/0023 , B81C2203/00 , B81C2203/0792 , H01L41/0933 , H01L41/1134 , H01L2224/11
摘要： One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.
摘要翻译：一个实施例公开了一种将微机电系统装置与包括电路芯片，微机电系统装置，密封环和盖的电路芯片集成的装置。电路芯片包括基板和多个金属接合区域。基板具有具有电路面积的有源表面，并且金属接合区域设置在有源表面上并电连接到电路。微机电系统装置包括多个基座和至少一个感测元件。基底连接至至少一个金属接合区域。至少一个感测元件弹性地连接到基座。所述密封环围绕所述基部，并且与所述金属接合区域中的至少一个连接。盖与电路芯片的有效表面相对，并连接到密封环，以具有密封感测元件和电路芯片的有效表面的密封室。

2. 发明授权

US09046367B2 Micro-electro-mechanical-system device with oscillating assembly 有权
标题翻译：具有摆动组件的微机电系统装置
公开(公告)号：US09046367B2
公开(公告)日：2015-06-02
申请号：US13459270
申请日：2012-04-30
申请人： Chung-Yuan Su , Chao-Ta Huang , Shih-Chieh Lin , Yu-Wen Hsu
发明人： Chung-Yuan Su , Chao-Ta Huang , Shih-Chieh Lin , Yu-Wen Hsu
IPC分类号： G01C19/56 , G01C19/5747
CPC分类号： G01C19/5747
摘要： A micro-electro-mechanical-system (MEMS) device comprising two proof masses disposed in the first frame, such that the MEMS device with oscillating assemblies senses the angular velocity in the two axes, respectively. The MEMS device with oscillating assemblies further comprises a lever structure and two oscillating assemblies connecting at two opposite ends of the lever structure, such that the oscillating assemblies move in opposite directions synchronously. The MEMS device with oscillating assemblies further comprises a spring assembly connected between the proof mass and a movable electrode, restricting the proof mass to drive the movable electrode to only move in a specific direction.
摘要翻译：一种微电子机械系统（MEMS）装置，包括设置在第一框架中的两个检验质量块，使得具有振荡组件的MEMS装置分别感测两个轴中的角速度。具有摆动组件的MEMS装置还包括杠杆结构和在杠杆结构的两个相对端处连接的两个摆动组件，使得摆动组件沿相反方向同步地移动。具有振荡组件的MEMS装置还包括连接在检验质量块和可动电极之间的弹簧组件，限制了证明物质以驱动可移动电极仅沿特定方向移动。

3. 发明申请

US20140248731A1 APPARATUS INTEGRATING MICROELECTROMECHANICAL SYSTEM DEVICE WITH CIRCUIT CHIP AND METHODS FOR FABRICATING THE SAME 有权
标题翻译：具有电路芯片的装置集成微电子系统装置及其制造方法
公开(公告)号：US20140248731A1
公开(公告)日：2014-09-04
申请号：US14274118
申请日：2014-05-09
申请人： Chao Ta HUANG , Shih Ting LIN , Yu Wen HSU
发明人： Chao Ta HUANG , Shih Ting LIN , Yu Wen HSU
IPC分类号： B81C1/00
CPC分类号： B81C1/00134 , B81B7/0064 , B81C1/0023 , B81C2203/00 , B81C2203/0792 , H01L41/0933 , H01L41/1134 , H01L2224/11
摘要： One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.
摘要翻译：一个实施例公开了一种将微机电系统装置与包括电路芯片，微机电系统装置，密封环和盖的电路芯片集成的装置。电路芯片包括基板和多个金属接合区域。基板具有具有电路面积的有源表面，并且金属接合区域设置在有源表面上并电连接到电路。微机电系统装置包括多个基座和至少一个感测元件。基底连接至至少一个金属接合区域。至少一个感测元件弹性地连接到基座。所述密封环围绕所述基部，并且与所述金属接合区域中的至少一个连接。盖与电路芯片的有效表面相对，并连接到密封环，以具有密封感测元件和电路芯片的有效表面的密封室。

4. 发明申请

US20130167632A1 MICROELECTROMECHANICAL SYSTEM DEVICE WITH ELECTRICAL INTERCONNECTIONS AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：具有电气互连的微电子机电系统装置及其制造方法
公开(公告)号：US20130167632A1
公开(公告)日：2013-07-04
申请号：US13459271
申请日：2012-04-30
申请人： Chao-Ta Huang , Yu-Wen Hsu , Chin-Fu Kuo
发明人： Chao-Ta Huang , Yu-Wen Hsu , Chin-Fu Kuo
IPC分类号： G01P3/42 , H01L21/306
CPC分类号： B81B7/0006 , B81B2201/0271 , B81B2201/042 , B81B2203/0109 , B81B2203/0154 , B81B2203/058 , G01R33/0286
摘要： A microelectromechanical system device including anchors and mass is provided. Electrical interconnections are formed on the mass by using a insulation layer of mass, an electrical insulation trench and conductive through hole. The electrical interconnections replace the cross-line structure without adding additional processing steps, thereby reducing the use of the conductive layer and the electrical insulation layer. A method for fabricating the microelectromechanical system device is also provided.
摘要翻译：提供了包括锚和质量的微机电系统装置。通过使用质量绝缘层，电绝缘沟槽和导电通孔在质量上形成电互连。电互连替代了交叉线结构，而不增加额外的处理步骤，从而减少了导电层和电绝缘层的使用。还提供了一种用于制造微机电系统装置的方法。

5. 发明授权

US08421543B2 Crystal oscillator and method for manufacturing the same 有权
标题翻译：晶体振荡器及其制造方法
公开(公告)号：US08421543B2
公开(公告)日：2013-04-16
申请号：US13115112
申请日：2011-05-25
申请人： Yu-Wen Hsu , Lung-Tai Chen , Tzung-Ching Lee , Chao-Ta Huang
发明人： Yu-Wen Hsu , Lung-Tai Chen , Tzung-Ching Lee , Chao-Ta Huang
IPC分类号： H03B1/00 , H03B5/32 , H01L41/053
CPC分类号： H03H9/0547 , H03H3/02
摘要： A crystal oscillator includes a cover, a crystal blank and an Integrated Circuit (IC) chip. The cover has a surface, a cavity formed in the surface, a plurality of conductive contacts and a conductive sealing ring. The conductive contacts are disposed on the surface, and the conductive sealing ring is disposed on the surface and surrounds the conductive contacts. The IC chip is connected to the conductive contacts and the conductive sealing ring, and forms a hermetic chamber with the cover and the conductive sealing ring. The crystal blank is located in the hermetic chamber, and is electrically connected to the IC chip. Furthermore, a method for manufacturing a crystal oscillator is also provided.
摘要翻译：晶体振荡器包括盖，晶体空白和集成电路（IC）芯片。盖具有表面，形成在表面中的空腔，多个导电触点和导电密封环。导电触点设置在表面上，并且导电密封环设置在表面上并且围绕导电触点。 IC芯片连接到导电触点和导电密封环，并与盖和导电密封环形成密封室。晶体坯料位于密封室中，并与IC芯片电连接。此外，还提供了一种用于制造晶体振荡器的方法。

6. 发明申请

US20120001276A1 APPARATUS INTEGRATING MICROELECTROMECHANICAL SYSTEM DEVICE WITH CIRCUIT CHIP AND METHODS FOR FABRICATING THE SAME 有权
标题翻译：具有电路芯片的装置集成微电子系统装置及其制造方法
公开(公告)号：US20120001276A1
公开(公告)日：2012-01-05
申请号：US13173119
申请日：2011-06-30
申请人： Chao Ta HUANG , Shih Ting Lin , Yu Wen Hsu
发明人： Chao Ta HUANG , Shih Ting Lin , Yu Wen Hsu
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： B81C1/00134 , B81B7/0064 , B81C1/0023 , B81C2203/00 , B81C2203/0792 , H01L41/0933 , H01L41/1134 , H01L2224/11
摘要： One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which comprises a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.
摘要翻译：一个实施例公开了一种将微机电系统装置与包括电路芯片，微机电系统装置，密封环和盖子的电路芯片集成的装置。电路芯片包括基板和多个金属接合区域。基板具有具有电路面积的有源表面，并且金属接合区域设置在有源表面上并电连接到电路。微机电系统装置包括多个基座和至少一个感测元件。基底连接至至少一个金属接合区域。至少一个感测元件弹性地连接到基座。所述密封环围绕所述基部，并且与所述金属接合区域中的至少一个连接。盖与电路芯片的有效表面相对，并连接到密封环，以具有密封感测元件和电路芯片的有效表面的密封室。

7. 发明授权

US08695426B2 Micro-electromechanical system device having electrical insulating structure and manufacturing methods 有权
标题翻译：具有电绝缘结构和制造方法的微机电系统装置
公开(公告)号：US08695426B2
公开(公告)日：2014-04-15
申请号：US13220068
申请日：2011-08-29
申请人： Yu Wen Hsu , Shih Ting Lin , Jen Yi Chen , Chao Ta Huang
发明人： Yu Wen Hsu , Shih Ting Lin , Jen Yi Chen , Chao Ta Huang
IPC分类号： G01C19/56
CPC分类号： B81C1/00301 , B81B3/0086 , B81B2201/0242 , B81B2207/07 , B81C2203/0792 , G01C19/5762
摘要： The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.
摘要翻译：本公开涉及具有电绝缘结构的微机电系统（MEMS）装置。 MEMS器件包括至少一个移动部件，至少一个锚固件，至少一个弹簧和绝缘层。弹簧连接到锚固件和移动部件。绝缘层设置在移动部分和锚中。移动部分和锚固体中的每一个被绝缘层分成两个导电部分。由此，不同运动部件的电信号通过未电气连接的绝缘电路传输。

8. 发明申请

US20130167635A1 MICRO-ELECTRO-MECHANICAL-SYSTEM DEVICE WITH OSCILLATING ASSEMBLY 有权
标题翻译：具有振荡装置的微电子机械系统装置
公开(公告)号：US20130167635A1
公开(公告)日：2013-07-04
申请号：US13459270
申请日：2012-04-30
申请人： Chung-Yuan Su , Chao-Ta Huang , Shih-Chieh Lin , Yu-Wen Hsu
发明人： Chung-Yuan Su , Chao-Ta Huang , Shih-Chieh Lin , Yu-Wen Hsu
IPC分类号： G01C19/56
CPC分类号： G01C19/5747
摘要： A micro-electro-mechanical-system (MEMS) device comprising two proof masses disposed in the first frame, such that the MEMS device with oscillating assemblies senses the angular velocity in the two axes, respectively. The MEMS device with oscillating assemblies further comprises a lever structure and two oscillating assemblies connecting at two opposite ends of the lever structure, such that the oscillating assemblies move in opposite directions synchronously. The MEMS device with oscillating assemblies further comprises a spring assembly connected between the proof mass and a movable electrode, restricting the proof mass to drive the movable electrode to only move in a specific direction.
摘要翻译：一种微电子机械系统（MEMS）装置，包括设置在第一框架中的两个检验质量块，使得具有振荡组件的MEMS装置分别感测两个轴中的角速度。具有摆动组件的MEMS装置还包括杠杆结构和在杠杆结构的两个相对端处连接的两个摆动组件，使得摆动组件沿相反方向同步地移动。具有振荡组件的MEMS装置还包括连接在检验质量块和可动电极之间的弹簧组件，限制了证明物质以驱动可移动电极仅沿特定方向移动。

9. 发明申请

US20120160027A1 MICRO-ELECTROMECHANICAL SYSTEM DEVICE HAVING ELECTRICAL INSULATING STRUCTURE AND MANUFACTURING METHODS 有权
标题翻译：具有电气绝缘结构和制造方法的微电子系统装置
公开(公告)号：US20120160027A1
公开(公告)日：2012-06-28
申请号：US13220068
申请日：2011-08-29
申请人： Yu Wen HSU , Shih Ting Lin , Jen Yi Chen , Chao Ta Huang
发明人： Yu Wen HSU , Shih Ting Lin , Jen Yi Chen , Chao Ta Huang
IPC分类号： G01C19/02 , H01L21/02
CPC分类号： B81C1/00301 , B81B3/0086 , B81B2201/0242 , B81B2207/07 , B81C2203/0792 , G01C19/5762
摘要： The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.
摘要翻译：本公开涉及具有电绝缘结构的微机电系统（MEMS）装置。 MEMS器件包括至少一个移动部件，至少一个锚固件，至少一个弹簧和绝缘层。弹簧连接到锚固件和移动部件。绝缘层设置在移动部分和锚中。移动部分和锚固体中的每一个被绝缘层分成两个导电部分。由此，不同运动部件的电信号通过未电气连接的绝缘电路传输。

10. 发明申请

US20110150261A1 CAPACITIVE TRANSDUCER AND FABRICATION METHOD 有权
标题翻译：电容式传感器和制造方法
公开(公告)号：US20110150261A1
公开(公告)日：2011-06-23
申请号：US12643417
申请日：2009-12-21
申请人： Tzong-Che HO , Lung-Tai Chen , Yao-Jung Lee , Chao-Ta Huang , Li-Chi Pan , Yu-Sheng Hsieh
发明人： Tzong-Che HO , Lung-Tai Chen , Yao-Jung Lee , Chao-Ta Huang , Li-Chi Pan , Yu-Sheng Hsieh
IPC分类号： H04R9/08 , H01G7/00
CPC分类号： H01G5/011 , H04R19/005 , H04R19/04 , H04R31/00
摘要： A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.
摘要翻译：公开了一种电容式换能器和制造方法。所述电容式换能器包括基板，安装在所述基板上的第一电极，具有通孔和所述通孔旁边的空腔的盖，穿过所述通孔安装在所述盖上的第二电极。第二电极响应于通过通孔施加到其上的压力波动而变形，并与第一电极一起限定为电容器。电容器包括具有压力波动的电容变量，并且空腔限定用于可变形的第二电极的后室。

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