专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06956292B2 Bumping process to increase bump height and to create a more robust bump structure 有权
标题翻译：凸起过程增加凸块高度并创建更坚固的凸块结构
公开(公告)号：US06956292B2
公开(公告)日：2005-10-18
申请号：US10613694
申请日：2003-07-03
申请人： Yang-Tung Fan , Cheng-Yu Chu , Fu-Jier Fan , Shih-Jane Lin , Chiou-Shian Peng , Yen-Ming Chen , Kuo-Wei Lin
发明人： Yang-Tung Fan , Cheng-Yu Chu , Fu-Jier Fan , Shih-Jane Lin , Chiou-Shian Peng , Yen-Ming Chen , Kuo-Wei Lin
IPC分类号： H01L21/60 , H01L23/48
CPC分类号： H01L24/11 , H01L2224/03912 , H01L2224/0401 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05171 , H01L2224/05572 , H01L2224/05644 , H01L2224/05655 , H01L2224/1147 , H01L2224/1191 , H01L2224/13099 , H01L2224/45144 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2224/05552 , H01L2924/00014 , H01L2924/013
摘要： A new process is provided which is an extension and improvement of present processing for the creation of a solder bump. After the layers of Under Bump Metal and a layer of solder metal have been created in patterned and etched format and overlying the contact pad, following a conventional processing sequence, a layer of polyimide is deposited. The solder flow is performed using the thickness of the deposited layer of polyimide to control the height of the column underneath the reflown solder.
摘要翻译：提供了一种新的工艺，其是用于产生焊料凸块的当前处理的延伸和改进。在图形化和蚀刻形式下形成了凹凸金属层和焊料金属层之后，按照传统的处理顺序，沉积了一层聚酰亚胺。使用聚酰亚胺沉积层的厚度来进行焊料流动，以控制在重熔焊料下面的柱的高度。

2. 发明授权

US06586323B1 Method for dual-layer polyimide processing on bumping technology 有权
标题翻译：碰撞技术双层聚酰亚胺加工方法
公开(公告)号：US06586323B1
公开(公告)日：2003-07-01
申请号：US09664417
申请日：2000-09-18
申请人： Fu-Jier Fan , Cheng-Yu Chu , Kuo Wei Lin , Shih-Jang Lin , Yang-Tung Fan , Chiou-Shian Peng
发明人： Fu-Jier Fan , Cheng-Yu Chu , Kuo Wei Lin , Shih-Jang Lin , Yang-Tung Fan , Chiou-Shian Peng
IPC分类号： H01L2144
CPC分类号： H01L24/11 , H01L23/3192 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2224/05022 , H01L2224/05572 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/19042 , H01L2924/00014 , H01L2224/05552
摘要： A new method and processing sequence is provided for the formation of solder bumps that are in contact with underlying aluminum contact pads. A patterned layer of negative photoresist is interposed between a patterned layer of PE Si3N4 and a patterned layer of polyamide insulator. The patterned negative photoresist partially overlays the aluminum contact pad and prevents contact between the layer of polyamide insulator and the aluminum contact pad. By forming this barrier no moisture that is contained in the polyamide insulator can come in contact with the aluminum contact pad, therefore no corrosion in the surface of the aluminum contact pad can occur.
摘要翻译：提供了一种新的方法和处理顺序，用于形成与下面的铝接触焊盘接触的焊料凸块。在图案化的PE Si 3 N 4层和聚酰胺绝缘体的图案化层之间插入负型光致抗蚀剂的图案层。图案化的负光致抗蚀剂部分覆盖铝接触垫，并防止聚酰胺绝缘体层与铝接触垫之间的接触。通过形成该屏障，聚酰胺绝缘体中所含的水分不能与铝接触垫接触，因此铝接触垫的表面中不会发生腐蚀。

3. 发明授权

US07816169B2 Colors only process to reduce package yield loss 有权
标题翻译：颜色只能减少包装产量损失
公开(公告)号：US07816169B2
公开(公告)日：2010-10-19
申请号：US12347468
申请日：2008-12-31
申请人： Yang-Tung Fan , Chiou-Shian Peng , Cheng-Yu Chu , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Li
发明人： Yang-Tung Fan , Chiou-Shian Peng , Cheng-Yu Chu , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Li
IPC分类号： H01L21/00
CPC分类号： H01L27/14685 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/14645 , H01L31/02162 , H01L31/02327
摘要： Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.
摘要翻译：公开了一种有序的微电子制造顺序，其中滤色器通过直角沉积直接形成在CCD，CID或CMOS成像装置的光电检测器阵列上以形成凹入像素表面，并且覆盖有高透光率平面化膜指定的折射率和物理性质，其优化光收集到光电二极管而不需要额外的常规微透镜。光学平坦的顶表面用于封装和保护成像器免受化学和热清洁处理损伤，最小化形成的底层变化，其将形成在非平面表面上的图像的像差或引起反射损失，并且消除在切割期间引起的残留颗粒夹杂物，打包。通过在半导体衬底上光刻地构图光电二极管平面阵列来形成CCD成像器。光电二极管阵列设置有金属遮光罩，钝化，并且在其上形成滤色器。沉积透明密封剂以平坦化滤色器层并完成固态彩色图像形成装置，而不需要常规的凸起的微透镜。

4. 发明授权

US07485906B2 Colors only process to reduce package yield loss 有权
标题翻译：颜色只能减少包装产量损失
公开(公告)号：US07485906B2
公开(公告)日：2009-02-03
申请号：US11642225
申请日：2006-12-20
申请人： Yang-Tung Fan , Chiou-Shian Peng , Cheng-Yu Chu , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Lin
发明人： Yang-Tung Fan , Chiou-Shian Peng , Cheng-Yu Chu , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Lin
IPC分类号： H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119
CPC分类号： H01L27/14685 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/14645 , H01L31/02162 , H01L31/02327
摘要： Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.
摘要翻译：公开了一种有序的微电子制造顺序，其中滤色器通过直角沉积直接形成在CCD，CID或CMOS成像装置的光电检测器阵列上以形成凹入像素表面，并且覆盖有高透光率平面化膜指定的折射率和物理性质，其优化光收集到光电二极管而不需要额外的常规微透镜。光学平坦的顶表面用于封装和保护成像器免受化学和热清洁处理损伤，最小化形成的底层变化，其将形成在非平面表面上的图像的像差或引起反射损失，并且消除在切割期间引起的残留颗粒夹杂物，打包。通过在半导体衬底上光刻地构图光电二极管平面阵列来形成CCD成像器。光电二极管阵列设置有金属遮光罩，钝化，并且在其上形成滤色器。沉积透明密封剂以平坦化滤色器层并完成固态彩色图像形成装置，而不需要常规的凸起的微透镜。

5. 发明授权

US06495813B1 Multi-microlens design for semiconductor imaging devices to increase light collection efficiency in the color filter process 有权
标题翻译：用于半导体成像装置的多微透镜设计，以提高滤色镜过程中的光采集效率
公开(公告)号：US06495813B1
公开(公告)日：2002-12-17
申请号：US09414926
申请日：1999-10-12
申请人： Yang-Tung Fan , Bii-Cheng Chang , Sheng-Liang Pan , Kuo-Liang Lu
发明人： Yang-Tung Fan , Bii-Cheng Chang , Sheng-Liang Pan , Kuo-Liang Lu
IPC分类号： H01L2700
CPC分类号： H01L27/14603 , H01L27/14627
摘要： Multi-microlens arrays for optimizing light collection efficiency in CCD/CMOS solid-state color image cameras with L-shaped or non-regular photodetector areas are disclosed. Microelectronic fabrication methods for forming planar array multi-microlenses comprised of elements consisting of lens-pairs, integrated with color-filters, and compatible with CMOS high-volume manufacturing are taught. Experimental results demonstrating the processes for fabrication of multi-microlenses for L-shaped and for non-regular sensing areas are given.
摘要翻译：公开了用于优化具有L形或非常规光电探测器区域的CCD / CMOS固态彩色摄像机中的光收集效率的多微透镜阵列。教导了用于形成平面阵列多微透镜的微电子制造方法，所述平面阵列多微透镜由与彩色滤光片集成并与CMOS大批量制造兼容的透镜对构成的元件组成。给出了证明L型和非常规感测区域的多微透镜制造工艺的实验结果。

6. 发明授权

US06426283B1 Method for bumping and backlapping a semiconductor wafer 有权
标题翻译：用于凸起和重叠半导体晶片的方法
公开(公告)号：US06426283B1
公开(公告)日：2002-07-30
申请号：US09727832
申请日：2000-12-01
申请人： Yen-Ming Chen , Kuo-Wei Lin , Cheng-Yu Chu , Fu-Jier Fan , Yang-Tung Fan , Chiou-Shian Peng , Shih-Jane Lin
发明人： Yen-Ming Chen , Kuo-Wei Lin , Cheng-Yu Chu , Fu-Jier Fan , Yang-Tung Fan , Chiou-Shian Peng , Shih-Jane Lin
IPC分类号： H01L2144
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05023 , H01L2224/05027 , H01L2224/0508 , H01L2224/05568 , H01L2224/05572 , H01L2224/1147 , H01L2224/13099 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/05647 , H01L2924/00014 , H01L2224/05655 , H01L2224/05124 , H01L2224/05166 , H01L2224/05171
摘要： A method for bumping and backlapping a semiconductor wafer that has a multiplicity of solder bumps formed on an active surface of the wafer is disclosed. In the method, a preprocessed wafer that has a multiplicity of bond pads formed on a top surface is first provided, a under-bump-metallurgy (UBM) layer is then sputter deposited on top of the wafer surface, followed by the lamination of a dry film resist layer on top of the UBM layer. The dry film resist layer is then patterned with a multiplicity of openings exposing the multiplicity of bond pads, followed by the deposition of a solder material into the multiplicity of openings to form the solder bump's. A protective tape is then adhesively bonded to the top of the dry film resist layer before the wafer is positioned into a backlapping apparatus for removing of a preselected thickness from the backside of the wafer. After the completion of the backside lapping process, the protective tape and the dry film resist layer are stripped away sequentially and the solder bumps are reflown into solder balls. The present invention novel method effectively prevents any damages to. the solder balls during the backlapping process since the solder bumps are well protected by the dry film resist layer during such process.
摘要翻译：公开了一种在晶片的有效表面上形成有多个焊料凸起的半导体晶片的凸起和反覆的方法。在该方法中，首先提供具有形成在顶表面上的多个接合焊盘的预处理晶片，然后溅射沉积凸块下冶金（UBM）层，然后溅射沉积在晶片表面上，然后层压 UBM层顶部的干膜抗蚀剂层。然后将干膜抗蚀剂层用暴露多个接合焊盘的多个开口图案化，随后将焊料材料沉积到多个开口中以形成焊料凸块。然后将保护带粘合到干膜抗蚀剂层的顶部，然后将晶片定位到用于从晶片的背面除去预选厚度的重叠装置。在完成背面研磨处理之后，依次剥离保护带和干膜抗蚀剂层，并将焊料凸点重新焊接到焊球中。本发明新颖的方法有效地防止了任何损害。由于焊料凸块在这种工艺期间被干膜抗蚀剂层良好地保护，所以在重叠过程期间的焊球。

7. 发明授权

US06200712B1 Color filter image array optoelectronic microelectronic fabrication with three dimensional color filter layer and method for fabrication thereof 有权
标题翻译：彩色滤光片图像阵列具有三维彩色滤光片层的光电微电子制造及其制造方法
公开(公告)号：US06200712B1
公开(公告)日：2001-03-13
申请号：US09252465
申请日：1999-02-18
申请人： Yang-Tung Fan , Chih-Hsiung Lee
发明人： Yang-Tung Fan , Chih-Hsiung Lee
IPC分类号： G02B520
CPC分类号： H01L31/0232 , G02B5/201 , H01L27/14621 , H01L27/14685 , H01L31/02162 , H01L31/02327
摘要： A method for forming an optoelectronic microelectronic fabrication and an optoelectronic microelectronic fabrication fabricated in accord with the method. There is first provided a substrate having at minimum a first photoactive region and a second photoactive region formed therein. There is then formed over the substrate a patterned first color filter layer registered with the first photoactive region. There is then formed upon the patterned first color filter layer a first optically transparent planarizing encapsulant layer. There is then formed upon the first optically transparent planarizing encapsulant layer a patterned second color filter layer registered with the second photoactive region. Finally, there is then formed upon the patterned second color filter layer a second optically transparent planarizing encapsulant layer. The method contemplates an optoelectronic microelectronic fabrication fabricated in accord with the method.
摘要翻译：一种用于形成光电子微电子制造的方法和根据该方法制造的光电子微电子制造。首先提供具有至少形成有第一光活性区域和第二光活性区域的基板。然后在衬底上形成与第一光活性区域配准的图案化的第一滤色器层。然后在图案化的第一滤色器层上形成第一光学透明平面化封装层。然后在第一光学透明平坦化包封层上形成与第二光活性区域配准的图案化的第二滤色器层。最后，然后在图案化的第二滤色器层上形成第二光学透明的平坦化封装层。该方法考虑了根据该方法制造的光电子微电子制造。

8. 发明授权

US06171885B2 High efficiency color filter process for semiconductor array imaging devices 有权
标题翻译：用于半导体阵列成像器件的高效率滤色器工艺
公开(公告)号：US06171885B2
公开(公告)日：2001-01-09
申请号：US09414925
申请日：1999-10-12
申请人： Yang-Tung Fan , Sheng-Liang Pan , Bii-Cheng Chang , Kuo-Liang Lu
发明人： Yang-Tung Fan , Sheng-Liang Pan , Bii-Cheng Chang , Kuo-Liang Lu
IPC分类号： H01L21339
CPC分类号： H01L27/14609 , H01L27/14621 , H01L27/14627
摘要： A microelectronic method is described for optimizing the fabrication of optical and semiconductor array structures for high efficiency color image formation in solid-state cameras. Disclosed is an ordered fabrication sequence in which microlens formation precedes color filter layer formation to enable increased image light collection efficiency, to encapsulate and protect the microlens elements from chemical and thermal processing damage, to minimize topographical underlayer variations which would axially misalign or otherwise aberrate microlens elements formed on non-planar surfaces, and, to complete the most difficult steps early in the process to minimize rework and scrap. A CMOS, CID, or CCD optoelectronic configuration is formed by photolithographically patterning a planar-array of photodiodes on a Silicon or other III-V, II-VI, or compound semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, planarized, and, a first convex microlens array of high curvature or other suitable lenses are formed thereon. A transparent encapsulant is deposited to planarize the microlens layer and provide a spacer for the successive deposition(s) of one or more color filter layers. The microlens array may be formed from positive photoresists and the spacer from negative resist, with close attention to matching the index of refraction at layer interfaces. A final surface layer comprising a color filter completes the solid-state color image-forming device.
摘要翻译：描述了用于优化固态照相机中用于高效率彩色图像形成的光学和半导体阵列结构的制造的微电子方法。公开了一种有序的制造顺序，其中微透镜形成在滤色器层形成之前，以提高图像光采集效率，封装和保护微透镜元件免受化学和热处理损伤，以最小化将轴向不对准或以其他方式将微透镜像差的形貌底层变化在非平面表面上形成的元件，并且在过程的早期完成最困难的步骤，以最小化返工和废料。通过光刻地图案化硅或其它III-V，II-VI或化合物半导体衬底上的光电二极管平面阵列来形成CMOS，CID或CCD光电结构。光电二极管阵列设置有金属遮光罩，钝化，平面化，并且在其上形成高曲率的第一凸形微透镜阵列或其它合适的透镜。沉积透明的密封剂以使微透镜层平坦化，并为一个或多个滤色器层的连续沉积提供间隔物。微透镜阵列可以由正光致抗蚀剂和来自负光刻胶的间隔物形成，密切关注层界面处的折射率的匹配。包括滤色器的最终表面层完成了固态彩色图像形成装置。

9. 发明授权

US06171883B2 Image array optoelectronic microelectronic fabrication with enhanced optical stability and method for fabrication thereof 有权
标题翻译：具有增强的光学稳定性的图像阵列光电微电子制造及其制造方法
公开(公告)号：US06171883B2
公开(公告)日：2001-01-09
申请号：US09252467
申请日：1999-02-18
申请人： Yang-Tung Fan , Yu-Kung Hsiao , Chih-Hsiung Lee
发明人： Yang-Tung Fan , Yu-Kung Hsiao , Chih-Hsiung Lee
IPC分类号： H01L2100
CPC分类号： H01L27/14609 , H01L27/14621 , H01L27/14627 , H01L27/14643
摘要： A method for forming an image array optoelectronic microelectronic fabrication, and the image array optoelectronic microelectronic fabrication formed employing the method. There is first provided a substrate having a photoactive region formed therein. There is then formed over the substrate a patterned microlens layer which functions to focus electromagnetic radiation with respect to the photoactive region of the substrate. The patterned microlens layer is formed of a first material having a first index of refraction. Finally, there is then formed conformally upon the patterned microlens layer an encapsulant layer, where the encapsulant layer is formed of a second material having a second index of refraction no greater than, and preferably less than, the first index of refraction of the first material. The method of the present invention contemplates an image array optoelectronic microelectronic fabrication formed employing the method of the present invention. The method is particularly useful for forming image array optoelectronic microelectronic fabrications with enhanced optical stability.
摘要翻译：一种用于形成图像阵列光电微电子制造的方法，以及使用该方法形成的图像阵列光电微电子制造。首先提供其中形成有光活性区的基板。然后在衬底上形成图案化的微透镜层，其用于将电磁辐射相对于衬底的光活性区域聚焦。图案化的微透镜层由具有第一折射率的第一材料形成。最后，然后在图案化微透镜层上形成一个密封层，其中密封剂层由具有第二折射率不大于，优选地小于第一材料的第一折射率的第二材料形成。本发明的方法考虑了使用本发明的方法形成的图像阵列光电微电子制造。该方法对于形成具有增强的光学稳定性的图像阵列光电微电子制造特别有用。

10. 发明申请

US20090111208A1 COLORS ONLY PROCESS TO REDUCE PACKAGE YIELD LOSS 有权
标题翻译：颜色只有减少包装损失的过程
公开(公告)号：US20090111208A1
公开(公告)日：2009-04-30
申请号：US12347468
申请日：2008-12-31
申请人： Yang-Tung FAN , Chiou-Shian Peng , Cheng-Yu Chu , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Lin
发明人： Yang-Tung FAN , Chiou-Shian Peng , Cheng-Yu Chu , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Lin
IPC分类号： H01L31/18
CPC分类号： H01L27/14685 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/14645 , H01L31/02162 , H01L31/02327
摘要： Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.
摘要翻译：公开了一种有序的微电子制造顺序，其中滤色器通过直角沉积直接形成在CCD，CID或CMOS成像装置的光电检测器阵列上以形成凹入像素表面，并且覆盖有高透光率平面化膜指定的折射率和物理性质，其优化光收集到光电二极管而不需要额外的常规微透镜。光学平坦的顶表面用于封装和保护成像器免受化学和热清洁处理损伤，最小化形成的底层变化，其将形成在非平面表面上的图像的像差或引起反射损失，并且消除在切割期间引起的残留颗粒夹杂物，打包。通过在半导体衬底上光刻地构图光电二极管平面阵列来形成CCD成像器。光电二极管阵列设置有金属遮光罩，钝化，并且在其上形成滤色器。沉积透明密封剂以平坦化滤色器层并完成固态彩色图像形成装置，而不需要常规的凸起的微透镜。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式