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1. 发明授权

US06956292B2 Bumping process to increase bump height and to create a more robust bump structure 有权
标题翻译：凸起过程增加凸块高度并创建更坚固的凸块结构
公开(公告)号：US06956292B2
公开(公告)日：2005-10-18
申请号：US10613694
申请日：2003-07-03
申请人： Yang-Tung Fan , Cheng-Yu Chu , Fu-Jier Fan , Shih-Jane Lin , Chiou-Shian Peng , Yen-Ming Chen , Kuo-Wei Lin
发明人： Yang-Tung Fan , Cheng-Yu Chu , Fu-Jier Fan , Shih-Jane Lin , Chiou-Shian Peng , Yen-Ming Chen , Kuo-Wei Lin
IPC分类号： H01L21/60 , H01L23/48
CPC分类号： H01L24/11 , H01L2224/03912 , H01L2224/0401 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05171 , H01L2224/05572 , H01L2224/05644 , H01L2224/05655 , H01L2224/1147 , H01L2224/1191 , H01L2224/13099 , H01L2224/45144 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2224/05552 , H01L2924/00014 , H01L2924/013
摘要： A new process is provided which is an extension and improvement of present processing for the creation of a solder bump. After the layers of Under Bump Metal and a layer of solder metal have been created in patterned and etched format and overlying the contact pad, following a conventional processing sequence, a layer of polyimide is deposited. The solder flow is performed using the thickness of the deposited layer of polyimide to control the height of the column underneath the reflown solder.
摘要翻译：提供了一种新的工艺，其是用于产生焊料凸块的当前处理的延伸和改进。在图形化和蚀刻形式下形成了凹凸金属层和焊料金属层之后，按照传统的处理顺序，沉积了一层聚酰亚胺。使用聚酰亚胺沉积层的厚度来进行焊料流动，以控制在重熔焊料下面的柱的高度。

2. 发明授权

US06586323B1 Method for dual-layer polyimide processing on bumping technology 有权
标题翻译：碰撞技术双层聚酰亚胺加工方法
公开(公告)号：US06586323B1
公开(公告)日：2003-07-01
申请号：US09664417
申请日：2000-09-18
申请人： Fu-Jier Fan , Cheng-Yu Chu , Kuo Wei Lin , Shih-Jang Lin , Yang-Tung Fan , Chiou-Shian Peng
发明人： Fu-Jier Fan , Cheng-Yu Chu , Kuo Wei Lin , Shih-Jang Lin , Yang-Tung Fan , Chiou-Shian Peng
IPC分类号： H01L2144
CPC分类号： H01L24/11 , H01L23/3192 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2224/05022 , H01L2224/05572 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/19042 , H01L2924/00014 , H01L2224/05552
摘要： A new method and processing sequence is provided for the formation of solder bumps that are in contact with underlying aluminum contact pads. A patterned layer of negative photoresist is interposed between a patterned layer of PE Si3N4 and a patterned layer of polyamide insulator. The patterned negative photoresist partially overlays the aluminum contact pad and prevents contact between the layer of polyamide insulator and the aluminum contact pad. By forming this barrier no moisture that is contained in the polyamide insulator can come in contact with the aluminum contact pad, therefore no corrosion in the surface of the aluminum contact pad can occur.
摘要翻译：提供了一种新的方法和处理顺序，用于形成与下面的铝接触焊盘接触的焊料凸块。在图案化的PE Si 3 N 4层和聚酰胺绝缘体的图案化层之间插入负型光致抗蚀剂的图案层。图案化的负光致抗蚀剂部分覆盖铝接触垫，并防止聚酰胺绝缘体层与铝接触垫之间的接触。通过形成该屏障，聚酰胺绝缘体中所含的水分不能与铝接触垫接触，因此铝接触垫的表面中不会发生腐蚀。

3. 发明申请

US20090111208A1 COLORS ONLY PROCESS TO REDUCE PACKAGE YIELD LOSS 有权
标题翻译：颜色只有减少包装损失的过程
公开(公告)号：US20090111208A1
公开(公告)日：2009-04-30
申请号：US12347468
申请日：2008-12-31
申请人： Yang-Tung FAN , Chiou-Shian Peng , Cheng-Yu Chu , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Lin
发明人： Yang-Tung FAN , Chiou-Shian Peng , Cheng-Yu Chu , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Lin
IPC分类号： H01L31/18
CPC分类号： H01L27/14685 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/14645 , H01L31/02162 , H01L31/02327
摘要： Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.
摘要翻译：公开了一种有序的微电子制造顺序，其中滤色器通过直角沉积直接形成在CCD，CID或CMOS成像装置的光电检测器阵列上以形成凹入像素表面，并且覆盖有高透光率平面化膜指定的折射率和物理性质，其优化光收集到光电二极管而不需要额外的常规微透镜。光学平坦的顶表面用于封装和保护成像器免受化学和热清洁处理损伤，最小化形成的底层变化，其将形成在非平面表面上的图像的像差或引起反射损失，并且消除在切割期间引起的残留颗粒夹杂物，打包。通过在半导体衬底上光刻地构图光电二极管平面阵列来形成CCD成像器。光电二极管阵列设置有金属遮光罩，钝化，并且在其上形成滤色器。沉积透明密封剂以平坦化滤色器层并完成固态彩色图像形成装置，而不需要常规的凸起的微透镜。

4. 发明申请

US20070120155A1 Colors only process to reduce package yield loss 有权
公开(公告)号：US20070120155A1
公开(公告)日：2007-05-31
申请号：US11642225
申请日：2006-12-20
申请人： Yang-Tung Fan , Chiou-Shian Peng , Chen-Yu Chu , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Lin
发明人： Yang-Tung Fan , Chiou-Shian Peng , Chen-Yu Chu , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Lin
IPC分类号： H01L29/76
CPC分类号： H01L27/14685 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/14645 , H01L31/02162 , H01L31/02327
摘要： Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.

5. 发明授权

US07183598B2 Colors only process to reduce package yield loss 有权
标题翻译：颜色只能减少包装产量损失
公开(公告)号：US07183598B2
公开(公告)日：2007-02-27
申请号：US11037445
申请日：2005-01-18
申请人： Yang-Tung Fan , Chiou-Shian Peng , Cheng-Yu Chu , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Lin
发明人： Yang-Tung Fan , Chiou-Shian Peng , Cheng-Yu Chu , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Lin
IPC分类号： H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119
CPC分类号： H01L27/14685 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/14645 , H01L31/02162 , H01L31/02327
摘要： Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.
摘要翻译：公开了一种有序的微电子制造顺序，其中滤色器通过直角沉积直接形成在CCD，CID或CMOS成像装置的光电检测器阵列上以形成凹入像素表面，并且覆盖有高透光率平面化膜指定的折射率和物理性质，其优化光收集到光电二极管而不需要额外的常规微透镜。光学平坦的顶表面用于封装和保护成像器免受化学和热清洁处理损伤，最小化形成的底层变化，其将形成在非平面表面上的图像的像差或引起反射损失，并且消除在切割期间引起的残留颗粒夹杂物，打包。通过在半导体衬底上光刻地构图光电二极管平面阵列来形成CCD成像器。光电二极管阵列设置有金属遮光罩，钝化，并且在其上形成滤色器。沉积透明密封剂以平坦化滤色器层并完成固态彩色图像形成装置，而不需要常规的凸起的微透镜。

6. 发明授权

US06936923B2 Method to form very a fine pitch solder bump using methods of electroplating 有权
标题翻译：使用电镀方法形成非常细的间距焊料凸块的方法
公开(公告)号：US06936923B2
公开(公告)日：2005-08-30
申请号：US10147245
申请日：2002-05-16
申请人： Kuo-Wei Lin , Cheng-Yu Chu , Yen-Ming Chen , Yang-Tung Fan , Fu-Jier Fan , Chiou Shian Peng , Shih-Jang Lin
发明人： Kuo-Wei Lin , Cheng-Yu Chu , Yen-Ming Chen , Yang-Tung Fan , Fu-Jier Fan , Chiou Shian Peng , Shih-Jang Lin
IPC分类号： H01L21/60 , H01L23/48
CPC分类号： H01L24/12 , H01L24/11 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/05568 , H01L2224/1147 , H01L2224/11902 , H01L2224/13023 , H01L2224/13099 , H01L2224/131 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/3025 , H01L2224/05552
摘要： A new method and processing sequence is provided for the creation of interconnect bumps. A layer of passivation is deposited over a contact pad and patterned, creating an opening in the layer of passivation that aligns with the contact pad. A layer of UBM metal is deposited over the layer of passivation, the layer of UBM is overlying the contact pad and limited to the immediate surroundings of the contact pad. The central surface of the layer of UBM is selectively electroplated after which a layer of solder or solder alloy is solder printed over the electroplated surface of the layer of UBM. A solder flux or paste is applied over the surface of the solder printed solder compound or solder alloy. Flowing of the solder or solder alloy creates the solder bump of the invention.
摘要翻译：提供了一种新的方法和处理顺序，用于创建互连凸块。钝化层沉积在接触焊盘上并被图案化，在与接触焊盘对准的钝化层中产生开口。一层UBM金属沉积在钝化层上，UBM层覆盖接触焊盘，并限制在接触焊盘的周围环境。选择性地电镀UBM层的中心表面，然后在UBM层的电镀表面上焊接印刷一层焊料或焊料合金。在焊料印刷的焊料化合物或焊料合金的表面上施加焊剂或糊料。焊料或焊料合金的流动产生本发明的焊料凸块。

7. 发明申请

US20050121737A1 Colors only process to reduce package yield loss 有权
标题翻译：颜色只能减少包装产量损失
公开(公告)号：US20050121737A1
公开(公告)日：2005-06-09
申请号：US11037445
申请日：2005-01-18
申请人： Yang-Tung Fan , Chion-Shian Peng , Cheng-Yu Chu , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Lin
发明人： Yang-Tung Fan , Chion-Shian Peng , Cheng-Yu Chu , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Lin
IPC分类号： G02F1/1335 , H01L21/00 , H01L27/146 , H01L31/0216 , H01L31/0232
CPC分类号： H01L27/14685 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/14645 , H01L31/02162 , H01L31/02327
摘要： Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.
摘要翻译：公开了一种有序的微电子制造顺序，其中滤色器通过直角沉积直接形成在CCD，CID或CMOS成像装置的光电检测器阵列上以形成凹入像素表面，并且覆盖有高透光率平面化膜指定的折射率和物理性质，其优化光收集到光电二极管而不需要额外的常规微透镜。光学平坦的顶表面用于封装和保护成像器免受化学和热清洁处理损伤，最小化形成的底层变化，其将形成在非平面表面上的图像的像差或引起反射损失，并且消除在切割期间引起的残留颗粒夹杂物，打包。通过在半导体衬底上光刻地构图光电二极管平面阵列来形成CCD成像器。光电二极管阵列设置有金属遮光罩，钝化，并且在其上形成滤色器。沉积透明密封剂以平坦化滤色器层并完成固态彩色图像形成装置，而不需要常规的凸起的微透镜。

8. 发明授权

US06632700B1 Method to form a color image sensor cell while protecting the bonding pad structure from damage 有权
标题翻译：形成彩色图像传感器单元同时保护接合垫结构免受损坏的方法
公开(公告)号：US06632700B1
公开(公告)日：2003-10-14
申请号：US10135096
申请日：2002-04-30
申请人： Yang-Tung Fan , Cheng-Yu Chu , Chiou-Shian Peng , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Lin
发明人： Yang-Tung Fan , Cheng-Yu Chu , Chiou-Shian Peng , Shih-Jane Lin , Yen-Ming Chen , Fu-Jier Fan , Kuo-Wei Lin
IPC分类号： H01L2100
CPC分类号： H01L31/02162 , H01L27/14621 , H01L27/14627 , H01L27/14685
摘要： A new method to form color image sensor cells without damaging bonding pads in the manufacture of an integrated circuit device is achieved. The method comprises, first, forming cell electrodes and bonding pads on a semiconductor substrate. A passivation layer is formed overlying the cell electrodes but exposing the top surface of the bonding pads. The semiconductor substrate is then dipped in a hydrogen peroxide solution to thereby form a metal oxide layer overlying the bonding pads. A first transparent planarization layer is deposited overlying the passivation layer and the metal oxide layer. A color filter photoresist layer is deposited overlying the first transparent planarization layer. The color filter photoresist layer is patterned to form color filter elements to complete the color image sensor cells in the manufacture of the integrated circuit device. The presence of the metal oxide layer prevents damage to the bonding pads from an alkaline developer.
摘要翻译：实现了在集成电路器件的制造中形成彩色图像传感器单元而不损坏接合焊盘的新方法。该方法首先在半导体衬底上形成电池电极和接合焊盘。钝化层形成在电池电极上方，但暴露了焊盘的顶表面。然后将半导体衬底浸入过氧化氢溶液中，从而形成覆盖在焊盘上的金属氧化物层。覆盖钝化层和金属氧化物层的第一透明平坦化层被沉积。沉积在第一透明平坦化层上的滤色器光致抗蚀剂层。图案化滤色器光致抗蚀剂层以形成滤色器元件，以在集成电路器件的制造中完成彩色图像传感器单元。金属氧化物层的存在防止了碱性显影剂对接合焊盘的损坏

9. 发明授权

US06583039B2 Method of forming a bump on a copper pad 有权
标题翻译：在铜垫上形成凸点的方法
公开(公告)号：US06583039B2
公开(公告)日：2003-06-24
申请号：US09978422
申请日：2001-10-15
申请人： Yen-Ming Chen , Kuo-Wei Lin , Cheng-Yu Chu , Yang-Tung Fan , Fu-Jier Fan , Shih-Jane Lin , Chiou-Shian Peng , Hsien-Tsung Liu
发明人： Yen-Ming Chen , Kuo-Wei Lin , Cheng-Yu Chu , Yang-Tung Fan , Fu-Jier Fan , Shih-Jane Lin , Chiou-Shian Peng , Hsien-Tsung Liu
IPC分类号： H01L2144
CPC分类号： H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/03019 , H01L2224/03912 , H01L2224/0401 , H01L2224/05558 , H01L2224/05572 , H01L2224/1147 , H01L2224/11849 , H01L2224/11912 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H01L2924/00014 , H01L2224/05552
摘要： A method of forming a bump overlying the copper based contact pad to prevent oxidation of the copper based contact pad. A passivation blanket is deposited over a semiconductor device having a copper based contact pad, the passivation blanket includes a first layer overlying the top surface; a second layer overlying the first layer; a portion of the second layer overlying the copper based contact pad is removed leaving the first layer in place; depositing an under bump metallurgy over the semiconductor device, a portion of the first layer overlying the copper based contact pad is removed so that the copper based contact pad has limited exposure to oxygen; depositing an under bump metallurgy over the semiconductor device; removing excess under bump metallurgy; depositing an electrically conductive material over the under bump metallurgy; reflowing electrically conductive material to form a bump overlying the copper based contact pad.
摘要翻译：一种形成覆盖铜基接触垫的凸起以防止铜基接触垫氧化的方法。钝化覆盖层沉积在具有铜基接触焊盘的半导体器件上，钝化层包括覆盖在顶表面上的第一层; 覆盖第一层的第二层; 去除覆盖铜基接触垫的第二层的一部分，留下第一层就位; 在半导体器件上沉积凸块下的冶金，去除覆盖在铜基接触焊盘上的第一层的一部分，使得铜基接触焊盘具有有限的暴露于氧气; 在所述半导体器件上沉积凸块下的冶金; 去除多余的突起冶金; 在凸块下冶金上沉积导电材料; 回流导电材料以形成覆盖铜基接触垫的凸块。

10. 发明授权

US06274917B1 High efficiency color filter process for semiconductor array imaging devices 有权
公开(公告)号：US06274917B1
公开(公告)日：2001-08-14
申请号：US09693505
申请日：2000-10-23
申请人： Yang-Tung Fan , Sheng-Liang Pan , Bii-Cheng Chang , Kuo-Liang Lu
发明人： Yang-Tung Fan , Sheng-Liang Pan , Bii-Cheng Chang , Kuo-Liang Lu
IPC分类号： H01L310232
CPC分类号： H01L27/14609 , H01L27/14621 , H01L27/14627
摘要： A microelectronic method is described for optimizing the fabrication of optical and semiconductor array structures for high efficiency color image formation in solid-state cameras. Disclosed is an ordered fabrication sequence in which microlens formation precedes color filter layer formation to enable increased image light collection efficiency, to encapsulate and protect the microlens elements from chemical and thermal processing damage, to minimize topographical underlayer variations which would axially misalign or otherwise aberrate microlens elements formed on non-planar surfaces, and, to complete the most difficult steps early in the process to minimize rework and scrap. A CMOS, CID, or CCD optoelectronic configuration is formed by photolithographically patterning a planar-array of photodiodes on a Silicon or other III-V, II-VI, or compound semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, planarized, and, a first convex microlens array of high curvature or other suitable lenses are formed thereon. A transparent encapsulant is deposited to planarize the microlens layer and provide a spacer for the successive deposition(s) of one or more color filter layers. The microlens array may be formed from positive photoresists and the spacer from negative resist, with close attention to matching the index of refraction at layer interfaces. A final surface layer comprising a color filter completes the solid-state color image-forming device.

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