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    • 2. 发明授权
    • LDMOS with channel stress
    • LDMOS具有通道压力
    • US07645651B2
    • 2010-01-12
    • US11951702
    • 2007-12-06
    • Xiaoqiu HuangVeeraraghavan DhandapaniBich-Yen NguyenAmanda M. KrollDaniel T. Pham
    • Xiaoqiu HuangVeeraraghavan DhandapaniBich-Yen NguyenAmanda M. KrollDaniel T. Pham
    • H01L21/00H01L21/84H01L21/337H01L21/8238H01L21/8236H01L21/336
    • H01L29/7835H01L29/1054H01L29/161H01L29/165H01L29/66659H01L29/7781
    • A method of forming a metal oxide semiconductor (MOS) device comprises defining an active area in an unstrained semiconductor layer structure, depositing a hard mask overlying the active area and a region outside of the active area, patterning the hard mask to expose the active area, selectively growing a strained semiconductor layer overlying the exposed active area, and forming a remainder of the MOS device. The active area includes a first doped region of first conductivity type and a second doped region of second conductivity type. The strained semiconductor layer provides a biaxially strained channel for the MOS device. During a portion of forming the remainder of the MOS device, dopant of the first conductivity type of the first doped region of the active area and dopant of the second conductivity type of the second doped region of the active area diffuses into overlying portions of the strained semiconductor layer to create a correspondingly doped strained semiconductor layer, thereby providing corresponding doping for the biaxially strained channel.
    • 一种形成金属氧化物半导体(MOS)器件的方法包括:在非限制性半导体层结构中限定有源区,沉积覆盖有源区的硬掩模和有源区外的区域,使硬掩模图形化以暴露有源区 选择性地生长覆盖暴露的有源区的应变半导体层,以及形成MOS器件的其余部分。 有源区包括第一导电类型的第一掺杂区和第二导电类型的第二掺杂区。 应变半导体层为MOS器件提供双向应变通道。 在形成MOS器件的其余部分的部分期间,有源区的第一掺杂区的第一导电类型的掺杂剂和有源区的第二掺杂区的第二导电类型的掺杂剂扩散到应变的上覆部分 以产生相应掺杂的应变半导体层,从而为双轴应变通道提供相应的掺杂。
    • 8. 发明申请
    • LDMOS WITH CHANNEL STRESS
    • LDMOS与通道应力
    • US20090146180A1
    • 2009-06-11
    • US11951702
    • 2007-12-06
    • Xiaoqiu HuangVeeraraghavan DhandapaniBich-Yen NguyenAmanda M. KrollDaniel T. Pham
    • Xiaoqiu HuangVeeraraghavan DhandapaniBich-Yen NguyenAmanda M. KrollDaniel T. Pham
    • H01L29/778H01L21/336
    • H01L29/7835H01L29/1054H01L29/161H01L29/165H01L29/66659H01L29/7781
    • A method of forming a metal oxide semiconductor (MOS) device comprises defining an active area in an unstrained semiconductor layer structure, depositing a hard mask overlying the active area and a region outside of the active area, patterning the hard mask to expose the active area, selectively growing a strained semiconductor layer overlying the exposed active area, and forming a remainder of the MOS device. The active area includes a first doped region of first conductivity type and a second doped region of second conductivity type. The strained semiconductor layer provides a biaxially strained channel for the MOS device. During a portion of forming the remainder of the MOS device, dopant of the first conductivity type of the first doped region of the active area and dopant of the second conductivity type of the second doped region of the active area diffuses into overlying portions of the strained semiconductor layer to create a correspondingly doped strained semiconductor layer, thereby providing corresponding doping for the biaxially strained channel.
    • 一种形成金属氧化物半导体(MOS)器件的方法包括:在非限制性半导体层结构中限定有源区,沉积覆盖有源区的硬掩模和有源区外的区域,使硬掩模图形化以暴露有源区 选择性地生长覆盖暴露的有源区的应变半导体层,以及形成MOS器件的其余部分。 有源区包括第一导电类型的第一掺杂区和第二导电类型的第二掺杂区。 应变半导体层为MOS器件提供双向应变通道。 在形成MOS器件的其余部分的部分期间,有源区的第一掺杂区的第一导电类型的掺杂剂和有源区的第二掺杂区的第二导电类型的掺杂剂扩散到应变的上覆部分 以产生相应掺杂的应变半导体层,从而为双轴应变通道提供相应的掺杂。