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    • 3. 发明授权
    • Lateral injection VCSEL
    • 侧向注入VCSEL
    • US6044100A
    • 2000-03-28
    • US997712
    • 1997-12-23
    • William Scott HobsonDaryoosh Vakhshoori
    • William Scott HobsonDaryoosh Vakhshoori
    • H01S5/183H01S3/19H01L29/06
    • H01S5/18311H01S5/18341H01S5/18369
    • A VCSEL comprises a pair of multi-layered mirrors forming an optical cavity resonator having its axis perpendicular to the layers of the mirrors, an active region disposed within the resonator, and a current guide for directing pumping current through an aperture to generate stimulated emission of radiation which propagates along the resonator axis. A portion of the radiation forms an output signal which emerges through at least one of the mirrors. The current guide includes a lateral injection structure disposed between one of the mirrors and the current aperture. The lateral injection structure comprises at least one relatively thin, highly doped semiconductor layer, each of the highly doped layer(s) being located at a node of the standing wave of the intracavity radiation, at least one lower doped semiconductor layer disposed adjacent each of the highly doped layers (e.g., one lower doped layer sandwiched between a pair of highly doped layers), and an etch stop layer disposed between the one mirror and the uppermost highly doped layer.
    • VCSEL包括一对多层反射镜,其形成具有垂直于反射镜的层的轴的光腔谐振器,设置在谐振器内的有源区,以及用于引导泵浦电流通过孔径以产生受激发射的 辐射沿着谐振器轴传播。 辐射的一部分形成通过至少一个反射镜出射的输出信号。 当前的引导件包括设置在反射镜之一和电流孔之间的横向注射结构。 横向注射结构包括至少一个相对较薄的高度掺杂的半导体层,每个高度掺杂层位于腔内辐射的驻波的一个节点处,至少一个下掺杂半导体层邻近 高掺杂层(例如,夹在一对高掺杂层之间的一个下掺杂层)和设置在一个反射镜和最上面的高掺杂层之间的蚀刻停止层。
    • 6. 发明授权
    • Method of making an article comprising an oxide layer on a GaAs-based semiconductor body
    • 在GaAs基半导体本体上制造包含氧化物层的制品的方法
    • US06271069B1
    • 2001-08-07
    • US09122558
    • 1998-07-24
    • Young-Kai ChenAlfred Yi ChoWilliam Scott HobsonMinghwei HongJenn-Ming KuoJueinai Raynien KwoDonald Winslow MurphyFan Ren
    • Young-Kai ChenAlfred Yi ChoWilliam Scott HobsonMinghwei HongJenn-Ming KuoJueinai Raynien KwoDonald Winslow MurphyFan Ren
    • H01L2976
    • H01L29/517C23C14/08H01L21/28158H01L21/28264H01L21/8252H01L27/0605H01L29/66522H01L29/78H01L33/44H01S5/028
    • Disclosed are a method of making GaAs-based enhancement-type MOS-FETs, and articles (e.g., GaAs-based ICs) that comprise such a MOS-FET. The MOS-FETs are planar devices, without etched recess or epitaxial re-growth, with gate oxide that is primarily Ga2O3, and with low midgap interface state density (e.g., at most 1×1011 cm−2 eV−1 at 20° C.). The method involves ion implantation, implant activation in an As-containing atmosphere, surface reconstruction, and in situ deposition of the gate oxide. In preferred embodiments, no processing step subsequent to gate oxide formation is carried out above 300° C. in air, or above about 700° C. in UHV. The method makes possible fabrication of planar enhancement-type MOS-FETs having excellent characteristics, and also makes possible fabrication of complementary MOS-FETs, as well as ICs comprising MOS-FETs and MES-FETs. The method includes deposition of gate oxide of overall composition GaxAyOz, where Ga substantially is in the 3+ oxidation state, A is one or more electropositive stabilizer element adapted for stabilizing Ga in the 3+ oxidation state, x is greater than or equal to zero, z is selected to satisfy the requirement that both Ga and A are substantially fully oxidized, and y/(x+y) is greater than 0.1.
    • 公开了制造基于GaAs的增强型MOS-FET的方法以及包括这种MOS-FET的制品(例如,基于GaAs的IC)。 MOS-FET是没有蚀刻凹槽或外延再生长的平面器件,其栅极氧化物主要是Ga 2 O 3,并且具有低的中间隙界面态密度(例如,在20℃下至多为1×10 11 cm -2 eV-1) 。 该方法涉及离子注入,在含As气氛中的注入活化,表面重构和栅极氧化物的原位沉积。 在优选的实施方案中,栅极氧化物形成之后的处理步骤在高于300℃的空气中或在高于约700℃的UHV中进行。 该方法可以制造具有优异特性的平面增强型MOS-FET,并且还可以制造互补MOS-FET以及包括MOS-FET和MES-FET的IC。 该方法包括沉积总体组成为GaxAyOz的栅极氧化物,其中Ga基本上处于3+氧化态,A是一种或多种适用于稳定3+氧化态的Ga的正电荷稳定剂元素,x大于或等于零 选择z以满足Ga和A基本上完全氧化,y /(x + y)大于0.1的要求。