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    • 5. 发明授权
    • Nonvolatile memory transistor having poly-silicon fin, stacked nonvolatile memory device having the transistor, method of fabricating the transistor, and method of fabricating the device
    • 具有多晶硅鳍片的非易失性存储晶体管,具有该晶体管的堆叠式非易失性存储器件,该晶体管的制造方法以及该器件的制造方法
    • US07842994B2
    • 2010-11-30
    • US12007037
    • 2008-01-04
    • Huaxiang YinYoung-soo ParkWenxu Xianyu
    • Huaxiang YinYoung-soo ParkWenxu Xianyu
    • H01L29/788
    • H01L27/0688H01L21/8221H01L27/11521H01L27/11551H01L29/7854
    • A nonvolatile memory transistor having a poly-silicon fin, a stacked nonvolatile memory device having the transistor, a method of fabricating the transistor, and a method of fabricating the device are provided. The device may include an active fin protruding upward from a semiconductor substrate. At least one first charge storing pattern on a top surface and sidewalls of the active fin may be formed. At least one first control gate line on a top surface of the at least one first charge storing pattern may be formed. The at least one first control gate line may intersect over the active fin. An interlayer dielectric layer may be formed on the at least one first control gate line. A poly-silicon fin may be formed on the interlayer dielectric layer. At least one second charge storing pattern on a top surface and sidewalls of the poly-silicon fin may be formed. At least one second control gate line on a top surface of the at least one second charge storing pattern may be formed, and the at least one second control gate line may intersect over the poly-silicon fin.
    • 提供了具有多晶硅鳍片的非易失性存储晶体管,具有该晶体管的堆叠非易失性存储器件,该晶体管的制造方法以及该器件的制造方法。 该器件可以包括从半导体衬底向上突出的活性鳍片。 可以形成顶表面上的至少一个第一电荷存储图案和有源鳍片的侧壁。 可以形成至少一个第一电荷存储图案的顶表面上的至少一个第一控制栅极线。 至少一个第一控制栅极线可以在有源鳍上交叉。 层间绝缘层可以形成在至少一个第一控制栅极线上。 多晶硅鳍可以形成在层间介电层上。 可以形成多晶硅鳍片的顶表面和侧壁上的至少一个第二电荷存储图案。 可以形成至少一个第二电荷存储图案的顶表面上的至少一个第二控制栅极线,并且所述至少一个第二控制栅极线可以在多晶硅鳍上相交。
    • 8. 发明授权
    • Method of manufacturing single crystal Si film
    • 制造单晶Si膜的方法
    • US07479442B2
    • 2009-01-20
    • US11071175
    • 2005-03-04
    • Takashi NoguchiWenxu XianyuHuaxiang Yin
    • Takashi NoguchiWenxu XianyuHuaxiang Yin
    • H01L21/461
    • H01L21/76254
    • Provided is a method of manufacturing a single crystal Si film. The method includes: preparing a Si substrate on which a first oxide layer is formed and an insulating substrate on which a second oxide layer is formed; forming a dividing layer at a predetermined depth from a surface of the Si substrate by implanting hydrogen ions from above the first oxide layer; bonding the insulating substrate to the Si substrate so that the first oxide layer contacts the second oxide layer; and forming a single crystal Si film having a predetermined thickness on the insulating substrate by cutting the dividing layer by irradiating a laser beam from above the insulating substrate. Therefore, a single crystal Si film having a predetermined thickness can be formed on an insulating substrate.
    • 提供制造单晶Si膜的方法。 该方法包括:制备其上形成有第一氧化物层的Si衬底和形成有第二氧化物层的绝缘衬底; 通过从所述第一氧化物层上方注入氢离子,从所述Si衬底的表面形成预定深度的分隔层; 将绝缘基板接合到Si衬底,使得第一氧化物层接触第二氧化物层; 以及通过从绝缘基板上方照射激光束切割分隔层,在绝缘基板上形成具有预定厚度的单晶硅膜。 因此,可以在绝缘基板上形成具有预定厚度的单晶Si膜。